CN100531516C - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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Publication number
CN100531516C
CN100531516C CNB2005100361513A CN200510036151A CN100531516C CN 100531516 C CN100531516 C CN 100531516C CN B2005100361513 A CNB2005100361513 A CN B2005100361513A CN 200510036151 A CN200510036151 A CN 200510036151A CN 100531516 C CN100531516 C CN 100531516C
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Prior art keywords
circuit board
pcb
printed circuit
electric capacity
pad
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Expired - Fee Related
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CNB2005100361513A
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CN1901778A (zh
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刘静
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CNB2005100361513A priority Critical patent/CN100531516C/zh
Priority to US11/309,027 priority patent/US7572983B2/en
Publication of CN1901778A publication Critical patent/CN1901778A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954—More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

本发明是关于一种印刷电路板，其包括若干摆放第一类贴片元件的焊盘和若干摆放第二类贴片元件的焊盘，所述若干摆放第一类贴片元件的焊盘与所述若干摆放第二类贴片元件的焊盘两者之间存在信号相同的焊盘，所述摆放第二类贴片元件的每一焊盘均与摆放第一类贴片元件的焊盘中对应信号相同的若干焊盘重叠摆放布线，且这些焊盘均布置在印刷电路板的同一侧，该种印刷电路板可以节省印刷电路板的布线空间和降低制造工艺难度。

Description

印刷电路板
【技术领域】
本发明涉及一种印刷电路板，特别是指一种可节省布线空间和降低制造工艺难度的印刷电路板。
【背景技术】
目前，随着印刷电路板上集成的功能越来越多，所需的电子组件也越来越多，而印刷电路板的尺寸却不会随之增大，反而有越来越小的趋势，要在印刷电路板上有限的面积内为如此多的组件间的连接进行布线，这势必要求布线的方式要更加合理化，对布线提出更高的要求。
例如现有的与775CPU相匹配的一类计算机主板上需要摆放若干某类贴片电容元件，如根据实际生产或其他目的的需要有时要安装C1206电容，有时要安装钽质电容，那么在布线设计上就要求将主板设计成两类贴片电容的摆放位置都同时存在以便可以根据实际需要自由选择所需的那类电容来摆放，其中摆放所述钽质电容的焊盘与摆放所述C1206电容的焊盘中有信号相同(电路原理图中表现为同一端点)的焊盘。如图1所示，为所述C1206电容摆放于印刷电路板上的局部电路原理图，其中C1206电容Cx(x为1到18的整数)的两端分别连接于电源Vcc端和接地端GND。如图2所示，为所述钽质电容摆放于印刷电路板上的局部电路原理图，其中钽质电容Ca和Cb的正极连接于电源Vcc端，负极连接于接地端GND。
现有的印刷电路板主要有两种，如图3所示，该图为现有第一种印刷电路板的布线示意图，图中摆放C1206电容的焊盘组61(每个焊盘组包括两焊盘用于放置一个贴片元件)设计在775CPU接口的安装部65(即指775CPU接口部分中心处不含775CPU连接接口引脚的小块方形区域)上，摆放钽质电容的焊盘组62设计在775CPU接口的外部区域66上，上，摆放钽质电容的焊盘组62设计在775CPU接口的外部区域66上，且两类电容的焊盘组61与62均布置在印刷电路板60的同一侧。此种印刷电路板的布线虽然满足了两类电容摆放位置同时存在的条件，但印刷电路板上一定有一类摆放电容的焊盘上无元件，这就势必浪费了印刷电路板的布线空间。
如图4和图5所示，为现有第二种印刷电路板的布线示意图及局部放大图，图中摆放C1206电容的焊盘组71设计在775CPU接口的安装部75的正面，摆放钽质电容的焊盘组72设计在775CPU接口的安装部75的背面，两种电容的焊盘组71与72分别布置在印刷电路板70的两侧。此种印刷电路板的布线虽然没有浪费布线空间，但是这种方法却增加了印刷电路板制造工艺的难度，从而增加了制造成本。
【发明内容】
鉴于以上内容，有必要提供一种可节省布线空间和降低制造工艺难度的印刷电路板。
一种印刷电路板，其包括若干摆放第一类贴片元件的焊盘和若干摆放第二类贴片元件的焊盘，所述两类贴片元件不同时安装于印刷电路板上，且所述若干摆放第一类贴片元件的焊盘与所述若干摆放第二类贴片元件的焊盘两者之间存在信号相同的焊盘，所述摆放第二类贴片元件的每一焊盘均与摆放第一类贴片元件的焊盘中对应信号相同的若干焊盘重叠摆放布线，且这些焊盘均布置在印刷电路板的同一侧。
本发明的优点在于：将摆放该两类贴片元件的焊盘中信号相同的焊盘重叠摆放布线，可以节省印刷电路板的布线空间，同时由于所述摆放两类贴片元件的焊盘布置在了印刷电路板的同一侧，从而降低了印刷电路板制造工艺的难度，降低了制造成本。
以下结合附图，对本发明的较佳实施方式作进一步描述。
【附图说明】
图1为安装在印刷电路板上的第一类电容的局部电路原理图。
图2为安装在印刷电路板上的第二类电容的局部电路原理图。
图3为现有的第一种印刷电路板的布线图。
图4为现有的第二种印刷电路板的布线图。
图5为图4的局部放大图。
图6为本发明较佳实施方式印刷电路板的布线图。
图7为图6的局部放大图。
【具体实施方式】
请参考图6和图7，本发明较佳实施方式印刷电路板50是一种与775CPU相匹配的一类计算机主板，其包括一安装部55，该安装部55上设置若干摆放第一类电容(一般为18个C1206电容)的焊盘组51和若干摆放第二类电容(一般为2个钽质电容)的焊盘组52，该安装部55外围设有若干用于连接该775CPU的接口引脚。
请一并参考图1和图2，由于该两类电容在电路图中的两端点表现在印刷电路板上即为摆放该两类电容的焊盘，也就是说，所述摆放两类电容的焊盘中彼此存在信号相同的焊盘。而信号相同的焊盘在电路图中即可能同为电源Vcc端或看同为接地端GND。于是，在图1中任意选出6个C1206电容，如C5、C6、C7、C8、C9、C10，将其连接电源Vcc端的11、12、17、18端点和连接接地端GND的13、14、15、16端点所对应的摆放C 1206电容的焊盘511、512、517、518和513、514、515、516按图7所示摆放，其他电容端点所对应的摆放C1206电容的焊盘可任意摆放。在图2中，将该两钽质电容Ca、Cb连接电源Vcc端的21、24端点和连接接地端GND的22、23端点所对应的摆放钽质电容的焊盘521、524和522、523按图7所示摆放。
根据上述方法布置摆放该两类电容的焊盘位置，如图7所示，将摆放钽质电容的焊盘521、522、523、524分别与摆放C1206电容的焊盘(511、512)、(513、514)、(515、516)、(517、518)重叠摆放布线，由于焊盘521、511、512信号相同即在电路原理图中对应的21、11、12端点都连接于电源Vcc端，故可以将焊盘521和511、512重叠摆放布线，同理，焊盘522和513、514，焊盘523和515、516，焊盘524和517、518亦可重叠摆放布线，这样布置既满足了摆放两类电容焊盘同时存在的要求同时也符合电路原理。
那么，根据上述原理所设计的该种印刷电路板，当实际需要用C1206电容摆放到印刷电路板上时，即可将其摆放到图7中所示摆放C1206电容的焊盘组51的位置上，此时C1206电容完全作用于印刷电路板而不受摆放钽质电容的焊盘组52的影响，同理，当实际需要用钽质电容摆放到印刷电路板上时，也可将其摆放到图7中所示摆放钽质电容的焊盘组52的位置上，此时钽质电容亦完全作用于印刷电路板而不受摆放C1206电容的焊盘组51的影响。

Claims (5)

1.一种印刷电路板，其包括若干摆放第一类贴片元件的焊盘和若干摆放第二类贴片元件的焊盘，所述若干摆放第一类贴片元件的焊盘与所述若干摆放第二类贴片元件的焊盘两者之间存在信号相同的焊盘，其特征在于：所述摆放第二类贴片元件的每一焊盘均与摆放第一类贴片元件的焊盘中对应信号相同的若干焊盘重叠摆放布线，且这些焊盘均布置在印刷电路板的同一侧。
2.如权利要求1所述的印刷电路板，其特征在于：所述印刷电路板为与775CPU相匹配的一类计算机主板。
3.如权利要求2所述的印刷电路板，其特征在于：所述印刷电路板包括一用来设置所述焊盘的安装部，所述安装部外围设有若干用于连接该775CPU的接口引脚。
4.如权利要求3所述的印刷电路板，其特征在于：所述两类贴片元件分别为C1206电容和钽质电容。
5.如权利要求4所述的印刷电路板，其特征在于：所述C1206电容和钽质电容数量分别为18个和2个。
CNB2005100361513A 2005-07-22 2005-07-22 印刷电路板 Expired - Fee Related CN100531516C (zh)

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CNB2005100361513A CN100531516C (zh) 2005-07-22 2005-07-22 印刷电路板
US11/309,027 US7572983B2 (en) 2005-07-22 2006-06-12 Printed circuit board

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Application Number Priority Date Filing Date Title
CNB2005100361513A CN100531516C (zh) 2005-07-22 2005-07-22 印刷电路板

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1182345A (zh) * 1996-06-19 1998-05-20 揖斐电株式会社 多层印刷电路板
US20030114024A1 (en) * 2001-12-18 2003-06-19 Kabushiki Kaisha Toshiba Printed wiring board having plurality of conductive patterns passing through adjacent pads, circuit component mounted on printed wiring board and circuit module containing wiring board with circuit component mounted thereon
US20030223203A1 (en) * 2002-05-29 2003-12-04 Eric Lutkiewicz Method of mounting a butterfly package on a PCB

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GB8924282D0 (en) * 1989-10-27 1989-12-13 Bicc Plc An improved circuit board
US5303122A (en) * 1991-10-31 1994-04-12 Ford Motor Company Printed circuit board having a commonized mounting pad which different sized surface mounted devices can be mounted
US5425647A (en) * 1992-04-29 1995-06-20 Alliedsignal Inc. Split conductive pad for mounting components to a circuit board
GB9304967D0 (en) * 1993-03-11 1993-04-28 Ncr Int Inc Printed circuit board for surface mounted electrical components
US5453581A (en) * 1993-08-30 1995-09-26 Motorola, Inc. Pad arrangement for surface mount components
JP3231225B2 (ja) * 1995-09-18 2001-11-19 アルプス電気株式会社 プリント配線基板
US5805428A (en) * 1996-12-20 1998-09-08 Compaq Computer Corporation Transistor/resistor printed circuit board layout
DE10111389A1 (de) * 2001-03-09 2002-09-12 Heidenhain Gmbh Dr Johannes Verbund aus flächigen Leiterelementen

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1182345A (zh) * 1996-06-19 1998-05-20 揖斐电株式会社 多层印刷电路板
US20030114024A1 (en) * 2001-12-18 2003-06-19 Kabushiki Kaisha Toshiba Printed wiring board having plurality of conductive patterns passing through adjacent pads, circuit component mounted on printed wiring board and circuit module containing wiring board with circuit component mounted thereon
US20030223203A1 (en) * 2002-05-29 2003-12-04 Eric Lutkiewicz Method of mounting a butterfly package on a PCB

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CN1901778A (zh) 2007-01-24
US7572983B2 (en) 2009-08-11
US20070125573A1 (en) 2007-06-07

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