CN101636040B - 印刷电路板 - Google Patents

印刷电路板 Download PDF

Info

Publication number
CN101636040B
CN101636040B CN200810302873.2A CN200810302873A CN101636040B CN 101636040 B CN101636040 B CN 101636040B CN 200810302873 A CN200810302873 A CN 200810302873A CN 101636040 B CN101636040 B CN 101636040B
Authority
CN
China
Prior art keywords
transmission line
connector
connector pad
coupling assembling
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200810302873.2A
Other languages
English (en)
Other versions
CN101636040A (zh
Inventor
谢博全
许寿国
白育彰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN200810302873.2A priority Critical patent/CN101636040B/zh
Priority to US12/205,167 priority patent/US20100012365A1/en
Publication of CN101636040A publication Critical patent/CN101636040A/zh
Application granted granted Critical
Publication of CN101636040B publication Critical patent/CN101636040B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0295Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/029Programmable, customizable or modifiable circuits having a programmable lay-out, i.e. adapted for choosing between a few possibilities
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09218Conductive traces
    • H05K2201/09236Parallel layout
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09954More mounting possibilities, e.g. on same place of PCB, or by using different sets of edge pads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

一种印刷电路板,包括芯片、第一、第二连接器焊盘、第一、第二连接组件、第一、第二及第三传输线,第一、第二传输线的一端分别连接于芯片两输出端,当第一连接器焊盘安装一连接器时,第一传输线的另一端通过第一连接组件连接第一连接器焊盘的一接入端,第二传输线的另一端通过第二连接组件连接第三传输线的一端,第三传输线的另一端连接第一连接器焊盘的另一接入端;当第二连接器焊盘安装一连接器时,第一传输线的另一端通过第一连接组件连接第三传输线的一端,第三传输线的另一端连接第二连接器焊盘的一接入端,第二传输线的另一端通过第二连接组件连接第二连接器焊盘的另一接入端。本发明印刷电路板的芯片可选择性地连接两种连接器。

Description

印刷电路板
技术领域
本发明涉及一种印刷电路板。
背景技术
现在的一般个人计算机主板上,除了有中央处理器,芯片组外,还有若干用于安装界面卡的连接器。随着电子产业的发展,芯片的功能进一步完善,同一芯片可支持不同的连接器,如一款外设组件互连(Peripheral ComponentInterconnection,PCI)芯片既可支持第一规格的连接器,也可同时支持第二规格的连接器。不同的主板产品会选择安装不同的连接器,如有的厂商要求在主板上只安装第一规格的连接器,而有的厂商则要求在主板上安装第二规格的连接器,因此,纵使芯片能够支持两种规格的连接器,但生产时也只能选择一种生产,即支持第一规格连接器的主板,或支持第二规格连接器的主板,两者无法共用。故按照不同的厂商要求,需要对主板布线重新设计,增加了主板设计的成本。因此,如何提供一种印刷电路板,利用相同的主板布线,可支持不同规格的连接器,即为业界急需解决的课题。
发明内容
鉴于以上内容,有必要提供一种印刷电路板,可使芯片选择性地连接不同的连接器。
一种印刷电路板,包括芯片、第一、第二连接器焊盘、第一、第二连接组件、第一、第二及第三传输线,所述第一及第二连接器焊盘用于安装连接器,所述第一、第二传输线的一端分别连接于所述芯片两输出端,所述第三传输线设置于所述第一、第二连接器焊盘之间,当第一连接器焊盘安装连接器时,所述第一传输线的另一端通过第一连接组件连接第一连接器焊盘的一接入端,所述第二传输线的另一端通过第二连接组件连接所述第三传输线的一端,所述第三传输线的另一端连接所述第一连接器焊盘的另一接入端,所述第二连接器焊盘空接;当第二连接器焊盘安装连接器时,所述第一传输线的另一端通过第一连接组件连接所述第三传输线的一端,所述第三传输线的另一端连接所述第二连接器焊盘的一接入端,所述第二传输线的另一端通过第二连接组件连接第二连接器焊盘的另一接入端,所述第一连接器焊盘空接。
本发明不需要对现有印刷电路板进行贯孔及重新布线,只需通过设置所述第一、第二连接组件的位置,使得所述芯片可选择性地连接不同的连接器。
附图说明
下面结合附图及较佳实施方式对本发明作进一步详细描述:
图1是本发明印刷电路板的芯片与一连接器焊盘相连接的示意图。
图2是本发明印刷电路板的芯片与另一连接器焊盘相连接的示意图。
具体实施方式
请一并参考图1及图2,本发明印刷电路板的较佳实施方式包括一芯片100、连接组件20、22、24、30、32、34、两连接器焊盘200、300、传输线102、104及106;所述芯片100包括两输出端P及N,所述连接器焊盘200包括两接入端202及204,所述连接器焊盘300包括两接入端302及304,所述传输线106设置于所述连接器焊盘200及300之间,所述连接器焊盘200及连接器焊盘300为不同规格的连接器焊盘,用以安装不同的连接器。所述传输线102及104的一端分别连接于所述芯片100的两输出端P及N。
当在连接器焊盘200上安装一连接器时,如图1所示,芯片100与此连接器进行通信,所述传输线102的另一端通过连接组件20连接连接器焊盘200的接入端202,所述传输线104的另一端通过连接组件22连接所述传输线106的一端,所述传输线106的另一端通过连接组件24连接所述连接器焊盘200的接入端204,所述连接器焊盘300空接;这样芯片100经输出端P和N发送的高速差分信号对,通过传输线102及104的传输,再经连接组件20及22完整地传输给连接器焊盘200。
当在连接器焊盘300上安装另一连接器时,如图2所示,芯片100与此另一连接器进行通信,移除连接组件20、22及24,所述传输线102的另一端通过连接组件30连接所述传输线106的一端,所述传输线106的另一端通过连接组件34连接所述连接器焊盘300的接入端302,所述传输线104的另一端通过连接组件32连接连接器焊盘300的接入端304,所述连接器焊盘200空接;这样芯片100经输出端P和N发送的高速差分信号对,通过传输线102及104的传输,再经连接组件30及32完整地传输给连接器焊盘300。
在本实施方式中,所述连接组件20、22、30及32均为电容,用以滤除信号传输中的干扰成分,以便得到更好的信号传输品质。所述连接组件24及34均为零欧姆电阻,用以减小信号传输损耗,还用以决定芯片100发送的高速差分信号的传输方向,在其它实施方式中,所述连接组件20、22、30及32也可用其它元件进行替换,如滤波器等;所述连接组件24及34可以省略,即当连接器焊盘200上连接连接器时,传输线106直接与连接器焊盘200的接入端204相连,当连接器焊盘300上连接连接器时,传输线106直接与连接器焊盘300的接入端302相连,所述连接组件24及34也可以用其它电子元件进行替换。
本发明只需在印刷电路板上设置连接组件20、22、24、30、32及34,而不需更改印刷电路板上的原有布线方式,即不需要更改传输线102、104及106的布线方式,也不需要对印刷电路板进行贯孔,就可实现芯片100可选择性地与连接器焊盘200或连接器焊盘300上的连接器相连接。
本发明的印刷电路板还使得线路工作时能维持信号完整性,具有更好的信号传输品质,由于不需要对现有印刷电路板进行贯孔及重新布线,实施方便,因此节省了现有印刷电路板的设计成本。

Claims (6)

1.一种印刷电路板,包括芯片、第一、第二连接器焊盘、第一、第二连接组件、第一、第二及第三传输线,所述第一及第二连接器焊盘用于安装连接器,所述第一、第二传输线的一端分别连接于所述芯片两输出端,所述第三传输线设置于所述第一、第二连接器焊盘之间,当第一连接器焊盘安装连接器时,所述第一传输线的另一端通过第一连接组件连接第一连接器焊盘的一接入端,所述第二传输线的另一端通过第二连接组件连接所述第三传输线的一端,所述第三传输线的另一端连接所述第一连接器焊盘的另一接入端,所述第二连接器焊盘空接;当第二连接器焊盘安装连接器时,所述第一传输线的另一端通过第一连接组件连接所述第三传输线的一端,所述第三传输线的另一端连接所述第二连接器焊盘的一接入端,所述第二传输线的另一端通过第二连接组件连接第二连接器焊盘的另一接入端,所述第一连接器焊盘空接。
2.如权利要求1所述的印刷电路板,其特征在于:当第一连接器焊盘安装连接器时,所述第三传输线的另一端与所述第一连接器焊盘的另一接入端之间连接有一第三连接组件。
3.如权利要求1所述的印刷电路板,其特征在于:当第二连接器焊盘安装连接器时,所述第三传输线的另一端与所述第二连接器焊盘的接入端之间连接有一第三连接组件。
4.如权利要求2或3所述的印刷电路板,其特征在于:所述第三连接组件为一零欧姆电阻。
5.如权利要求1所述的印刷电路板,其特征在于:所述第一、第二连接组件均为电容。
6.如权利要求1所述的印刷电路板,其特征在于:所述第一及第二连接器焊盘用于安装不同规格的连接器。
CN200810302873.2A 2008-07-21 2008-07-21 印刷电路板 Expired - Fee Related CN101636040B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200810302873.2A CN101636040B (zh) 2008-07-21 2008-07-21 印刷电路板
US12/205,167 US20100012365A1 (en) 2008-07-21 2008-09-05 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200810302873.2A CN101636040B (zh) 2008-07-21 2008-07-21 印刷电路板

Publications (2)

Publication Number Publication Date
CN101636040A CN101636040A (zh) 2010-01-27
CN101636040B true CN101636040B (zh) 2011-12-14

Family

ID=41529282

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200810302873.2A Expired - Fee Related CN101636040B (zh) 2008-07-21 2008-07-21 印刷电路板

Country Status (2)

Country Link
US (1) US20100012365A1 (zh)
CN (1) CN101636040B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8665606B2 (en) 2010-07-16 2014-03-04 Mediatek Inc. Electronic device having circuit board with co-layout design of multiple connector placement sites and related circuit board thereof
US9763333B2 (en) * 2015-03-09 2017-09-12 Cooper Technologies Company Shared resistor pad bypass
CN108429047B (zh) * 2018-03-15 2020-11-20 海信视像科技股份有限公司 一种信号传输装置以及应用于其的信号兼容设计方法
EP3685641B1 (en) * 2018-09-17 2021-11-03 Phoenix Contact Development and Manufacturing, Inc. Mechanical bypass switch assembly for a backplane
US20230164916A1 (en) * 2021-11-25 2023-05-25 Celestica Technology Consultancy (Shanghai) Co. Ltd Printed circuit board and wire arrangement method thereof
US12068554B2 (en) 2022-01-28 2024-08-20 Hewlett Packard Enterprise Development Lp Dual-path high-speed interconnect PCB layout solution

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6218850B1 (en) * 1999-04-22 2001-04-17 United Microelectronics Corp. Apparatus for selecting high-reliability integrated circuits
US6783371B2 (en) * 2001-04-17 2004-08-31 Agilent Technologies, Inc. Solder-down printed circuit board connection structure
CN1967946A (zh) * 2006-06-01 2007-05-23 华为技术有限公司 插接件及提高插接件信号传输性能的方法
CN101136003A (zh) * 2006-09-01 2008-03-05 鸿富锦精密工业(深圳)有限公司 高速差分信号传输架构

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3940740A (en) * 1973-06-27 1976-02-24 Actron Industries, Inc. Method for providing reconfigurable microelectronic circuit devices and products produced thereby
US5162675A (en) * 1989-04-14 1992-11-10 Digital Communications Associates, Inc. Dual personal computer architecture peripheral adapter board and circuit
US5014002A (en) * 1989-04-18 1991-05-07 Vlsi Technology, Inc. ATE jumper programmable interface board
US5715409A (en) * 1993-05-24 1998-02-03 I-Tech Corporation Universal SCSI electrical interface system
AU5574396A (en) * 1995-05-04 1996-11-21 Intel Corporation Printed circuit board with selectable routing configuration
TW531082U (en) * 2000-05-11 2003-05-01 Asustek Comp Inc Double layout of slot hole
US6454585B1 (en) * 2001-08-01 2002-09-24 Compaq Information Technologies Group, L.P. Low profile NIC jumper solution using ZIF connector
US6941405B2 (en) * 2001-08-21 2005-09-06 02Micro International Limited System and method capable of offloading converter/controller-specific tasks to a system microprocessor
US6895447B2 (en) * 2002-06-06 2005-05-17 Dell Products L.P. Method and system for configuring a set of wire lines to communicate with AC or DC coupled protocols
US7305509B2 (en) * 2003-03-07 2007-12-04 Dell Products L.P. Method and apparatus for zero stub serial termination capacitor of resistor mounting option in an information handling system
US7099969B2 (en) * 2003-11-06 2006-08-29 Dell Products L.P. Dynamic reconfiguration of PCI Express links
JP4620483B2 (ja) * 2005-02-07 2011-01-26 富士通株式会社 コンピュータシステム,コンピュータ,io拡張装置およびio拡張装置接続認識方法
US7793029B1 (en) * 2005-05-17 2010-09-07 Nvidia Corporation Translation device apparatus for configuring printed circuit board connectors
US7265645B2 (en) * 2005-06-03 2007-09-04 Dell Products L.P. Matched-impedance high-bandwidth configuration jumper
CN1892634B (zh) * 2005-07-09 2010-12-08 鸿富锦精密工业(深圳)有限公司 PCI Express扩展槽电路及其设计方法
US20070016707A1 (en) * 2005-07-13 2007-01-18 Loffink John S Configuration connector for information handling system circuit boards
CN101408867B (zh) * 2007-10-11 2010-11-10 鸿富锦精密工业(深圳)有限公司 具有高速差分信号传输架构的主板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6218850B1 (en) * 1999-04-22 2001-04-17 United Microelectronics Corp. Apparatus for selecting high-reliability integrated circuits
US6783371B2 (en) * 2001-04-17 2004-08-31 Agilent Technologies, Inc. Solder-down printed circuit board connection structure
CN1967946A (zh) * 2006-06-01 2007-05-23 华为技术有限公司 插接件及提高插接件信号传输性能的方法
CN101136003A (zh) * 2006-09-01 2008-03-05 鸿富锦精密工业(深圳)有限公司 高速差分信号传输架构

Also Published As

Publication number Publication date
US20100012365A1 (en) 2010-01-21
CN101636040A (zh) 2010-01-27

Similar Documents

Publication Publication Date Title
CN100561455C (zh) 高速差分信号传输硬件架构
CN101636040B (zh) 印刷电路板
TWI544339B (zh) USB Type-C連接器模組(一)
US20110197012A1 (en) Computer motherboard
US20070032100A1 (en) Replaceable input/output interface for circuit board
CN101408867B (zh) 具有高速差分信号传输架构的主板
JP4771372B2 (ja) 電子装置用コネクタ、システムおよび取り付け方法(pciエクスプレス・コネクタ)
US20040064628A1 (en) Improved backplane with an accelerated graphic port in industrial computer
CN102065630A (zh) 具有高速差分信号布线结构的印刷电路板
CN103260341B (zh) 印制电路板及基于印制电路板的差分信号线布线方法
US20070218709A1 (en) Computer system and main board equipped with hybrid hypertransport interfaces
CN101965095A (zh) 印刷电路板
CN102065631B (zh) 具有高速差分信号布线结构的印刷电路板
CN102686007B (zh) 具有高速差分信号布线结构的印刷电路板
CN102573270A (zh) 具有高速差分信号布线结构的印刷电路板
US8406005B2 (en) Printed circuit board
TWI762685B (zh) 印刷電路板
US20070011384A1 (en) Computer expansion slot and design method thereof
CN219676579U (zh) 一种用于ssd的调试装置
US20130039025A1 (en) Printed circuit board
CN210488534U (zh) 一种用于pcie子卡的调试装置
CN212515791U (zh) 一种PCIe转接卡及4GPU配置系统
US20100067187A1 (en) Motherboard
CN213069797U (zh) 转接装置及通信设备
TWI763542B (zh) 板對板橋接信號傳輸系統

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111214

Termination date: 20140721

EXPY Termination of patent right or utility model