CN102065630A - 具有高速差分信号布线结构的印刷电路板 - Google Patents
具有高速差分信号布线结构的印刷电路板 Download PDFInfo
- Publication number
- CN102065630A CN102065630A CN2009103096700A CN200910309670A CN102065630A CN 102065630 A CN102065630 A CN 102065630A CN 2009103096700 A CN2009103096700 A CN 2009103096700A CN 200910309670 A CN200910309670 A CN 200910309670A CN 102065630 A CN102065630 A CN 102065630A
- Authority
- CN
- China
- Prior art keywords
- pad
- pcb
- circuit board
- printed circuit
- differential signal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0239—Signal transmission by AC coupling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0295—Programmable, customizable or modifiable circuits adapted for choosing between different types or different locations of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/1003—Non-printed inductor
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Combinations Of Printed Boards (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
Description
Claims (4)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910309670.0A CN102065630B (zh) | 2009-11-13 | 2009-11-13 | 具有高速差分信号布线结构的印刷电路板 |
US12/633,655 US7916494B1 (en) | 2009-11-13 | 2009-12-08 | Printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200910309670.0A CN102065630B (zh) | 2009-11-13 | 2009-11-13 | 具有高速差分信号布线结构的印刷电路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102065630A true CN102065630A (zh) | 2011-05-18 |
CN102065630B CN102065630B (zh) | 2013-02-13 |
Family
ID=43769904
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200910309670.0A Expired - Fee Related CN102065630B (zh) | 2009-11-13 | 2009-11-13 | 具有高速差分信号布线结构的印刷电路板 |
Country Status (2)
Country | Link |
---|---|
US (1) | US7916494B1 (zh) |
CN (1) | CN102065630B (zh) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102933022A (zh) * | 2011-08-11 | 2013-02-13 | 鸿富锦精密工业(深圳)有限公司 | 具有高速差分信号布线结构的印刷电路板 |
CN103260341A (zh) * | 2013-04-23 | 2013-08-21 | 青岛海信宽带多媒体技术有限公司 | 印制电路板及基于印制电路板的差分信号线布线方法 |
CN104615214A (zh) * | 2015-02-16 | 2015-05-13 | 宁开泉 | 一种计算机整体布线机箱 |
CN107155258A (zh) * | 2017-04-25 | 2017-09-12 | 安徽宏鑫电子科技有限公司 | 一种不对称过孔印制电路板 |
CN107918581A (zh) * | 2017-11-09 | 2018-04-17 | 郑州云海信息技术有限公司 | 一种针对高速信号连接器优化分析方法与系统 |
CN108495514A (zh) * | 2018-03-07 | 2018-09-04 | 中国船舶重工集团公司第七二三研究所 | 一种压接式接插件孔模型处理方法 |
CN110536541A (zh) * | 2019-08-23 | 2019-12-03 | 天津市滨海新区信息技术创新中心 | 一种减小stub影响的PCB结构及设计方法 |
CN114126230A (zh) * | 2021-11-26 | 2022-03-01 | 浪潮电子信息产业股份有限公司 | 一种pcb板的兼容布线方法及相关装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109451651A (zh) * | 2018-10-23 | 2019-03-08 | 惠科股份有限公司 | 一种电路板的差分走线及电路板 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6530790B1 (en) * | 1998-11-24 | 2003-03-11 | Teradyne, Inc. | Electrical connector |
US6449166B1 (en) * | 2000-08-24 | 2002-09-10 | High Connection Density, Inc. | High capacity memory module with higher density and improved manufacturability |
CN100574552C (zh) * | 2005-08-12 | 2009-12-23 | 鸿富锦精密工业(深圳)有限公司 | 印刷电路板 |
CN101420818B (zh) * | 2007-10-25 | 2011-03-30 | 鸿富锦精密工业(深圳)有限公司 | 差分布线架构 |
-
2009
- 2009-11-13 CN CN200910309670.0A patent/CN102065630B/zh not_active Expired - Fee Related
- 2009-12-08 US US12/633,655 patent/US7916494B1/en not_active Expired - Fee Related
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102933022B (zh) * | 2011-08-11 | 2017-04-05 | 诚亿电子(嘉兴)有限公司 | 具有高速差分信号布线结构的印刷电路板 |
CN102933022A (zh) * | 2011-08-11 | 2013-02-13 | 鸿富锦精密工业(深圳)有限公司 | 具有高速差分信号布线结构的印刷电路板 |
CN103260341A (zh) * | 2013-04-23 | 2013-08-21 | 青岛海信宽带多媒体技术有限公司 | 印制电路板及基于印制电路板的差分信号线布线方法 |
CN103260341B (zh) * | 2013-04-23 | 2016-01-20 | 青岛海信宽带多媒体技术有限公司 | 印制电路板及基于印制电路板的差分信号线布线方法 |
CN104615214B (zh) * | 2015-02-16 | 2018-04-27 | 宁开泉 | 一种计算机整体布线机箱 |
CN104615214A (zh) * | 2015-02-16 | 2015-05-13 | 宁开泉 | 一种计算机整体布线机箱 |
CN107155258B (zh) * | 2017-04-25 | 2019-05-10 | 安徽宏鑫电子科技有限公司 | 一种不对称过孔印制电路板 |
CN107155258A (zh) * | 2017-04-25 | 2017-09-12 | 安徽宏鑫电子科技有限公司 | 一种不对称过孔印制电路板 |
CN107918581A (zh) * | 2017-11-09 | 2018-04-17 | 郑州云海信息技术有限公司 | 一种针对高速信号连接器优化分析方法与系统 |
CN108495514A (zh) * | 2018-03-07 | 2018-09-04 | 中国船舶重工集团公司第七二三研究所 | 一种压接式接插件孔模型处理方法 |
CN110536541A (zh) * | 2019-08-23 | 2019-12-03 | 天津市滨海新区信息技术创新中心 | 一种减小stub影响的PCB结构及设计方法 |
CN114126230A (zh) * | 2021-11-26 | 2022-03-01 | 浪潮电子信息产业股份有限公司 | 一种pcb板的兼容布线方法及相关装置 |
CN114126230B (zh) * | 2021-11-26 | 2024-02-09 | 浪潮电子信息产业股份有限公司 | 一种pcb板的兼容布线方法及相关装置 |
Also Published As
Publication number | Publication date |
---|---|
CN102065630B (zh) | 2013-02-13 |
US7916494B1 (en) | 2011-03-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20110518 Assignee: Hongfujin Precision Electronics (Tianjin) Co., Ltd. Assignor: Hon Hai Precision Industry Co., Ltd. | Hong Fujin Precision Industry (Shenzhen) Co., Ltd. Contract record no.: 2014990000931 Denomination of invention: Printed circuit board with high-speed differential signal wiring structure Granted publication date: 20130213 License type: Exclusive License Record date: 20141216 |
|
LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130213 Termination date: 20151113 |
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EXPY | Termination of patent right or utility model |