JP3935529B2 - プリント回路基板 - Google Patents

プリント回路基板 Download PDF

Info

Publication number
JP3935529B2
JP3935529B2 JP19719996A JP19719996A JP3935529B2 JP 3935529 B2 JP3935529 B2 JP 3935529B2 JP 19719996 A JP19719996 A JP 19719996A JP 19719996 A JP19719996 A JP 19719996A JP 3935529 B2 JP3935529 B2 JP 3935529B2
Authority
JP
Japan
Prior art keywords
daughter board
motherboard
board
printed circuit
contact pads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP19719996A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0946015A5 (enExample
JPH0946015A (ja
Inventor
テリイ・ノー
レオナルド・ウエバー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agilent Technologies Inc
Original Assignee
Agilent Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agilent Technologies Inc filed Critical Agilent Technologies Inc
Publication of JPH0946015A publication Critical patent/JPH0946015A/ja
Publication of JPH0946015A5 publication Critical patent/JPH0946015A5/ja
Application granted granted Critical
Publication of JP3935529B2 publication Critical patent/JP3935529B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10666—Plated through-hole for surface mounting on PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP19719996A 1995-07-28 1996-07-26 プリント回路基板 Expired - Fee Related JP3935529B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US508,731 1995-07-28
US08/508,731 US5657208A (en) 1995-07-28 1995-07-28 Surface mount attachments of daughterboards to motherboards

Publications (3)

Publication Number Publication Date
JPH0946015A JPH0946015A (ja) 1997-02-14
JPH0946015A5 JPH0946015A5 (enExample) 2004-08-12
JP3935529B2 true JP3935529B2 (ja) 2007-06-27

Family

ID=24023847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19719996A Expired - Fee Related JP3935529B2 (ja) 1995-07-28 1996-07-26 プリント回路基板

Country Status (4)

Country Link
US (1) US5657208A (enExample)
JP (1) JP3935529B2 (enExample)
DE (1) DE19627663C2 (enExample)
GB (1) GB2303971B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11119862A (ja) * 1997-10-09 1999-04-30 Canon Inc プリント配線板ユニット、および電子機器
DE19750306A1 (de) 1997-11-13 1999-05-20 Bosch Gmbh Robert Elektronisches Steuergerät
US6281446B1 (en) 1998-02-16 2001-08-28 Matsushita Electric Industrial Co., Ltd. Multi-layered circuit board and method of manufacturing the same
US6761816B1 (en) * 1998-06-23 2004-07-13 Clinical Micro Systems, Inc. Printed circuit boards with monolayers and capture ligands
US7087148B1 (en) 1998-06-23 2006-08-08 Clinical Micro Sensors, Inc. Binding acceleration techniques for the detection of analytes
US6137693A (en) * 1998-07-31 2000-10-24 Agilent Technologies Inc. High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding
US6942771B1 (en) * 1999-04-21 2005-09-13 Clinical Micro Sensors, Inc. Microfluidic systems in the electrochemical detection of target analytes
US20040053290A1 (en) * 2000-01-11 2004-03-18 Terbrueggen Robert Henry Devices and methods for biochip multiplexing
US20020177135A1 (en) * 1999-07-27 2002-11-28 Doung Hau H. Devices and methods for biochip multiplexing
TW443083B (en) * 1999-06-23 2001-06-23 Asustek Comp Inc Printed circuit board structure
JP2002246704A (ja) * 2001-02-16 2002-08-30 Philips Japan Ltd 電子装置及び回路装置
US6710255B2 (en) * 2001-03-30 2004-03-23 Intel Corporation Printed circuit board having buried intersignal capacitance and method of making
JP4209130B2 (ja) 2002-04-09 2009-01-14 株式会社ザナヴィ・インフォマティクス 多層モジュール基板
CN102231616B (zh) * 2010-01-29 2014-01-08 中山大洋电机制造有限公司 一种电子驱动电机的电机控制器及其控制方法
JP2013055547A (ja) * 2011-09-05 2013-03-21 Alps Electric Co Ltd 高周波モジュールおよびそれを用いた高周波機器
WO2015151292A1 (ja) * 2014-04-04 2015-10-08 三菱電機株式会社 プリント配線板ユニット
US10393908B2 (en) 2016-12-15 2019-08-27 Rockwell Automation Technologies, Inc. Bobbin construction and coil winding method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59186387A (ja) * 1983-04-07 1984-10-23 松下電器産業株式会社 プリント基板の接合方法
US4553111A (en) * 1983-08-30 1985-11-12 Burroughs Corporation Printed circuit board maximizing areas for component utilization
JPH0397975U (enExample) * 1990-01-24 1991-10-09
JP3167342B2 (ja) * 1991-03-14 2001-05-21 株式会社東芝 送受共用円偏波アンテナ
US5142239A (en) * 1991-05-20 1992-08-25 Motorola, Inc. High frequency linear amplifier assembly
JPH0590826A (ja) * 1991-09-26 1993-04-09 Toshiba Corp マイクロストリツプアンテナ
JPH05175357A (ja) * 1991-12-25 1993-07-13 Casio Comput Co Ltd 多層基板のストリップ線路構造
US5222014A (en) * 1992-03-02 1993-06-22 Motorola, Inc. Three-dimensional multi-chip pad array carrier
JPH06152206A (ja) * 1992-11-10 1994-05-31 Toshiba Corp 無反射終端
US5355283A (en) * 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection
JPH0710969U (ja) * 1993-07-23 1995-02-14 日本無線株式会社 プリント基板
JP2565127B2 (ja) * 1993-12-13 1996-12-18 日本電気株式会社 ３ｄＢ９０゜ハイブリッド方向性結合器
JP2908225B2 (ja) * 1993-12-24 1999-06-21 日本電気株式会社 高周波チョーク回路
US5477933A (en) * 1994-10-24 1995-12-26 At&T Corp. Electronic device interconnection techniques
US5572405A (en) * 1995-06-07 1996-11-05 International Business Machines Corporation (Ibm) Thermally enhanced ball grid array package

Also Published As

Publication number Publication date
DE19627663C2 (de) 2003-10-02
DE19627663A1 (de) 1997-01-30
US5657208A (en) 1997-08-12
GB2303971B (en) 1999-09-08
GB9614938D0 (en) 1996-09-04
GB2303971A (en) 1997-03-05
JPH0946015A (ja) 1997-02-14

Similar Documents

Publication Publication Date Title
JP3935529B2 (ja) プリント回路基板
US7435912B1 (en) Tailoring via impedance on a circuit board
US4249302A (en) Multilayer printed circuit board
US6236572B1 (en) Controlled impedance bus and method for a computer system
US7518884B2 (en) Tailoring impedances of conductive traces in a circuit board
US6288906B1 (en) Multiple layer printed circuit board having power planes on outer layers
EP0439928B1 (en) Directional stripline structure and manufacture
US4836435A (en) Component self alignment
EP0489118A1 (en) MULTI-LAYERED CIRCUIT BOARD ELIMINATING RADIO-ELECTRIC INTERFERENCE OF HF SIGNALS.
US9538636B1 (en) Blind via edge castellation
US4926546A (en) PC board panel configuration technique
JP2002261402A (ja) 電子回路ユニットの回路基板
US6664482B1 (en) Printed circuit board having solder bridges for electronically connecting conducting pads and method of fabricating solder bridges
US5886878A (en) Printed circuit board manufacturing method for through hole components with a metal case
JPH05198732A (ja) 集積回路モジュールの機能を変更する方法および装置
JPH071821B2 (ja) 配線基板
JPS63114299A (ja) プリント配線板
US20050044702A1 (en) Printed circuit board having solder bridges for electronically connecting conducting pads and method of fabricating solder bridges
EP0996317B1 (en) Structure and method for mounting an electronic circuit unit to a printed board
JPH0745992Y2 (ja) 電子部品とシールドケースとの接地構造
KR100287738B1 (ko) 인쇄회로기판용 표면실장 방법
US6608257B1 (en) Direct plane attachment for capacitors
WO2008117213A2 (en) An assembly of at least two printed circuit boards and a method of assembling at least two printed circuit boards
JPH0739258Y2 (ja) 基板のエッジにおける端子構造
WO2004080140A1 (en) Surface mounting daughter board into an aperture of mother board

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060523

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20060822

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20060825

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060925

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20070220

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20070320

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees