JPH09285107A - 電力変換装置 - Google Patents
電力変換装置Info
- Publication number
- JPH09285107A JPH09285107A JP8294166A JP29416696A JPH09285107A JP H09285107 A JPH09285107 A JP H09285107A JP 8294166 A JP8294166 A JP 8294166A JP 29416696 A JP29416696 A JP 29416696A JP H09285107 A JPH09285107 A JP H09285107A
- Authority
- JP
- Japan
- Prior art keywords
- power converter
- hole
- conversion device
- pcb
- power conversion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims description 25
- 238000006243 chemical reaction Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 12
- 238000005476 soldering Methods 0.000 description 10
- 230000002829 reductive effect Effects 0.000 description 9
- FJUVPPYNSDTRQV-UHFFFAOYSA-N 1,2,5-trichloro-3-(2,6-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=C(Cl)C(C=2C(=CC=CC=2Cl)Cl)=C1 FJUVPPYNSDTRQV-UHFFFAOYSA-N 0.000 description 7
- 238000004806 packaging method and process Methods 0.000 description 5
- 230000002441 reversible effect Effects 0.000 description 5
- 238000003860 storage Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- KENZYIHFBRWMOD-UHFFFAOYSA-N 1,2-dichloro-4-(2,5-dichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C=C(Cl)C(Cl)=CC=2)=C1 KENZYIHFBRWMOD-UHFFFAOYSA-N 0.000 description 2
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 230000037361 pathway Effects 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- SXFLURRQRFKBNN-UHFFFAOYSA-N 1,2,3-trichloro-5-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C=C(Cl)C(Cl)=C(Cl)C=2)=C1 SXFLURRQRFKBNN-UHFFFAOYSA-N 0.000 description 1
- ALDJIKXAHSDLLB-UHFFFAOYSA-N 1,2-dichloro-3-(2,5-dichlorophenyl)benzene Chemical compound ClC1=CC=C(Cl)C(C=2C(=C(Cl)C=CC=2)Cl)=C1 ALDJIKXAHSDLLB-UHFFFAOYSA-N 0.000 description 1
- CUGLICQCTXWQNF-UHFFFAOYSA-N 1,2-dichloro-3-(2,6-dichlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=CC=CC=2Cl)Cl)=C1Cl CUGLICQCTXWQNF-UHFFFAOYSA-N 0.000 description 1
- ZMHWQAHZKUPENF-UHFFFAOYSA-N 1,2-dichloro-3-(4-chlorophenyl)benzene Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC(Cl)=C1Cl ZMHWQAHZKUPENF-UHFFFAOYSA-N 0.000 description 1
- ZGHQUYZPMWMLBM-UHFFFAOYSA-N 1,2-dichloro-4-phenylbenzene Chemical compound C1=C(Cl)C(Cl)=CC=C1C1=CC=CC=C1 ZGHQUYZPMWMLBM-UHFFFAOYSA-N 0.000 description 1
- GOFFZTAPOOICFT-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,3-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=CC(Cl)=C1Cl GOFFZTAPOOICFT-UHFFFAOYSA-N 0.000 description 1
- GXVMAQACUOSFJF-UHFFFAOYSA-N 1,3-dichloro-5-(2-chlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(C=2C(=CC=CC=2)Cl)=C1 GXVMAQACUOSFJF-UHFFFAOYSA-N 0.000 description 1
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 1
- UTMWFJSRHLYRPY-UHFFFAOYSA-N 3,3',5,5'-tetrachlorobiphenyl Chemical compound ClC1=CC(Cl)=CC(C=2C=C(Cl)C=C(Cl)C=2)=C1 UTMWFJSRHLYRPY-UHFFFAOYSA-N 0.000 description 1
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 1
- 241000237509 Patinopecten sp. Species 0.000 description 1
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 235000020637 scallop Nutrition 0.000 description 1
- 238000009966 trimming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Rectifiers (AREA)
- Dc-Dc Converters (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/552,522 US6031726A (en) | 1995-11-06 | 1995-11-06 | Low profile mounting of power converters with the converter body in an aperture |
| US08/552522 | 1995-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09285107A true JPH09285107A (ja) | 1997-10-31 |
Family
ID=24205700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8294166A Pending JPH09285107A (ja) | 1995-11-06 | 1996-11-06 | 電力変換装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US6031726A (de) |
| EP (1) | EP0772379A1 (de) |
| JP (1) | JPH09285107A (de) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE59814347D1 (de) * | 1998-10-30 | 2009-04-09 | Continental Automotive Gmbh | Halbleiter-Schaltungszusammenbau, insbesondere Hochstromumrichter mit niedriger Zwischenkreisspannung |
| US6623281B2 (en) * | 1999-06-29 | 2003-09-23 | Vlt Corporation | Mounting electronic components on circuit boards |
| JP2002134875A (ja) * | 2000-10-26 | 2002-05-10 | Murata Mfg Co Ltd | モジュール部品、モジュール部品の実装構造、および電子装置 |
| US6434005B1 (en) * | 2000-10-27 | 2002-08-13 | Vlt Corporation | Power converter packaging |
| US7361844B2 (en) * | 2002-11-25 | 2008-04-22 | Vlt, Inc. | Power converter package and thermal management |
| DE10361452A1 (de) * | 2003-12-23 | 2005-10-06 | Demag Cranes & Components Gmbh | Anordnung zum Befestigen von elektrischen und/oder elektronischen Bauteilen, insbesondere Leistungsbauteilen, an einer Platine und Gehäuse hiermit |
| US7074054B2 (en) * | 2004-08-06 | 2006-07-11 | Honeywell International Inc. | SMT terminal block |
| US7663232B2 (en) * | 2006-03-07 | 2010-02-16 | Micron Technology, Inc. | Elongated fasteners for securing together electronic components and substrates, semiconductor device assemblies including such fasteners, and accompanying systems |
| US7281930B1 (en) * | 2006-07-27 | 2007-10-16 | Research In Motion Limited | Electrical connector for a printed circuit board |
| KR101569842B1 (ko) * | 2009-09-30 | 2015-11-17 | 삼성전자 주식회사 | 텔레비전용 전원공급유닛 및 이를 포함하는 텔레비전 |
| US8966747B2 (en) * | 2011-05-11 | 2015-03-03 | Vlt, Inc. | Method of forming an electrical contact |
| US10264664B1 (en) | 2015-06-04 | 2019-04-16 | Vlt, Inc. | Method of electrically interconnecting circuit assemblies |
| US10097096B2 (en) | 2016-05-04 | 2018-10-09 | Toyota Motor Engineering & Manufacturing North America, Inc. | Packaging of a power conversion circuit |
Family Cites Families (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2917678A (en) * | 1956-09-20 | 1959-12-15 | Charles W Tepper | Method of mounting sub-miniature tubes in wiring plates for electronic assemblies |
| US3205408A (en) * | 1964-04-14 | 1965-09-07 | Boehm Josef | Components for printed circuits |
| US3621338A (en) * | 1970-01-02 | 1971-11-16 | Fairchild Camera Instr Co | Diaphragm-connected, leadless package for semiconductor devices |
| US3683241A (en) * | 1971-03-08 | 1972-08-08 | Communications Transistor Corp | Radio frequency transistor package |
| JPS5048579A (de) * | 1973-09-01 | 1975-04-30 | ||
| US4138711A (en) * | 1977-09-29 | 1979-02-06 | Allen-Bradley Company | Static control device for printed circuit package |
| US4417296A (en) * | 1979-07-23 | 1983-11-22 | Rca Corp | Method of connecting surface mounted packages to a circuit board and the resulting connector |
| US4531145A (en) * | 1980-08-04 | 1985-07-23 | Fine Particle Technology Corporation | Method of fabricating complex micro-circuit boards and substrates and substrate |
| US4994215A (en) * | 1980-08-04 | 1991-02-19 | Fine Particle Technology Corp. | Method of fabricating complex microcircuit boards, substrates and microcircuits and the substrates and microcircuits |
| US4400762A (en) * | 1980-08-25 | 1983-08-23 | Allen-Bradley Company | Edge termination for an electrical circuit device |
| US4551746A (en) * | 1982-10-05 | 1985-11-05 | Mayo Foundation | Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation |
| US4551747A (en) * | 1982-10-05 | 1985-11-05 | Mayo Foundation | Leadless chip carrier apparatus providing for a transmission line environment and improved heat dissipation |
| EP0141582B1 (de) * | 1983-10-20 | 1988-09-07 | Plessey Overseas Limited | Pyroelektrischer Detektor |
| FR2574615B1 (fr) * | 1984-12-11 | 1987-01-16 | Silicium Semiconducteur Ssc | Boitier pour composant de puissance haute-frequence refroidi par circulation d'eau |
| US4783697A (en) * | 1985-01-07 | 1988-11-08 | Motorola, Inc. | Leadless chip carrier for RF power transistors or the like |
| DE3527043A1 (de) * | 1985-07-27 | 1987-02-05 | Grundig Emv | Verfahren zum einloeten einer integrierten schaltung in eine leiterplatte |
| JPS6273799A (ja) * | 1985-09-27 | 1987-04-04 | 日本電気株式会社 | 多層セラミツク配線基板 |
| US4750089A (en) * | 1985-11-22 | 1988-06-07 | Texas Instruments Incorporated | Circuit board with a chip carrier and mounting structure connected to the chip carrier |
| US4769525A (en) * | 1986-09-02 | 1988-09-06 | Hughes Aircraft Company | Circuit package attachment apparatus and method |
| US4918811A (en) * | 1986-09-26 | 1990-04-24 | General Electric Company | Multichip integrated circuit packaging method |
| US4783695A (en) * | 1986-09-26 | 1988-11-08 | General Electric Company | Multichip integrated circuit packaging configuration and method |
| JPS63146940A (ja) * | 1986-12-11 | 1988-06-18 | Diafoil Co Ltd | ポリエステル系収縮フイルム |
| US4740414A (en) * | 1986-11-17 | 1988-04-26 | Rockwell International Corporation | Ceramic/organic multilayer interconnection board |
| US4953005A (en) * | 1987-04-17 | 1990-08-28 | Xoc Devices, Inc. | Packaging system for stacking integrated circuits |
| DE3720925A1 (de) * | 1987-06-25 | 1989-01-05 | Wabco Westinghouse Fahrzeug | Leiterplatte |
| FR2620296B1 (fr) * | 1987-09-03 | 1990-01-19 | Bendix Electronics Sa | Boitier pour circuit electronique |
| JPS6473966A (en) * | 1987-09-16 | 1989-03-20 | Fujitsu Ltd | Facsimile equipment |
| DE3802593A1 (de) * | 1988-01-29 | 1989-08-10 | Heidelberger Druckmasch Ag | Umrichter mit gleichspannungs-zwischenkreis |
| US4847136A (en) * | 1988-03-21 | 1989-07-11 | Hughes Aircraft Company | Thermal expansion mismatch forgivable printed wiring board for ceramic leadless chip carrier |
| US5019946A (en) * | 1988-09-27 | 1991-05-28 | General Electric Company | High density interconnect with high volumetric efficiency |
| US4988984A (en) * | 1988-10-31 | 1991-01-29 | International Business Machines Corporation | Image interpolator for an image display system |
| JP2656585B2 (ja) * | 1988-11-23 | 1997-09-24 | ティーディーケイ株式会社 | 集積回路部品とその実装構造 |
| JPH02151095A (ja) * | 1988-12-01 | 1990-06-11 | Rohm Co Ltd | 基板に対するｉｃの実装方法およびｉｃ実装基板 |
| JPH02215068A (ja) * | 1989-02-15 | 1990-08-28 | Nippon Kaiheiki Kogyo Kk | プリント基板用制御機器 |
| JPH0329389A (ja) * | 1989-06-27 | 1991-02-07 | Mitsubishi Electric Corp | プリント回路板 |
| US5028987A (en) * | 1989-07-03 | 1991-07-02 | General Electric Company | High current hermetic package having a lead extending through the package lid and a packaged semiconductor chip |
| US5019941A (en) * | 1989-11-03 | 1991-05-28 | Motorola, Inc. | Electronic assembly having enhanced heat dissipating capabilities |
| US5006673A (en) * | 1989-12-07 | 1991-04-09 | Motorola, Inc. | Fabrication of pad array carriers from a universal interconnect structure |
| US4975824A (en) * | 1989-12-11 | 1990-12-04 | Sundstrand Corporation | Power converter circuit board |
| JPH05315192A (ja) * | 1992-05-14 | 1993-11-26 | Fuji Electric Co Ltd | 電解コンデンサの取付け装置 |
| JP2791216B2 (ja) * | 1992-07-17 | 1998-08-27 | ヴィエルティー コーポレーション | 電気部品用パッケージ、電力損発生部品の取付方法、及び導体端子ピンと回路基板との接続方法 |
| JPH0679990A (ja) * | 1992-09-04 | 1994-03-22 | Mitsubishi Electric Corp | Ｉｃメモリカード |
| US5352851A (en) * | 1992-09-08 | 1994-10-04 | Texas Instruments Incorporated | Edge-mounted, surface-mount integrated circuit device |
| CN1050242C (zh) * | 1993-06-14 | 2000-03-08 | Vlt公司 | 电源变换装置、电源变换器控制装置及其制造电源变换器的方法 |
-
1995
- 1995-11-06 US US08/552,522 patent/US6031726A/en not_active Expired - Lifetime
-
1996
- 1996-11-05 EP EP96307991A patent/EP0772379A1/de not_active Withdrawn
- 1996-11-06 JP JP8294166A patent/JPH09285107A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US6031726A (en) | 2000-02-29 |
| EP0772379A1 (de) | 1997-05-07 |
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