JPH09266167A - 環境制御チヤンバ - Google Patents

環境制御チヤンバ

Info

Publication number
JPH09266167A
JPH09266167A JP8099320A JP9932096A JPH09266167A JP H09266167 A JPH09266167 A JP H09266167A JP 8099320 A JP8099320 A JP 8099320A JP 9932096 A JP9932096 A JP 9932096A JP H09266167 A JPH09266167 A JP H09266167A
Authority
JP
Japan
Prior art keywords
heat
space
exhaust
control chamber
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8099320A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09266167A5 (enExample
Inventor
Ryochi Nagahashi
良智 長橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to JP8099320A priority Critical patent/JPH09266167A/ja
Priority to KR1019970010872A priority patent/KR100477960B1/ko
Publication of JPH09266167A publication Critical patent/JPH09266167A/ja
Priority to US09/905,079 priority patent/US20010048513A1/en
Priority to US10/289,296 priority patent/US6753942B2/en
Publication of JPH09266167A5 publication Critical patent/JPH09266167A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Toxicology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
JP8099320A 1996-03-28 1996-03-28 環境制御チヤンバ Pending JPH09266167A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP8099320A JPH09266167A (ja) 1996-03-28 1996-03-28 環境制御チヤンバ
KR1019970010872A KR100477960B1 (ko) 1996-03-28 1997-03-27 노광장치의제조방법
US09/905,079 US20010048513A1 (en) 1996-03-28 2001-07-16 Environmental control chamber
US10/289,296 US6753942B2 (en) 1996-03-28 2002-11-07 Environmental control chamber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8099320A JPH09266167A (ja) 1996-03-28 1996-03-28 環境制御チヤンバ

Publications (2)

Publication Number Publication Date
JPH09266167A true JPH09266167A (ja) 1997-10-07
JPH09266167A5 JPH09266167A5 (enExample) 2004-07-29

Family

ID=14244353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8099320A Pending JPH09266167A (ja) 1996-03-28 1996-03-28 環境制御チヤンバ

Country Status (3)

Country Link
US (2) US20010048513A1 (enExample)
JP (1) JPH09266167A (enExample)
KR (1) KR100477960B1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284210A (ja) * 2000-03-30 2001-10-12 Canon Inc 露光装置、デバイス製造方法、半導体製造工場および露光装置の保守方法
US6621554B1 (en) * 2000-05-01 2003-09-16 Xerox Corporation Method and apparatus for controlling humidity in a copying device
JP2004158510A (ja) * 2002-11-01 2004-06-03 Canon Inc デバイス製造装置
US7253383B2 (en) * 2002-12-03 2007-08-07 Samsung Electronics Co., Ltd. Transformer assembly for microwave oven, method for manufacturing the same, and microwave oven having the same
US7329308B2 (en) * 2003-07-09 2008-02-12 Entegris, Inc. Air handling and chemical filtration system and method
US7150964B2 (en) * 2004-06-07 2006-12-19 Konica Minolta Medical & Graphic, Inc. Process for treating photothermographic dry imaging material
JP4689308B2 (ja) * 2005-03-18 2011-05-25 キヤノン株式会社 露光装置およびデバイス製造方法
US8170225B2 (en) * 2007-02-14 2012-05-01 Integrated Dynamics Engineering Gmbh Method for adapting a vibration isolation system
US7817262B2 (en) * 2007-06-27 2010-10-19 Vistec Semiconductor Systems Gmbh Device for measuring positions of structures on a substrate
US7572976B1 (en) * 2008-02-06 2009-08-11 Victor Merrill Quick connect electrical box
DE102010030260A1 (de) * 2010-06-18 2011-12-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Prüfung der Haftfestigkeit einer Beschichtung auf einem Substrat
TW201346205A (zh) * 2012-01-13 2013-11-16 尼康股份有限公司 箱室裝置及隔熱板
KR20140105239A (ko) * 2013-02-22 2014-09-01 삼성디스플레이 주식회사 레이저 빔을 이용한 마스크 제조 방법 및 마스크 제조 장치
CN109427635B (zh) * 2017-08-29 2020-09-11 创意电子股份有限公司 半导体元件的测试设备及其搬运装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4690528A (en) 1983-10-05 1987-09-01 Nippon Kogaku K. K. Projection exposure apparatus
JPS61160934A (ja) 1985-01-10 1986-07-21 Canon Inc 投影光学装置
EP0295860B1 (en) 1987-06-15 1994-04-06 Canon Kabushiki Kaisha An exposure apparatus
US4989031A (en) 1990-01-29 1991-01-29 Nikon Corporation Projection exposure apparatus
US5326316A (en) 1991-04-17 1994-07-05 Matsushita Electric Industrial Co., Ltd. Coupling type clean space apparatus
JP2746125B2 (ja) * 1994-06-17 1998-04-28 日本電気株式会社 電子線露光装置の装置較正用基準マーク及び装置較正方法。
US6002987A (en) * 1996-03-26 1999-12-14 Nikon Corporation Methods to control the environment and exposure apparatus

Also Published As

Publication number Publication date
KR100477960B1 (ko) 2005-08-09
KR970067657A (ko) 1997-10-13
US20010048513A1 (en) 2001-12-06
US6753942B2 (en) 2004-06-22
US20030058417A1 (en) 2003-03-27

Similar Documents

Publication Publication Date Title
US20220155062A1 (en) Measurement system, substrate processing system, and device manufacturing method
KR100443452B1 (ko) 주사형노광장치
JPH09266167A (ja) 環境制御チヤンバ
JP3365571B2 (ja) 光学式計測装置及び露光装置
CN100377303C (zh) 反射镜设备、曝光设备以及器件制造方法
US9946171B2 (en) Movable body apparatus, exposure apparatus, exposure method, and device manufacturing method
US9874823B2 (en) Exposure apparatus, exposure method, and device manufacturing method
US6342941B1 (en) Exposure apparatus and method preheating a mask before exposing; a conveyance method preheating a mask before exposing; and a device manufacturing system and method manufacturing a device according to the exposure apparatus and method
KR19980042711A (ko) 노광 장치
JP2005203754A (ja) リソグラフィ装置及びデバイス製造方法
WO2002054460A1 (fr) Dispositif d'exposition
JP4474871B2 (ja) 露光装置
JPWO2002101804A1 (ja) 露光装置及びデバイス製造方法、並びに温度安定化流路装置
JP2000091192A (ja) 露光装置
WO2003079418A1 (en) Aligner and device manufacuring method
JP2005315707A (ja) 温度計測装置、露光装置、およびデバイス製造方法
JP3637639B2 (ja) 露光装置
JP4835970B2 (ja) 調整方法
JP2006032808A (ja) 位置ずれ検出装置、マスク搬送システム及び露光装置
JP3286994B2 (ja) 露光方法、および露光装置
JPH11251236A (ja) 露光方法及び露光装置
JP2006134944A (ja) 露光装置
JPH08293449A (ja) 露光装置
JPH10242046A (ja) 露光装置、露光方法及びマスク収納ケース
JP3214494B2 (ja) 保持装置および露光システム、デバイス

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20040712

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20040921

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20050222