US20010048513A1 - Environmental control chamber - Google Patents

Environmental control chamber Download PDF

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Publication number
US20010048513A1
US20010048513A1 US09/905,079 US90507901A US2001048513A1 US 20010048513 A1 US20010048513 A1 US 20010048513A1 US 90507901 A US90507901 A US 90507901A US 2001048513 A1 US2001048513 A1 US 2001048513A1
Authority
US
United States
Prior art keywords
heat
control chamber
environmental control
main body
space
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US09/905,079
Other languages
English (en)
Inventor
Yoshitomo Nagahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to US09/905,079 priority Critical patent/US20010048513A1/en
Publication of US20010048513A1 publication Critical patent/US20010048513A1/en
Priority to US10/289,296 priority patent/US6753942B2/en
Abandoned legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system

Definitions

  • the air conditioning device 13 comprises an air blower 14 , a heater 15 and a cooler 16 .
  • the air conditioning device 13 is arranged in such a manner that air is discharged from the chamber 1 and air is introduced from the outside into the chamber 1 through an intake opening 17 and an intake duct 18 .
  • the air introduced into the air conditioning device 13 is then subjected to adjustment of temperature with the heater 15 or the cooler 16 and sent to the chamber 1 with the air blower 14 through an air outlet 19 .
  • the air outlet 19 is provided with a filter (not shown) that can remove dust from the air to be introduced into the chamber 1 .
  • the environmental control chamber according to the present invention may be constructed in such a manner that an element structuring the heat source of the main body of the device is disposed in the heat-discharging space or that the element structuring the heat source thereof is connected to the heat-discharging space via a heat exchange device.
  • the environmental control chamber according to the present invention may be provided with the heat-discharging space which may be in a shape of a box and which may be made of a heat insulating material.
  • FIG. 4 is a schematic view showing the structure of a conventional environmental control chamber.
  • a reticle 4 is irradiated with rays of illuminating light emitted from an illumination optical system 3 to form a pattern on the reticle 4 and the pattern formed thereon is then projected through a projecting lens 5 onto a member 6 located immediately under the projecting lens 5 .
  • a wafer stage 8 In the member 6 is disposed a wafer stage 8 , and a wafer 7 is located in an light-exposing region on the wafer stage 8 . Rays of projecting light from the projecting lens 5 are projected onto a light-exposing region of the wafer 7 , thereby transcribing the pattern formed on the reticle 4 on the wafer 7 .
  • the member 6 is mounted on a vibration isolation table 22 that can absorb vibration.
  • the heat source (not shown) for emitting rays of illuminating light to the illumination optical system 3 is disposed on the outside of the partition wall 21 .
  • the end measuring machine 9 by the laser interferometer is connected to the laser head 10 that emits laser beams for measurement.
  • the laser beams emitted from the laser head 10 are reflected on the reflecting mirrors 11 and disposed over the wafer stage 8 and received by the end measuring machine 9 by the laser interferometer.
  • the reflecting mirrors 11 are mounted on the wafer stage 8 and on a peripheral side portion of a projecting opening through which the rays of projecting light are emitted onto the wafer 7 .
  • the end measuring machine 9 by the laser interferometer is arranged to measure a distance between the projecting opening and the wafer stage 8 upon receiving the laser beams reflected from the reflecting mirrors.
  • the heat source disposed in the environmental control chamber 20 generates heat on operating the stepper 20 .
  • the relay board 12 acting as one of the sources of heat is operated by the electric power supplied from a control rack (not shown) disposed in the vicinity of the stepper 2 .
  • the relay board 12 Upon operation, the relay board 12 generates Joule heat in accordance with the consumption of the electric power and warms up the air in its vicinity causing the air to fluctuate.
  • the fluctuations of the air remain within the heat-discharging box 24 in the environmental control chamber 20 because the relay board 12 is disposed in the heat-discharging box 24 .
  • the cooler 32 to be located in the heat-discharging box 31 there may be mentioned, for example, an air conditioning device separate from the air conditioning device 13 (FIG. 1), a cooler using a liquid refrigerant or a electronic cooler using Peltier effect.
  • the heat-discharging box 31 may be provided with a fan (not shown) or a heat discharging opening (not shown), thereby discharging the heat gathered in the heat-discharging box 31 toward the outside.

Landscapes

  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Toxicology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
US09/905,079 1996-03-28 2001-07-16 Environmental control chamber Abandoned US20010048513A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US09/905,079 US20010048513A1 (en) 1996-03-28 2001-07-16 Environmental control chamber
US10/289,296 US6753942B2 (en) 1996-03-28 2002-11-07 Environmental control chamber

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP99320/1996 1996-03-28
JP8099320A JPH09266167A (ja) 1996-03-28 1996-03-28 環境制御チヤンバ
US82429597A 1997-03-26 1997-03-26
US09/905,079 US20010048513A1 (en) 1996-03-28 2001-07-16 Environmental control chamber

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US82429597A Continuation 1996-03-28 1997-03-26

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US10/289,296 Continuation US6753942B2 (en) 1996-03-28 2002-11-07 Environmental control chamber

Publications (1)

Publication Number Publication Date
US20010048513A1 true US20010048513A1 (en) 2001-12-06

Family

ID=14244353

Family Applications (2)

Application Number Title Priority Date Filing Date
US09/905,079 Abandoned US20010048513A1 (en) 1996-03-28 2001-07-16 Environmental control chamber
US10/289,296 Expired - Fee Related US6753942B2 (en) 1996-03-28 2002-11-07 Environmental control chamber

Family Applications After (1)

Application Number Title Priority Date Filing Date
US10/289,296 Expired - Fee Related US6753942B2 (en) 1996-03-28 2002-11-07 Environmental control chamber

Country Status (3)

Country Link
US (2) US20010048513A1 (enExample)
JP (1) JPH09266167A (enExample)
KR (1) KR100477960B1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6621554B1 (en) * 2000-05-01 2003-09-16 Xerox Corporation Method and apparatus for controlling humidity in a copying device
US20050081715A1 (en) * 2003-07-09 2005-04-21 Extraction Systems, Inc. Air handling and chemical filtration system and method
US20090194311A1 (en) * 2008-02-06 2009-08-06 Victor Merrill Quick connect electrical box
US20190064247A1 (en) * 2017-08-29 2019-02-28 Global Unichip Corporation Testing equipment for semiconductor element and its carrying device

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001284210A (ja) * 2000-03-30 2001-10-12 Canon Inc 露光装置、デバイス製造方法、半導体製造工場および露光装置の保守方法
JP2004158510A (ja) * 2002-11-01 2004-06-03 Canon Inc デバイス製造装置
US7253383B2 (en) * 2002-12-03 2007-08-07 Samsung Electronics Co., Ltd. Transformer assembly for microwave oven, method for manufacturing the same, and microwave oven having the same
US7150964B2 (en) * 2004-06-07 2006-12-19 Konica Minolta Medical & Graphic, Inc. Process for treating photothermographic dry imaging material
JP4689308B2 (ja) * 2005-03-18 2011-05-25 キヤノン株式会社 露光装置およびデバイス製造方法
US8170225B2 (en) * 2007-02-14 2012-05-01 Integrated Dynamics Engineering Gmbh Method for adapting a vibration isolation system
US7817262B2 (en) * 2007-06-27 2010-10-19 Vistec Semiconductor Systems Gmbh Device for measuring positions of structures on a substrate
DE102010030260A1 (de) 2010-06-18 2011-12-22 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Prüfung der Haftfestigkeit einer Beschichtung auf einem Substrat
TW201346205A (zh) * 2012-01-13 2013-11-16 尼康股份有限公司 箱室裝置及隔熱板
KR20140105239A (ko) * 2013-02-22 2014-09-01 삼성디스플레이 주식회사 레이저 빔을 이용한 마스크 제조 방법 및 마스크 제조 장치

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4690528A (en) * 1983-10-05 1987-09-01 Nippon Kogaku K. K. Projection exposure apparatus
JPS61160934A (ja) * 1985-01-10 1986-07-21 Canon Inc 投影光学装置
DE3888876T2 (de) * 1987-06-15 1994-10-27 Canon Kk Belichtungsvorrichtung.
US4989031A (en) * 1990-01-29 1991-01-29 Nikon Corporation Projection exposure apparatus
US5326316A (en) * 1991-04-17 1994-07-05 Matsushita Electric Industrial Co., Ltd. Coupling type clean space apparatus
JP2746125B2 (ja) * 1994-06-17 1998-04-28 日本電気株式会社 電子線露光装置の装置較正用基準マーク及び装置較正方法。
US6002987A (en) * 1996-03-26 1999-12-14 Nikon Corporation Methods to control the environment and exposure apparatus

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6621554B1 (en) * 2000-05-01 2003-09-16 Xerox Corporation Method and apparatus for controlling humidity in a copying device
US20040125349A1 (en) * 2000-05-01 2004-07-01 Xerox Corporation Method and apparatus for controlling humidity in a copying device
US6894761B2 (en) 2000-05-01 2005-05-17 Xerox Corporation Method and apparatus for controlling humidity in a copying device
US20050081715A1 (en) * 2003-07-09 2005-04-21 Extraction Systems, Inc. Air handling and chemical filtration system and method
US7329308B2 (en) 2003-07-09 2008-02-12 Entegris, Inc. Air handling and chemical filtration system and method
US20090194311A1 (en) * 2008-02-06 2009-08-06 Victor Merrill Quick connect electrical box
US20190064247A1 (en) * 2017-08-29 2019-02-28 Global Unichip Corporation Testing equipment for semiconductor element and its carrying device
CN109427635A (zh) * 2017-08-29 2019-03-05 创意电子股份有限公司 半导体元件的测试设备及其搬运装置
US10502775B2 (en) * 2017-08-29 2019-12-10 Global Unichip Corporation Testing equipment for semiconductor element and its carrying device

Also Published As

Publication number Publication date
KR970067657A (ko) 1997-10-13
US6753942B2 (en) 2004-06-22
KR100477960B1 (ko) 2005-08-09
JPH09266167A (ja) 1997-10-07
US20030058417A1 (en) 2003-03-27

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Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION