JPH081110Y2 - Icメモリーカード - Google Patents
IcメモリーカードInfo
- Publication number
- JPH081110Y2 JPH081110Y2 JP1988086505U JP8650588U JPH081110Y2 JP H081110 Y2 JPH081110 Y2 JP H081110Y2 JP 1988086505 U JP1988086505 U JP 1988086505U JP 8650588 U JP8650588 U JP 8650588U JP H081110 Y2 JPH081110 Y2 JP H081110Y2
- Authority
- JP
- Japan
- Prior art keywords
- memory
- wiring board
- printed wiring
- conductor
- joined
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988086505U JPH081110Y2 (ja) | 1988-06-29 | 1988-06-29 | Icメモリーカード |
PCT/JP1989/000643 WO1990000117A1 (en) | 1988-06-29 | 1989-06-28 | Ic memory card |
EP19890907813 EP0379592A4 (en) | 1988-06-29 | 1989-06-28 | Ic memory card |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988086505U JPH081110Y2 (ja) | 1988-06-29 | 1988-06-29 | Icメモリーカード |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH028977U JPH028977U (nl) | 1990-01-19 |
JPH081110Y2 true JPH081110Y2 (ja) | 1996-01-17 |
Family
ID=31311144
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988086505U Expired - Lifetime JPH081110Y2 (ja) | 1988-06-29 | 1988-06-29 | Icメモリーカード |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH081110Y2 (nl) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6080232A (ja) * | 1983-10-11 | 1985-05-08 | Nippon Telegr & Teleph Corp <Ntt> | Lsiチツプ実装用カ−ド |
JPS60129897A (ja) * | 1983-12-19 | 1985-07-11 | Sony Corp | 小型電子機器 |
JPS60189860U (ja) * | 1984-05-25 | 1985-12-16 | オムロン株式会社 | 変流器の出力回路 |
JPS62179993A (ja) * | 1986-02-04 | 1987-08-07 | カシオ計算機株式会社 | 電子カ−ド |
-
1988
- 1988-06-29 JP JP1988086505U patent/JPH081110Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH028977U (nl) | 1990-01-19 |
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