JPH028977U - - Google Patents

Info

Publication number
JPH028977U
JPH028977U JP1988086505U JP8650588U JPH028977U JP H028977 U JPH028977 U JP H028977U JP 1988086505 U JP1988086505 U JP 1988086505U JP 8650588 U JP8650588 U JP 8650588U JP H028977 U JPH028977 U JP H028977U
Authority
JP
Japan
Prior art keywords
memory
circuit section
wiring board
printed wiring
memory card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1988086505U
Other languages
English (en)
Japanese (ja)
Other versions
JPH081110Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988086505U priority Critical patent/JPH081110Y2/ja
Priority to PCT/JP1989/000643 priority patent/WO1990000117A1/ja
Priority to EP19890907813 priority patent/EP0379592A4/en
Publication of JPH028977U publication Critical patent/JPH028977U/ja
Application granted granted Critical
Publication of JPH081110Y2 publication Critical patent/JPH081110Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Credit Cards Or The Like (AREA)
  • Wire Bonding (AREA)
JP1988086505U 1988-06-29 1988-06-29 Ｉｃメモリーカード Expired - Lifetime JPH081110Y2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1988086505U JPH081110Y2 (ja) 1988-06-29 1988-06-29 Ｉｃメモリーカード
PCT/JP1989/000643 WO1990000117A1 (en) 1988-06-29 1989-06-28 Ic memory card
EP19890907813 EP0379592A4 (en) 1988-06-29 1989-06-28 Ic memory card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988086505U JPH081110Y2 (ja) 1988-06-29 1988-06-29 Ｉｃメモリーカード

Publications (2)

Publication Number Publication Date
JPH028977U true JPH028977U (nl) 1990-01-19
JPH081110Y2 JPH081110Y2 (ja) 1996-01-17

Family

ID=31311144

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988086505U Expired - Lifetime JPH081110Y2 (ja) 1988-06-29 1988-06-29 Ｉｃメモリーカード

Country Status (1)

Country Link
JP (1) JPH081110Y2 (nl)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6080232A (ja) * 1983-10-11 1985-05-08 Nippon Telegr & Teleph Corp <Ntt> Ｌｓｉチツプ実装用カ−ド
JPS60129897A (ja) * 1983-12-19 1985-07-11 Sony Corp 小型電子機器
JPS60189860U (ja) * 1984-05-25 1985-12-16 オムロン株式会社 変流器の出力回路
JPS62179993A (ja) * 1986-02-04 1987-08-07 カシオ計算機株式会社 電子カ−ド

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6080232A (ja) * 1983-10-11 1985-05-08 Nippon Telegr & Teleph Corp <Ntt> Ｌｓｉチツプ実装用カ−ド
JPS60129897A (ja) * 1983-12-19 1985-07-11 Sony Corp 小型電子機器
JPS60189860U (ja) * 1984-05-25 1985-12-16 オムロン株式会社 変流器の出力回路
JPS62179993A (ja) * 1986-02-04 1987-08-07 カシオ計算機株式会社 電子カ−ド

Also Published As

Publication number Publication date
JPH081110Y2 (ja) 1996-01-17

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