JPH08110353A - 半導体加速度センサー装置 - Google Patents

半導体加速度センサー装置

Info

Publication number
JPH08110353A
JPH08110353A JP6246174A JP24617494A JPH08110353A JP H08110353 A JPH08110353 A JP H08110353A JP 6246174 A JP6246174 A JP 6246174A JP 24617494 A JP24617494 A JP 24617494A JP H08110353 A JPH08110353 A JP H08110353A
Authority
JP
Japan
Prior art keywords
sensor chip
semiconductor acceleration
acceleration sensor
sensor device
probe pin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6246174A
Other languages
English (en)
Japanese (ja)
Inventor
Hajime Kato
肇 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP6246174A priority Critical patent/JPH08110353A/ja
Priority to DE19523171A priority patent/DE19523171C2/de
Publication of JPH08110353A publication Critical patent/JPH08110353A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
JP6246174A 1994-10-12 1994-10-12 半導体加速度センサー装置 Pending JPH08110353A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP6246174A JPH08110353A (ja) 1994-10-12 1994-10-12 半導体加速度センサー装置
DE19523171A DE19523171C2 (de) 1994-10-12 1995-06-26 Halbleiterbeschleunigungssensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6246174A JPH08110353A (ja) 1994-10-12 1994-10-12 半導体加速度センサー装置

Publications (1)

Publication Number Publication Date
JPH08110353A true JPH08110353A (ja) 1996-04-30

Family

ID=17144622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6246174A Pending JPH08110353A (ja) 1994-10-12 1994-10-12 半導体加速度センサー装置

Country Status (2)

Country Link
JP (1) JPH08110353A (de)
DE (1) DE19523171C2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4246197B2 (ja) 2005-12-08 2009-04-02 三菱電機株式会社 センサチップの破壊強度検査方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6459161A (en) * 1987-08-31 1989-03-06 Fujikura Ltd Semiconductor acceleration sensor and manufacture thereof
JPH04166770A (ja) * 1990-10-30 1992-06-12 Mitsubishi Electric Corp 半導体加速度センサ装置の製造方法
JPH04174365A (ja) * 1990-11-06 1992-06-22 Mitsubishi Electric Corp 半導体ｇセンサ

Also Published As

Publication number Publication date
DE19523171A1 (de) 1996-04-18
DE19523171C2 (de) 2000-03-02

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