JPH0755003Y2 - 半導体素子用セラミックパッケージ - Google Patents
半導体素子用セラミックパッケージInfo
- Publication number
- JPH0755003Y2 JPH0755003Y2 JP1988139933U JP13993388U JPH0755003Y2 JP H0755003 Y2 JPH0755003 Y2 JP H0755003Y2 JP 1988139933 U JP1988139933 U JP 1988139933U JP 13993388 U JP13993388 U JP 13993388U JP H0755003 Y2 JPH0755003 Y2 JP H0755003Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- layer ceramic
- package
- ceramic substrate
- metal conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988139933U JPH0755003Y2 (ja) | 1988-10-28 | 1988-10-28 | 半導体素子用セラミックパッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988139933U JPH0755003Y2 (ja) | 1988-10-28 | 1988-10-28 | 半導体素子用セラミックパッケージ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0262734U JPH0262734U (it) | 1990-05-10 |
JPH0755003Y2 true JPH0755003Y2 (ja) | 1995-12-18 |
Family
ID=31403649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988139933U Expired - Lifetime JPH0755003Y2 (ja) | 1988-10-28 | 1988-10-28 | 半導体素子用セラミックパッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0755003Y2 (it) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4595835B2 (ja) * | 2006-03-07 | 2010-12-08 | 株式会社日立製作所 | 鉛フリーはんだを用いたリード付き電子部品 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60142546A (ja) * | 1983-12-29 | 1985-07-27 | Matsushita Electronics Corp | 半導体集積回路用パツケ−ジ |
JPS62232949A (ja) * | 1986-04-02 | 1987-10-13 | Nec Corp | 半導体装置用パツケ−ジ |
-
1988
- 1988-10-28 JP JP1988139933U patent/JPH0755003Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0262734U (it) | 1990-05-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6330158B1 (en) | Semiconductor package having heat sinks and method of fabrication | |
US4879588A (en) | Integrated circuit package | |
US5719441A (en) | Transistor package with integral heatsink | |
JPH0755003Y2 (ja) | 半導体素子用セラミックパッケージ | |
JP3492594B2 (ja) | 半導体モジュール | |
JP3193142B2 (ja) | 基 板 | |
JP2856192B2 (ja) | 半導体装置 | |
JPH09213847A (ja) | 半導体集積回路装置及びこの製造方法並びにそれを用いた電子装置 | |
JP3894749B2 (ja) | 半導体装置 | |
JP2841945B2 (ja) | 半導体装置 | |
JPH05121589A (ja) | 厚膜混成集積回路 | |
JPH10107200A (ja) | 半導体集積回路装置 | |
JPH04213863A (ja) | Ic実装用パッケージ/キャリア | |
JP3022738B2 (ja) | マルチチップモジュール | |
JP2765242B2 (ja) | 集積回路装置 | |
JPS5810360Y2 (ja) | 半導体装置用パツケ−ジ | |
JPH10294403A (ja) | 半導体装置 | |
JPH01120853A (ja) | 半導体装置 | |
JP3074077B2 (ja) | 半導体パッケージ | |
JPH08274225A (ja) | 半導体部品 | |
JPH0627956Y2 (ja) | 電子回路モジュール | |
JPH05114665A (ja) | 放熱性基板 | |
JPS6184043A (ja) | プラグインパツケ−ジ | |
JPH05335451A (ja) | 半導体装置 | |
JPH0677366A (ja) | 半導体装置 |