JPH0744018Y2 - 突起電極部構造 - Google Patents

突起電極部構造

Info

Publication number
JPH0744018Y2
JPH0744018Y2 JP1987013180U JP1318087U JPH0744018Y2 JP H0744018 Y2 JPH0744018 Y2 JP H0744018Y2 JP 1987013180 U JP1987013180 U JP 1987013180U JP 1318087 U JP1318087 U JP 1318087U JP H0744018 Y2 JPH0744018 Y2 JP H0744018Y2
Authority
JP
Japan
Prior art keywords
wiring conductor
protruding electrode
substrate
hole
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987013180U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63121448U (enExample
Inventor
良郎 高橋
勝 木村
和男 戸倉
義範 荒尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP1987013180U priority Critical patent/JPH0744018Y2/ja
Publication of JPS63121448U publication Critical patent/JPS63121448U/ja
Application granted granted Critical
Publication of JPH0744018Y2 publication Critical patent/JPH0744018Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/012—

Landscapes

  • Wire Bonding (AREA)
JP1987013180U 1987-01-31 1987-01-31 突起電極部構造 Expired - Lifetime JPH0744018Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987013180U JPH0744018Y2 (ja) 1987-01-31 1987-01-31 突起電極部構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987013180U JPH0744018Y2 (ja) 1987-01-31 1987-01-31 突起電極部構造

Publications (2)

Publication Number Publication Date
JPS63121448U JPS63121448U (enExample) 1988-08-05
JPH0744018Y2 true JPH0744018Y2 (ja) 1995-10-09

Family

ID=30801996

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987013180U Expired - Lifetime JPH0744018Y2 (ja) 1987-01-31 1987-01-31 突起電極部構造

Country Status (1)

Country Link
JP (1) JPH0744018Y2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68927931T2 (de) * 1989-07-26 1997-09-18 Ibm Verfahren zur Herstellung einer Packungsstruktur für einen integrierten Schaltungschip
JP4666608B2 (ja) * 2005-06-29 2011-04-06 日本インター株式会社 電極構造の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58157147A (ja) * 1982-03-12 1983-09-19 Mitsubishi Electric Corp 混成集積回路基板

Also Published As

Publication number Publication date
JPS63121448U (enExample) 1988-08-05

Similar Documents

Publication Publication Date Title
US5960262A (en) Stitch bond enhancement for hard-to-bond materials
JPH09321073A (ja) 半導体装置用パッケージ及び半導体装置
JP2001060645A (ja) 半導体ダイスの基板への取付用介在物
JPH01205544A (ja) 集積回路装置の組立テープ
JPH08186151A (ja) 半導体装置及びその製造方法
US6501160B1 (en) Semiconductor device and a method of manufacturing the same and a mount structure
KR100345075B1 (ko) 칩 사이즈 패키지
KR100658120B1 (ko) 필름 기판을 사용한 반도체 장치 제조 방법
JPH11126795A (ja) 実装基板およびその製造方法ならびに電子部品の実装方法
JPH0744018Y2 (ja) 突起電極部構造
JP2005311137A (ja) 半導体装置及びその製造方法、半導体装置の実装構造並びにリードフレーム
JP2002280491A (ja) 電子部品およびその製造方法
JP3563170B2 (ja) 半導体装置の製造方法
JPH0547836A (ja) 半導体装置の実装構造
JPH11176849A (ja) 半導体装置の製造方法
JPH09199631A (ja) 半導体装置の構造と製造方法
JPH07283274A (ja) 半導体装置及び接合シート
JPH09246416A (ja) 半導体装置
JP2751897B2 (ja) ボールグリッドアレイ実装構造及び実装方法
JP3389712B2 (ja) Ｉｃチップのバンプ形成方法
JP2739366B2 (ja) 電子部品搭載用基板
JP2002270629A (ja) 電子部品およびその製造方法
JP2551243B2 (ja) 半導体装置
JP2762705B2 (ja) 半導体装置実装用回路基板の構造
JP2002261183A (ja) 配線基板、半導体装置、及びその製造方法