JPH0739230Y2 - トランスファ成形用金型 - Google Patents

トランスファ成形用金型

Info

Publication number
JPH0739230Y2
JPH0739230Y2 JP14669488U JP14669488U JPH0739230Y2 JP H0739230 Y2 JPH0739230 Y2 JP H0739230Y2 JP 14669488 U JP14669488 U JP 14669488U JP 14669488 U JP14669488 U JP 14669488U JP H0739230 Y2 JPH0739230 Y2 JP H0739230Y2
Authority
JP
Japan
Prior art keywords
mold
runner
lead frame
gap
flash
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP14669488U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0267639U (OSRAM
Inventor
元聖 鹿川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP14669488U priority Critical patent/JPH0739230Y2/ja
Publication of JPH0267639U publication Critical patent/JPH0267639U/ja
Application granted granted Critical
Publication of JPH0739230Y2 publication Critical patent/JPH0739230Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
JP14669488U 1988-11-10 1988-11-10 トランスファ成形用金型 Expired - Fee Related JPH0739230Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14669488U JPH0739230Y2 (ja) 1988-11-10 1988-11-10 トランスファ成形用金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14669488U JPH0739230Y2 (ja) 1988-11-10 1988-11-10 トランスファ成形用金型

Publications (2)

Publication Number Publication Date
JPH0267639U JPH0267639U (OSRAM) 1990-05-22
JPH0739230Y2 true JPH0739230Y2 (ja) 1995-09-06

Family

ID=31416424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14669488U Expired - Fee Related JPH0739230Y2 (ja) 1988-11-10 1988-11-10 トランスファ成形用金型

Country Status (1)

Country Link
JP (1) JPH0739230Y2 (OSRAM)

Also Published As

Publication number Publication date
JPH0267639U (OSRAM) 1990-05-22

Similar Documents

Publication Publication Date Title
JP3339602B2 (ja) パワー用半導体装置の製造方法
US5422314A (en) Lead frame and production method for producing semiconductor device using the lead frame
JPH0739230Y2 (ja) トランスファ成形用金型
JPS587322A (ja) 樹脂封入成形方法とその金型装置
JPH0124612B2 (OSRAM)
JPH02184040A (ja) 半導体装置の製造方法
JPS5881137A (ja) 合成樹脂製品の成形方法
JP3444747B2 (ja) 電子部品の樹脂封止成形方法
JPH0647703Y2 (ja) ディスクシェルケース成形用金型
JPH06224244A (ja) 電子部品の封止成形方法及び金型
JPH0153501B2 (OSRAM)
JP3174408B2 (ja) 鋳造用金型構造
JPS6237120A (ja) モ−ルド金型およびモ−ルド方法
JPS5932138Y2 (ja) 半導体装置の樹脂モ−ルド装置
JP2000225634A (ja) 樹脂封止用金型
JPH069842B2 (ja) 射出成形方法
JPH0763983B2 (ja) 表面に凹部を有する成形品の射出成形方法及び装置
JP3499269B2 (ja) カバーフレームと樹脂封止方法
JPH06166050A (ja) 樹脂モールド装置
JPH0644105Y2 (ja) 樹脂モ−ルド型半導体装置のリ−ドフレ−ム
JPS62140426A (ja) 樹脂封止金型
JP2000200797A (ja) 樹脂封止型半導体装置のモ―ルド金型及びそのリ―ドフレ―ム
JPH01315148A (ja) 半導体装置の樹脂封止金型
JPH10151633A (ja) 電子部品の樹脂封止成形用金型の加工方法及び金型
JPH02148744A (ja) 樹脂封止半導体用モールド金型

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees