JPH073636Y2 - 半導体素子固定用耐熱接着フイルム - Google Patents

半導体素子固定用耐熱接着フイルム

Info

Publication number
JPH073636Y2
JPH073636Y2 JP1987001075U JP107587U JPH073636Y2 JP H073636 Y2 JPH073636 Y2 JP H073636Y2 JP 1987001075 U JP1987001075 U JP 1987001075U JP 107587 U JP107587 U JP 107587U JP H073636 Y2 JPH073636 Y2 JP H073636Y2
Authority
JP
Japan
Prior art keywords
heat
adhesive film
resistant adhesive
lead frame
semiconductor elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987001075U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63110034U (enExample
Inventor
征則 作本
淳 越村
垣 松下
正企 津島
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Tomoegawa Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Tomoegawa Paper Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd, Tomoegawa Paper Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP1987001075U priority Critical patent/JPH073636Y2/ja
Priority to KR1019880000060A priority patent/KR880009429A/ko
Publication of JPS63110034U publication Critical patent/JPS63110034U/ja
Priority to KR2019940021708U priority patent/KR940007545Y1/ko
Application granted granted Critical
Publication of JPH073636Y2 publication Critical patent/JPH073636Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/071—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Die Bonding (AREA)
JP1987001075U 1987-01-09 1987-01-09 半導体素子固定用耐熱接着フイルム Expired - Lifetime JPH073636Y2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1987001075U JPH073636Y2 (ja) 1987-01-09 1987-01-09 半導体素子固定用耐熱接着フイルム
KR1019880000060A KR880009429A (ko) 1987-01-09 1988-01-08 반도체 소자 고정용 내열 접착필름
KR2019940021708U KR940007545Y1 (ko) 1987-01-09 1994-08-26 반도체 소자 고정용 내열필름(Heat-resistance bonding film for attaching semiconductor device)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987001075U JPH073636Y2 (ja) 1987-01-09 1987-01-09 半導体素子固定用耐熱接着フイルム

Publications (2)

Publication Number Publication Date
JPS63110034U JPS63110034U (enExample) 1988-07-15
JPH073636Y2 true JPH073636Y2 (ja) 1995-01-30

Family

ID=30778641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987001075U Expired - Lifetime JPH073636Y2 (ja) 1987-01-09 1987-01-09 半導体素子固定用耐熱接着フイルム

Country Status (2)

Country Link
JP (1) JPH073636Y2 (enExample)
KR (1) KR880009429A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2668576B2 (ja) * 1989-02-23 1997-10-27 株式会社 巴川製紙所 接着テープ

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57102137U (enExample) * 1980-12-12 1982-06-23
JPS58169912A (ja) * 1982-03-31 1983-10-06 Hitachi Ltd 半導体装置
JPS59146963U (ja) * 1983-03-22 1984-10-01 凸版印刷株式会社 リ−ドフレ−ム
JPS59231825A (ja) * 1983-06-14 1984-12-26 Toshiba Corp 半導体装置
JPS60167454A (ja) * 1984-02-10 1985-08-30 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
KR880009429A (ko) 1988-09-15
JPS63110034U (enExample) 1988-07-15

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