JPH0442921Y2 - - Google Patents

Info

Publication number
JPH0442921Y2
JPH0442921Y2 JP1987062676U JP6267687U JPH0442921Y2 JP H0442921 Y2 JPH0442921 Y2 JP H0442921Y2 JP 1987062676 U JP1987062676 U JP 1987062676U JP 6267687 U JP6267687 U JP 6267687U JP H0442921 Y2 JPH0442921 Y2 JP H0442921Y2
Authority
JP
Japan
Prior art keywords
die pad
resin
semiconductor device
adhesive layer
tape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1987062676U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63170946U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987062676U priority Critical patent/JPH0442921Y2/ja
Publication of JPS63170946U publication Critical patent/JPS63170946U/ja
Application granted granted Critical
Publication of JPH0442921Y2 publication Critical patent/JPH0442921Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Wire Bonding (AREA)
JP1987062676U 1987-04-27 1987-04-27 Expired JPH0442921Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987062676U JPH0442921Y2 (enExample) 1987-04-27 1987-04-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987062676U JPH0442921Y2 (enExample) 1987-04-27 1987-04-27

Publications (2)

Publication Number Publication Date
JPS63170946U JPS63170946U (enExample) 1988-11-07
JPH0442921Y2 true JPH0442921Y2 (enExample) 1992-10-12

Family

ID=30897174

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987062676U Expired JPH0442921Y2 (enExample) 1987-04-27 1987-04-27

Country Status (1)

Country Link
JP (1) JPH0442921Y2 (enExample)

Also Published As

Publication number Publication date
JPS63170946U (enExample) 1988-11-07

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