JPS63170946U - - Google Patents
Info
- Publication number
- JPS63170946U JPS63170946U JP1987062676U JP6267687U JPS63170946U JP S63170946 U JPS63170946 U JP S63170946U JP 1987062676 U JP1987062676 U JP 1987062676U JP 6267687 U JP6267687 U JP 6267687U JP S63170946 U JPS63170946 U JP S63170946U
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- semiconductor pellet
- lead
- sealing resin
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987062676U JPH0442921Y2 (enExample) | 1987-04-27 | 1987-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987062676U JPH0442921Y2 (enExample) | 1987-04-27 | 1987-04-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63170946U true JPS63170946U (enExample) | 1988-11-07 |
| JPH0442921Y2 JPH0442921Y2 (enExample) | 1992-10-12 |
Family
ID=30897174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987062676U Expired JPH0442921Y2 (enExample) | 1987-04-27 | 1987-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0442921Y2 (enExample) |
-
1987
- 1987-04-27 JP JP1987062676U patent/JPH0442921Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0442921Y2 (enExample) | 1992-10-12 |