JPS63170945U - - Google Patents
Info
- Publication number
- JPS63170945U JPS63170945U JP1987062675U JP6267587U JPS63170945U JP S63170945 U JPS63170945 U JP S63170945U JP 1987062675 U JP1987062675 U JP 1987062675U JP 6267587 U JP6267587 U JP 6267587U JP S63170945 U JPS63170945 U JP S63170945U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor pellet
- die pad
- semiconductor
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987062675U JPS63170945U (enExample) | 1987-04-27 | 1987-04-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987062675U JPS63170945U (enExample) | 1987-04-27 | 1987-04-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63170945U true JPS63170945U (enExample) | 1988-11-07 |
Family
ID=30897172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987062675U Pending JPS63170945U (enExample) | 1987-04-27 | 1987-04-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63170945U (enExample) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5226878B1 (enExample) * | 1972-07-03 | 1977-07-16 | ||
| JPS57160138A (en) * | 1981-03-27 | 1982-10-02 | Yamagata Nippon Denki Kk | Lead frame for semiconductor device |
| JPS5834934A (ja) * | 1981-08-26 | 1983-03-01 | Toshiba Corp | 半導体装置 |
| JPS60113932A (ja) * | 1983-11-26 | 1985-06-20 | Mitsubishi Electric Corp | 樹脂封止半導体装置の組立方法 |
-
1987
- 1987-04-27 JP JP1987062675U patent/JPS63170945U/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5226878B1 (enExample) * | 1972-07-03 | 1977-07-16 | ||
| JPS57160138A (en) * | 1981-03-27 | 1982-10-02 | Yamagata Nippon Denki Kk | Lead frame for semiconductor device |
| JPS5834934A (ja) * | 1981-08-26 | 1983-03-01 | Toshiba Corp | 半導体装置 |
| JPS60113932A (ja) * | 1983-11-26 | 1985-06-20 | Mitsubishi Electric Corp | 樹脂封止半導体装置の組立方法 |