JPH0260236U - - Google Patents
Info
- Publication number
- JPH0260236U JPH0260236U JP1988139621U JP13962188U JPH0260236U JP H0260236 U JPH0260236 U JP H0260236U JP 1988139621 U JP1988139621 U JP 1988139621U JP 13962188 U JP13962188 U JP 13962188U JP H0260236 U JPH0260236 U JP H0260236U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- pellet
- bonded
- substrate
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988139621U JPH0260236U (enExample) | 1988-10-26 | 1988-10-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988139621U JPH0260236U (enExample) | 1988-10-26 | 1988-10-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0260236U true JPH0260236U (enExample) | 1990-05-02 |
Family
ID=31403046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988139621U Pending JPH0260236U (enExample) | 1988-10-26 | 1988-10-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0260236U (enExample) |
-
1988
- 1988-10-26 JP JP1988139621U patent/JPH0260236U/ja active Pending