JPS63170945U - - Google Patents

Info

Publication number
JPS63170945U
JPS63170945U JP6267587U JP6267587U JPS63170945U JP S63170945 U JPS63170945 U JP S63170945U JP 6267587 U JP6267587 U JP 6267587U JP 6267587 U JP6267587 U JP 6267587U JP S63170945 U JPS63170945 U JP S63170945U
Authority
JP
Japan
Prior art keywords
lead
semiconductor pellet
die pad
semiconductor
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6267587U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6267587U priority Critical patent/JPS63170945U/ja
Publication of JPS63170945U publication Critical patent/JPS63170945U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は従来の技術によるリードフレームの斜
視図、第２図は従来の半導体装図の断面図、第３
図は本考案の半導体装置の断面図、第４図は本考
案で用いられるダイパツドテープの構造例を示す
断面図、第５図は本考案を構成するリードフレー
ムの１例の平面図である。 ２：リード、４：半導体ペレツト、５：ダイボ
ンデイング接着剤、６……ボンデイングワイヤー
、７：電極、８：封止樹脂、９：空隙部、１０：
ダイパツドテープ、１０ａ：接着性支持体、１０
ｂ：支持体、１１ａ，１１ｂ：接着層、１２ａ：
表面処理層。

Claims (1)

    【実用新案登録請求の範囲】
  1. ダイパツドが排除されたリードフレームの空隙
    部に半導体ペレツトが配置され、該半導体ペレツ
    トの下面とリードの下面とが、ダイパツドテープ
    に接着され、かつ該半導体ペレツト上部に設けた
    電極とリード間がボンデイングワイヤーで接続さ
    れ、これらが封止樹脂で密封封止されていること
    を特徴とする半導体装置。
JP6267587U 1987-04-27 1987-04-27 Pending JPS63170945U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6267587U JPS63170945U (ja) 1987-04-27 1987-04-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6267587U JPS63170945U (ja) 1987-04-27 1987-04-27

Publications (1)

Publication Number Publication Date
JPS63170945U true JPS63170945U (ja) 1988-11-07

Family

ID=30897172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6267587U Pending JPS63170945U (ja) 1987-04-27 1987-04-27

Country Status (1)

Country Link
JP (1) JPS63170945U (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5226878B1 (ja) * 1972-07-03 1977-07-16
JPS57160138A (en) * 1981-03-27 1982-10-02 Yamagata Nippon Denki Kk Lead frame for semiconductor device
JPS5834934A (ja) * 1981-08-26 1983-03-01 Toshiba Corp 半導体装置
JPS60113932A (ja) * 1983-11-26 1985-06-20 Mitsubishi Electric Corp 樹脂封止半導体装置の組立方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5226878B1 (ja) * 1972-07-03 1977-07-16
JPS57160138A (en) * 1981-03-27 1982-10-02 Yamagata Nippon Denki Kk Lead frame for semiconductor device
JPS5834934A (ja) * 1981-08-26 1983-03-01 Toshiba Corp 半導体装置
JPS60113932A (ja) * 1983-11-26 1985-06-20 Mitsubishi Electric Corp 樹脂封止半導体装置の組立方法

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