JPS61207040U - - Google Patents

Info

Publication number
JPS61207040U
JPS61207040U JP9017685U JP9017685U JPS61207040U JP S61207040 U JPS61207040 U JP S61207040U JP 9017685 U JP9017685 U JP 9017685U JP 9017685 U JP9017685 U JP 9017685U JP S61207040 U JPS61207040 U JP S61207040U
Authority
JP
Japan
Prior art keywords
lead frame
chip
power transistor
die island
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9017685U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9017685U priority Critical patent/JPS61207040U/ja
Publication of JPS61207040U publication Critical patent/JPS61207040U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例のパワトランジスタ
の樹脂封止の説明のための断面図、第２図ａは本
実施例のパワトランジスタの平面図、ｂは断面図
、第３図は従来のパワトランジスタの樹脂封止の
説明のために断面図、第４図は従来のパワトラン
ジスタの断面図である。 １，２…型、３…リードフレーム、４…半導体
チツプ、５…ワイヤ、６…封止樹脂、７…リード
フレーム。

Claims (1)

  1. 【実用新案登録請求の範囲】 リードフレームの放熱板として機能するダイア
    イランドにパワトランジスタチツプを接着し、該
    チツプの電極と上記リードフレームのリードとを
    ワイヤにより接続し、上記ダイアイランドが完全
    に内蔵され且つ該ダイアイランドの上記チツプ接
    着面の反対面と樹脂の外面とが近接するように樹
    脂封止したパワトランジスタにおいて、 上記リードフレームが均一厚で成り、該リード
    フレームが、ダイアイランドが段底となるように
    折曲加工され、該段底部分に上記チツプに接着さ
    れたことを特徴とするパワトランジスタ。
JP9017685U 1985-06-17 1985-06-17 Pending JPS61207040U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9017685U JPS61207040U (ja) 1985-06-17 1985-06-17

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9017685U JPS61207040U (ja) 1985-06-17 1985-06-17

Publications (1)

Publication Number Publication Date
JPS61207040U true JPS61207040U (ja) 1986-12-27

Family

ID=30644938

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9017685U Pending JPS61207040U (ja) 1985-06-17 1985-06-17

Country Status (1)

Country Link
JP (1) JPS61207040U (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60128646A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd 絶縁型パワートランジスタの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60128646A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd 絶縁型パワートランジスタの製造方法

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