JPS6242254U - - Google Patents

Info

Publication number
JPS6242254U
JPS6242254U JP13389885U JP13389885U JPS6242254U JP S6242254 U JPS6242254 U JP S6242254U JP 13389885 U JP13389885 U JP 13389885U JP 13389885 U JP13389885 U JP 13389885U JP S6242254 U JPS6242254 U JP S6242254U
Authority
JP
Japan
Prior art keywords
glass
semiconductor element
lead terminal
external lead
semiconductor package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13389885U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13389885U priority Critical patent/JPS6242254U/ja
Publication of JPS6242254U publication Critical patent/JPS6242254U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第1図乃至第3図は本考案のガラス封止型半導
体パツケージの一実施例を示す図である。 1……基体、2……蓋体、4……半導体素子、
5……外部リード端子、6a,6b……ガラス層
、7……電極、8……凹凸部。

Claims (1)

  1. 【実用新案登録請求の範囲】 絶縁基体と蓋体との間に半導体素子及び該半導
    体素子の各電極がワイヤボンドにより接続された
    外部リード端子とを挾持し、ガラス溶着によつて
    内部に半導体素子を封止するガラス封止型半導体
    パツケージにおいて、 前記少なくとも1つの外部リード端子のワイヤ
    がボンデイングされる部位に表面粗さ1乃至10
    μmの凹凸部を設けたことを特徴とするガラス封
    止型半導体パツケージ。
JP13389885U 1985-08-31 1985-08-31 Pending JPS6242254U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13389885U JPS6242254U (ja) 1985-08-31 1985-08-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13389885U JPS6242254U (ja) 1985-08-31 1985-08-31

Publications (1)

Publication Number Publication Date
JPS6242254U true JPS6242254U (ja) 1987-03-13

Family

ID=31034632

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13389885U Pending JPS6242254U (ja) 1985-08-31 1985-08-31

Country Status (1)

Country Link
JP (1) JPS6242254U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02136607A (ja) * 1988-11-18 1990-05-25 Universal Trading Kk 改良型バーナー
JPH0418748A (ja) * 1990-05-11 1992-01-22 Toshiba Corp セラミックパッケージ用リードフレーム

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5454569A (en) * 1977-10-11 1979-04-28 Toshiba Corp Semiconductor device
JPS5674936A (en) * 1979-11-22 1981-06-20 Sharp Corp Position detection method of semiconductor chip

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5454569A (en) * 1977-10-11 1979-04-28 Toshiba Corp Semiconductor device
JPS5674936A (en) * 1979-11-22 1981-06-20 Sharp Corp Position detection method of semiconductor chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02136607A (ja) * 1988-11-18 1990-05-25 Universal Trading Kk 改良型バーナー
JPH0418748A (ja) * 1990-05-11 1992-01-22 Toshiba Corp セラミックパッケージ用リードフレーム

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