JPS63170946U - - Google Patents
Info
- Publication number
- JPS63170946U JPS63170946U JP6267687U JP6267687U JPS63170946U JP S63170946 U JPS63170946 U JP S63170946U JP 6267687 U JP6267687 U JP 6267687U JP 6267687 U JP6267687 U JP 6267687U JP S63170946 U JPS63170946 U JP S63170946U
- Authority
- JP
- Japan
- Prior art keywords
- die pad
- semiconductor pellet
- lead
- sealing resin
- bonding wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000008188 pellet Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000002335 surface treatment layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
Description
第1図は従来の技術によるリードフレームの斜
視図、第2図は従来の半導体装置の断面図、第3
図イ,ロは本考案の半導体装置の断面図である。
第4図は本考案において用いられるダイパツドテ
ープの各例の断面図。 1;ダイパツド、2;リード、3;サポートバ
ー、4;半導体ペレツト、5;ダイボンデイング
接着剤、6;ボンデイングワイヤー、7;電極、
8;封止樹脂、10;ダイパツドテープ、10a
;接着性支持体、10b;支持体、11;上面の
接着層、12a;下面の接着層、12b;表面処
理層。
視図、第2図は従来の半導体装置の断面図、第3
図イ,ロは本考案の半導体装置の断面図である。
第4図は本考案において用いられるダイパツドテ
ープの各例の断面図。 1;ダイパツド、2;リード、3;サポートバ
ー、4;半導体ペレツト、5;ダイボンデイング
接着剤、6;ボンデイングワイヤー、7;電極、
8;封止樹脂、10;ダイパツドテープ、10a
;接着性支持体、10b;支持体、11;上面の
接着層、12a;下面の接着層、12b;表面処
理層。
Claims (1)
- リードフレームの中央のダイパツド上に半導体
ペレツトが配置接合され、かつ少なくも該ダイパ
ツドの下面が、絶縁性ダイパツドテープに接着さ
れ、かつ該半導体ペレツト上部に設けた電極とリ
ード間がボンデイングワイヤーで接続され、これ
らが封止樹脂で密封封止されていることを特徴と
する半導体装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6267687U JPH0442921Y2 (ja) | 1987-04-27 | 1987-04-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6267687U JPH0442921Y2 (ja) | 1987-04-27 | 1987-04-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63170946U true JPS63170946U (ja) | 1988-11-07 |
JPH0442921Y2 JPH0442921Y2 (ja) | 1992-10-12 |
Family
ID=30897174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6267687U Expired JPH0442921Y2 (ja) | 1987-04-27 | 1987-04-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0442921Y2 (ja) |
-
1987
- 1987-04-27 JP JP6267687U patent/JPH0442921Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPH0442921Y2 (ja) | 1992-10-12 |