JPS63110034U - - Google Patents
Info
- Publication number
- JPS63110034U JPS63110034U JP1987001075U JP107587U JPS63110034U JP S63110034 U JPS63110034 U JP S63110034U JP 1987001075 U JP1987001075 U JP 1987001075U JP 107587 U JP107587 U JP 107587U JP S63110034 U JPS63110034 U JP S63110034U
- Authority
- JP
- Japan
- Prior art keywords
- heat
- resistant
- film
- thermosetting resin
- surface treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/071—
-
- H10W72/536—
-
- H10W72/5363—
-
- H10W72/884—
-
- H10W74/00—
-
- H10W90/736—
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- H10W90/756—
Landscapes
- Die Bonding (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987001075U JPH073636Y2 (ja) | 1987-01-09 | 1987-01-09 | 半導体素子固定用耐熱接着フイルム |
| KR1019880000060A KR880009429A (ko) | 1987-01-09 | 1988-01-08 | 반도체 소자 고정용 내열 접착필름 |
| KR2019940021708U KR940007545Y1 (ko) | 1987-01-09 | 1994-08-26 | 반도체 소자 고정용 내열필름(Heat-resistance bonding film for attaching semiconductor device) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987001075U JPH073636Y2 (ja) | 1987-01-09 | 1987-01-09 | 半導体素子固定用耐熱接着フイルム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63110034U true JPS63110034U (enExample) | 1988-07-15 |
| JPH073636Y2 JPH073636Y2 (ja) | 1995-01-30 |
Family
ID=30778641
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987001075U Expired - Lifetime JPH073636Y2 (ja) | 1987-01-09 | 1987-01-09 | 半導体素子固定用耐熱接着フイルム |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPH073636Y2 (enExample) |
| KR (1) | KR880009429A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02222477A (ja) * | 1989-02-23 | 1990-09-05 | Tomoegawa Paper Co Ltd | 接着テープ |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57102137U (enExample) * | 1980-12-12 | 1982-06-23 | ||
| JPS58169912A (ja) * | 1982-03-31 | 1983-10-06 | Hitachi Ltd | 半導体装置 |
| JPS59146963U (ja) * | 1983-03-22 | 1984-10-01 | 凸版印刷株式会社 | リ−ドフレ−ム |
| JPS59231825A (ja) * | 1983-06-14 | 1984-12-26 | Toshiba Corp | 半導体装置 |
| JPS60167454A (ja) * | 1984-02-10 | 1985-08-30 | Hitachi Ltd | 半導体装置 |
-
1987
- 1987-01-09 JP JP1987001075U patent/JPH073636Y2/ja not_active Expired - Lifetime
-
1988
- 1988-01-08 KR KR1019880000060A patent/KR880009429A/ko not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57102137U (enExample) * | 1980-12-12 | 1982-06-23 | ||
| JPS58169912A (ja) * | 1982-03-31 | 1983-10-06 | Hitachi Ltd | 半導体装置 |
| JPS59146963U (ja) * | 1983-03-22 | 1984-10-01 | 凸版印刷株式会社 | リ−ドフレ−ム |
| JPS59231825A (ja) * | 1983-06-14 | 1984-12-26 | Toshiba Corp | 半導体装置 |
| JPS60167454A (ja) * | 1984-02-10 | 1985-08-30 | Hitachi Ltd | 半導体装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02222477A (ja) * | 1989-02-23 | 1990-09-05 | Tomoegawa Paper Co Ltd | 接着テープ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH073636Y2 (ja) | 1995-01-30 |
| KR880009429A (ko) | 1988-09-15 |