JPH0163145U - - Google Patents

Info

Publication number
JPH0163145U
JPH0163145U JP1987158264U JP15826487U JPH0163145U JP H0163145 U JPH0163145 U JP H0163145U JP 1987158264 U JP1987158264 U JP 1987158264U JP 15826487 U JP15826487 U JP 15826487U JP H0163145 U JPH0163145 U JP H0163145U
Authority
JP
Japan
Prior art keywords
island
bonded
lead frame
metal lead
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987158264U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987158264U priority Critical patent/JPH0163145U/ja
Publication of JPH0163145U publication Critical patent/JPH0163145U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/073—
    • H10W90/736—

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1987158264U 1987-10-16 1987-10-16 Pending JPH0163145U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987158264U JPH0163145U (enExample) 1987-10-16 1987-10-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987158264U JPH0163145U (enExample) 1987-10-16 1987-10-16

Publications (1)

Publication Number Publication Date
JPH0163145U true JPH0163145U (enExample) 1989-04-24

Family

ID=31438434

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987158264U Pending JPH0163145U (enExample) 1987-10-16 1987-10-16

Country Status (1)

Country Link
JP (1) JPH0163145U (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06295970A (ja) * 1993-04-08 1994-10-21 Seiko Epson Corp 半導体装置及び半導体装置製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06295970A (ja) * 1993-04-08 1994-10-21 Seiko Epson Corp 半導体装置及び半導体装置製造方法

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