JPH0268449U - - Google Patents

Info

Publication number
JPH0268449U
JPH0268449U JP1988149174U JP14917488U JPH0268449U JP H0268449 U JPH0268449 U JP H0268449U JP 1988149174 U JP1988149174 U JP 1988149174U JP 14917488 U JP14917488 U JP 14917488U JP H0268449 U JPH0268449 U JP H0268449U
Authority
JP
Japan
Prior art keywords
plastic
plastic resin
semiconductor device
thin film
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988149174U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988149174U priority Critical patent/JPH0268449U/ja
Publication of JPH0268449U publication Critical patent/JPH0268449U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1988149174U 1988-11-15 1988-11-15 Pending JPH0268449U (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988149174U JPH0268449U (enExample) 1988-11-15 1988-11-15

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988149174U JPH0268449U (enExample) 1988-11-15 1988-11-15

Publications (1)

Publication Number Publication Date
JPH0268449U true JPH0268449U (enExample) 1990-05-24

Family

ID=31421164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988149174U Pending JPH0268449U (enExample) 1988-11-15 1988-11-15

Country Status (1)

Country Link
JP (1) JPH0268449U (enExample)

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