JPH0268449U - - Google Patents
Info
- Publication number
- JPH0268449U JPH0268449U JP1988149174U JP14917488U JPH0268449U JP H0268449 U JPH0268449 U JP H0268449U JP 1988149174 U JP1988149174 U JP 1988149174U JP 14917488 U JP14917488 U JP 14917488U JP H0268449 U JPH0268449 U JP H0268449U
- Authority
- JP
- Japan
- Prior art keywords
- plastic
- plastic resin
- semiconductor device
- thin film
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000088 plastic resin Substances 0.000 claims description 4
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000002344 surface layer Substances 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案による半導体ＩＣの一実施例を
示し、ａは断面図、ｂは上側図、ｃはアルミ薄板
形状、ｄはプラスチツク樹脂形状である。第２図
は本考案による半導体ＩＣの他の実施例を示しａ
は断面図、ｂは上側図、ｃはアルミ薄板形状、ｄ
はプラスチツク樹脂形状。
１……アルミ薄板、２……プラスチツク樹脂、
３……リードフレーム。
FIG. 1 shows an embodiment of a semiconductor IC according to the present invention, in which a is a sectional view, b is a top view, c is an aluminum thin plate shape, and d is a plastic resin shape. FIG. 2 shows another embodiment of the semiconductor IC according to the present invention.
is a cross-sectional view, b is a top view, c is an aluminum thin plate shape, d
is a plastic resin shape. 1...Aluminum thin plate, 2...Plastic resin,
3...Lead frame.
Claims (1)
り反射率の高い薄膜を装着させた事を特徴とする
プラスチツク封止型半導体装置。 A plastic-sealed semiconductor device characterized in that a thin film having a higher reflectance than the surface layer is attached to the upper surface of a plastic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988149174U JPH0268449U (en) | 1988-11-15 | 1988-11-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988149174U JPH0268449U (en) | 1988-11-15 | 1988-11-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0268449U true JPH0268449U (en) | 1990-05-24 |
Family
ID=31421164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988149174U Pending JPH0268449U (en) | 1988-11-15 | 1988-11-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0268449U (en) |
-
1988
- 1988-11-15 JP JP1988149174U patent/JPH0268449U/ja active Pending