JPH0727639Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0727639Y2
JPH0727639Y2 JP1989126058U JP12605889U JPH0727639Y2 JP H0727639 Y2 JPH0727639 Y2 JP H0727639Y2 JP 1989126058 U JP1989126058 U JP 1989126058U JP 12605889 U JP12605889 U JP 12605889U JP H0727639 Y2 JPH0727639 Y2 JP H0727639Y2
Authority
JP
Japan
Prior art keywords
semiconductor element
circuit board
semiconductor device
spring mechanism
flat plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989126058U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0365254U (enrdf_load_html_response
Inventor
達也 加藤
健二 八村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1989126058U priority Critical patent/JPH0727639Y2/ja
Publication of JPH0365254U publication Critical patent/JPH0365254U/ja
Application granted granted Critical
Publication of JPH0727639Y2 publication Critical patent/JPH0727639Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP1989126058U 1989-10-27 1989-10-27 半導体装置 Expired - Fee Related JPH0727639Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989126058U JPH0727639Y2 (ja) 1989-10-27 1989-10-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989126058U JPH0727639Y2 (ja) 1989-10-27 1989-10-27 半導体装置

Publications (2)

Publication Number Publication Date
JPH0365254U JPH0365254U (enrdf_load_html_response) 1991-06-25
JPH0727639Y2 true JPH0727639Y2 (ja) 1995-06-21

Family

ID=31673897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989126058U Expired - Fee Related JPH0727639Y2 (ja) 1989-10-27 1989-10-27 半導体装置

Country Status (1)

Country Link
JP (1) JPH0727639Y2 (enrdf_load_html_response)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4764979B2 (ja) * 2004-06-08 2011-09-07 富士電機株式会社 半導体装置
JP5460560B2 (ja) * 2010-11-11 2014-04-02 三菱電機株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01302753A (ja) * 1988-05-30 1989-12-06 Sansha Electric Mfg Co Ltd 樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPH0365254U (enrdf_load_html_response) 1991-06-25

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Legal Events

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