JPH07207466A - パラジウム用化学エッチャント - Google Patents
パラジウム用化学エッチャントInfo
- Publication number
- JPH07207466A JPH07207466A JP6317409A JP31740994A JPH07207466A JP H07207466 A JPH07207466 A JP H07207466A JP 6317409 A JP6317409 A JP 6317409A JP 31740994 A JP31740994 A JP 31740994A JP H07207466 A JPH07207466 A JP H07207466A
- Authority
- JP
- Japan
- Prior art keywords
- solution
- acid
- nitrobenzoic acid
- compound
- thallium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims abstract description 70
- 229910052763 palladium Inorganic materials 0.000 title claims abstract description 25
- 239000000126 substance Substances 0.000 title description 2
- 239000000243 solution Substances 0.000 claims abstract description 122
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims abstract description 89
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims abstract description 87
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000010949 copper Substances 0.000 claims abstract description 45
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000003112 inhibitor Substances 0.000 claims abstract description 22
- SLAMLWHELXOEJZ-UHFFFAOYSA-N 2-nitrobenzoic acid Chemical compound OC(=O)C1=CC=CC=C1[N+]([O-])=O SLAMLWHELXOEJZ-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000007800 oxidant agent Substances 0.000 claims abstract description 18
- AFPHTEQTJZKQAQ-UHFFFAOYSA-N 3-nitrobenzoic acid Chemical compound OC(=O)C1=CC=CC([N+]([O-])=O)=C1 AFPHTEQTJZKQAQ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 230000001590 oxidative effect Effects 0.000 claims abstract description 17
- OTLNPYWUJOZPPA-UHFFFAOYSA-N 4-nitrobenzoic acid Chemical compound OC(=O)C1=CC=C([N+]([O-])=O)C=C1 OTLNPYWUJOZPPA-UHFFFAOYSA-N 0.000 claims abstract description 16
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims abstract description 16
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 150000003476 thallium compounds Chemical class 0.000 claims abstract description 12
- 229910000029 sodium carbonate Inorganic materials 0.000 claims abstract description 8
- MNWBNISUBARLIT-UHFFFAOYSA-N sodium cyanide Chemical compound [Na+].N#[C-] MNWBNISUBARLIT-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000007864 aqueous solution Substances 0.000 claims abstract description 6
- 238000005260 corrosion Methods 0.000 claims abstract description 6
- NKCCODPFBDGPRJ-UHFFFAOYSA-N nitridocarbon(1+) Chemical compound N#[C+] NKCCODPFBDGPRJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 150000003839 salts Chemical class 0.000 claims abstract description 5
- 230000007797 corrosion Effects 0.000 claims abstract description 4
- 239000012266 salt solution Substances 0.000 claims abstract 9
- 239000002904 solvent Substances 0.000 claims abstract 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims abstract 2
- 239000004615 ingredient Substances 0.000 claims abstract 2
- 238000000034 method Methods 0.000 claims description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 27
- 229910052716 thallium Inorganic materials 0.000 claims description 26
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 claims description 24
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical group CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 18
- 239000011734 sodium Substances 0.000 claims description 17
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 claims description 15
- 239000008367 deionised water Substances 0.000 claims description 14
- 229910021641 deionized water Inorganic materials 0.000 claims description 14
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical class CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 12
- -1 mercapto compound Chemical class 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 12
- 239000011833 salt mixture Substances 0.000 claims description 12
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical group CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 10
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical class OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical class OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 8
- 239000002253 acid Substances 0.000 claims description 7
- 150000005440 nitrobenzoic acid derivatives Chemical class 0.000 claims description 7
- FYWSTUCDSVYLPV-UHFFFAOYSA-N nitrooxythallium Chemical compound [Tl+].[O-][N+]([O-])=O FYWSTUCDSVYLPV-UHFFFAOYSA-N 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 6
- 150000003475 thallium Chemical class 0.000 claims description 5
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 claims description 4
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical compound C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 claims description 4
- QWIWYBUPJLCBSE-UHFFFAOYSA-N 3-chloro-2-nitrobenzenesulfonic acid Chemical class OS(=O)(=O)C1=CC=CC(Cl)=C1[N+]([O-])=O QWIWYBUPJLCBSE-UHFFFAOYSA-N 0.000 claims description 4
- VCHSXYHBMFKRBK-UHFFFAOYSA-N 4771-47-5 Chemical compound OC(=O)C1=CC=CC(Cl)=C1[N+]([O-])=O VCHSXYHBMFKRBK-UHFFFAOYSA-N 0.000 claims description 4
- CWIYBOJLSWJGKV-UHFFFAOYSA-N 5-methyl-1,3-dihydrobenzimidazole-2-thione Chemical compound CC1=CC=C2NC(S)=NC2=C1 CWIYBOJLSWJGKV-UHFFFAOYSA-N 0.000 claims description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical class O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 4
- 150000007513 acids Chemical class 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 4
- 229910017604 nitric acid Inorganic materials 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000013019 agitation Methods 0.000 claims description 2
- 238000001914 filtration Methods 0.000 claims description 2
- 229910002651 NO3 Inorganic materials 0.000 claims 4
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 claims 4
- SPXOTSHWBDUUMT-UHFFFAOYSA-N 138-42-1 Chemical compound OS(=O)(=O)C1=CC=C([N+]([O-])=O)C=C1 SPXOTSHWBDUUMT-UHFFFAOYSA-N 0.000 claims 3
- HWTDMFJYBAURQR-UHFFFAOYSA-N 80-82-0 Chemical compound OS(=O)(=O)C1=CC=CC=C1[N+]([O-])=O HWTDMFJYBAURQR-UHFFFAOYSA-N 0.000 claims 3
- ONMOULMPIIOVTQ-UHFFFAOYSA-N 98-47-5 Chemical compound OS(=O)(=O)C1=CC=CC([N+]([O-])=O)=C1 ONMOULMPIIOVTQ-UHFFFAOYSA-N 0.000 claims 3
- 239000012046 mixed solvent Substances 0.000 claims 3
- PYRZPBDTPRQYKG-UHFFFAOYSA-N cyclopentene-1-carboxylic acid Chemical compound OC(=O)C1=CCCC1 PYRZPBDTPRQYKG-UHFFFAOYSA-N 0.000 claims 2
- 239000000706 filtrate Substances 0.000 claims 2
- 230000002401 inhibitory effect Effects 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract 3
- 229940054266 2-mercaptobenzothiazole Drugs 0.000 abstract 1
- 239000012141 concentrate Substances 0.000 description 14
- 230000003628 erosive effect Effects 0.000 description 14
- 238000005530 etching Methods 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000011889 copper foil Substances 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 9
- 229910052737 gold Inorganic materials 0.000 description 9
- 239000010931 gold Substances 0.000 description 9
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 3
- 239000002244 precipitate Substances 0.000 description 3
- 239000002516 radical scavenger Substances 0.000 description 3
- 230000002195 synergetic effect Effects 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- KXZJHVJKXJLBKO-UHFFFAOYSA-N chembl1408157 Chemical compound N=1C2=CC=CC=C2C(C(=O)O)=CC=1C1=CC=C(O)C=C1 KXZJHVJKXJLBKO-UHFFFAOYSA-N 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Natural products NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 150000001447 alkali salts Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000002779 inactivation Effects 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- 150000002611 lead compounds Chemical class 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 150000002940 palladium Chemical class 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 230000003334 potential effect Effects 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/16—Sulfur-containing compounds
- C23F11/161—Mercaptans
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- ing And Chemical Polishing (AREA)
- Treatment Of Water By Oxidation Or Reduction (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/175,091 US5380400A (en) | 1993-12-29 | 1993-12-29 | Chemical etchant for palladium |
| US175091 | 1993-12-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07207466A true JPH07207466A (ja) | 1995-08-08 |
Family
ID=22638843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6317409A Pending JPH07207466A (ja) | 1993-12-29 | 1994-12-21 | パラジウム用化学エッチャント |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5380400A (en:Method) |
| EP (1) | EP0661388B1 (en:Method) |
| JP (1) | JPH07207466A (en:Method) |
| KR (1) | KR950018642A (en:Method) |
| CA (1) | CA2133134C (en:Method) |
| DE (1) | DE69427680T2 (en:Method) |
| SG (1) | SG43776A1 (en:Method) |
| TW (1) | TW270943B (en:Method) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101994104A (zh) * | 2009-08-10 | 2011-03-30 | 住友电木株式会社 | 非电解镍-钯-金镀敷方法、镀敷处理物、印刷布线板、内插板以及半导体装置 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7150820B2 (en) * | 2003-09-22 | 2006-12-19 | Semitool, Inc. | Thiourea- and cyanide-free bath and process for electrolytic etching of gold |
| TW200831710A (en) * | 2006-09-25 | 2008-08-01 | Mec Co Ltd | Metal removing solution and metal removing method using the same |
| TWI471457B (zh) * | 2013-02-22 | 2015-02-01 | Uwin Nanotech Co Ltd | 金屬剝除添加劑、含其之組合物、及使用該組合物以剝除金屬的方法 |
| CN105219967A (zh) * | 2015-10-14 | 2016-01-06 | 云龙县铂翠贵金属科技有限公司 | 一种铜基镀钯电子废料退钯及提铜的方法 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2185858A (en) * | 1936-06-27 | 1940-01-02 | Western Electric Co | Method of removing gold, silver, palladium, or the like |
| US2649361A (en) * | 1949-05-13 | 1953-08-18 | Enthone | Method of dissolving metals and compostion therefor |
| US3102808A (en) * | 1959-01-29 | 1963-09-03 | Eltex Res Corp | Composition for selectively stripping electroplated metals from surfaces |
| US3242090A (en) * | 1964-03-10 | 1966-03-22 | Macdermid Inc | Compositions for and methods of removing gold deposits by chemical action |
| DE1226551B (de) * | 1964-12-28 | 1966-10-13 | Basf Ag | Verfahren zur Gewinnung von Palladium-verbindungen durch Extraktion |
| US3655363A (en) * | 1970-10-23 | 1972-04-11 | Kuraray Co | Method of recovering palladium |
| US3839110A (en) * | 1973-02-20 | 1974-10-01 | Bell Telephone Labor Inc | Chemical etchant for palladium |
| US3819494A (en) * | 1973-03-29 | 1974-06-25 | Fountain Plating Co Inc | Method of removing braze |
| US3935005A (en) * | 1974-09-19 | 1976-01-27 | American Chemical & Refining Company, Incorporated | Composition and method for stripping gold and silver |
| US4548791A (en) * | 1983-09-30 | 1985-10-22 | American Chemical & Refining Company, Inc. | Thallium-containing composition for stripping palladium |
| US4483739A (en) * | 1984-02-16 | 1984-11-20 | Omi International Corporation | Compositions and method for stripping gold from copper substrates |
| JPH08988B2 (ja) * | 1987-04-18 | 1996-01-10 | 新光電気工業株式会社 | 金めつき剥離液 |
-
1993
- 1993-12-29 US US08/175,091 patent/US5380400A/en not_active Expired - Lifetime
-
1994
- 1994-09-12 TW TW083108404A patent/TW270943B/zh active
- 1994-09-28 CA CA002133134A patent/CA2133134C/en not_active Expired - Lifetime
- 1994-12-09 DE DE69427680T patent/DE69427680T2/de not_active Expired - Lifetime
- 1994-12-09 SG SG1996000800A patent/SG43776A1/en unknown
- 1994-12-09 EP EP94309195A patent/EP0661388B1/en not_active Expired - Lifetime
- 1994-12-21 JP JP6317409A patent/JPH07207466A/ja active Pending
- 1994-12-23 KR KR1019940036158A patent/KR950018642A/ko not_active Abandoned
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101994104A (zh) * | 2009-08-10 | 2011-03-30 | 住友电木株式会社 | 非电解镍-钯-金镀敷方法、镀敷处理物、印刷布线板、内插板以及半导体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0661388B1 (en) | 2001-07-11 |
| EP0661388A1 (en) | 1995-07-05 |
| HK1004716A1 (en) | 1998-12-04 |
| CA2133134C (en) | 1998-12-15 |
| DE69427680T2 (de) | 2002-04-25 |
| DE69427680D1 (de) | 2001-08-16 |
| KR950018642A (ko) | 1995-07-22 |
| TW270943B (en:Method) | 1996-02-21 |
| CA2133134A1 (en) | 1995-06-30 |
| US5380400A (en) | 1995-01-10 |
| SG43776A1 (en) | 1997-11-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20021105 |