CA2133134C - Chemical etchant for palladium - Google Patents

Chemical etchant for palladium

Info

Publication number
CA2133134C
CA2133134C CA002133134A CA2133134A CA2133134C CA 2133134 C CA2133134 C CA 2133134C CA 002133134 A CA002133134 A CA 002133134A CA 2133134 A CA2133134 A CA 2133134A CA 2133134 C CA2133134 C CA 2133134C
Authority
CA
Canada
Prior art keywords
solution
nitrobenzoic acid
stripping
acid
mercaptobenzothiazole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CA002133134A
Other languages
English (en)
French (fr)
Other versions
CA2133134A1 (en
Inventor
Joseph Anthony Abys
Joseph John Maisano, Jr.
Heinrich Karl Straschil
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
American Telephone and Telegraph Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Telephone and Telegraph Co Inc filed Critical American Telephone and Telegraph Co Inc
Publication of CA2133134A1 publication Critical patent/CA2133134A1/en
Application granted granted Critical
Publication of CA2133134C publication Critical patent/CA2133134C/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/16—Sulfur-containing compounds
    • C23F11/161—Mercaptans

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • ing And Chemical Polishing (AREA)
  • Treatment Of Water By Oxidation Or Reduction (AREA)
CA002133134A 1993-12-29 1994-09-28 Chemical etchant for palladium Expired - Lifetime CA2133134C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/175,091 US5380400A (en) 1993-12-29 1993-12-29 Chemical etchant for palladium
US175,091 1993-12-29

Publications (2)

Publication Number Publication Date
CA2133134A1 CA2133134A1 (en) 1995-06-30
CA2133134C true CA2133134C (en) 1998-12-15

Family

ID=22638843

Family Applications (1)

Application Number Title Priority Date Filing Date
CA002133134A Expired - Lifetime CA2133134C (en) 1993-12-29 1994-09-28 Chemical etchant for palladium

Country Status (8)

Country Link
US (1) US5380400A (en:Method)
EP (1) EP0661388B1 (en:Method)
JP (1) JPH07207466A (en:Method)
KR (1) KR950018642A (en:Method)
CA (1) CA2133134C (en:Method)
DE (1) DE69427680T2 (en:Method)
SG (1) SG43776A1 (en:Method)
TW (1) TW270943B (en:Method)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7150820B2 (en) * 2003-09-22 2006-12-19 Semitool, Inc. Thiourea- and cyanide-free bath and process for electrolytic etching of gold
TW200831710A (en) * 2006-09-25 2008-08-01 Mec Co Ltd Metal removing solution and metal removing method using the same
JP5573429B2 (ja) * 2009-08-10 2014-08-20 住友ベークライト株式会社 無電解ニッケル−パラジウム−金めっき方法、めっき処理物、プリント配線板、インターポーザ、および半導体装置
TWI471457B (zh) * 2013-02-22 2015-02-01 Uwin Nanotech Co Ltd 金屬剝除添加劑、含其之組合物、及使用該組合物以剝除金屬的方法
CN105219967A (zh) * 2015-10-14 2016-01-06 云龙县铂翠贵金属科技有限公司 一种铜基镀钯电子废料退钯及提铜的方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2185858A (en) * 1936-06-27 1940-01-02 Western Electric Co Method of removing gold, silver, palladium, or the like
US2649361A (en) * 1949-05-13 1953-08-18 Enthone Method of dissolving metals and compostion therefor
US3102808A (en) * 1959-01-29 1963-09-03 Eltex Res Corp Composition for selectively stripping electroplated metals from surfaces
US3242090A (en) * 1964-03-10 1966-03-22 Macdermid Inc Compositions for and methods of removing gold deposits by chemical action
DE1226551B (de) * 1964-12-28 1966-10-13 Basf Ag Verfahren zur Gewinnung von Palladium-verbindungen durch Extraktion
US3655363A (en) * 1970-10-23 1972-04-11 Kuraray Co Method of recovering palladium
US3839110A (en) * 1973-02-20 1974-10-01 Bell Telephone Labor Inc Chemical etchant for palladium
US3819494A (en) * 1973-03-29 1974-06-25 Fountain Plating Co Inc Method of removing braze
US3935005A (en) * 1974-09-19 1976-01-27 American Chemical & Refining Company, Incorporated Composition and method for stripping gold and silver
US4548791A (en) * 1983-09-30 1985-10-22 American Chemical & Refining Company, Inc. Thallium-containing composition for stripping palladium
US4483739A (en) * 1984-02-16 1984-11-20 Omi International Corporation Compositions and method for stripping gold from copper substrates
JPH08988B2 (ja) * 1987-04-18 1996-01-10 新光電気工業株式会社 金めつき剥離液

Also Published As

Publication number Publication date
EP0661388B1 (en) 2001-07-11
EP0661388A1 (en) 1995-07-05
HK1004716A1 (en) 1998-12-04
DE69427680T2 (de) 2002-04-25
DE69427680D1 (de) 2001-08-16
KR950018642A (ko) 1995-07-22
JPH07207466A (ja) 1995-08-08
TW270943B (en:Method) 1996-02-21
CA2133134A1 (en) 1995-06-30
US5380400A (en) 1995-01-10
SG43776A1 (en) 1997-11-14

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Legal Events

Date Code Title Description
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MKEX Expiry

Effective date: 20140929