DE69427680D1 - Chemisches Palladium-Ätzmittel - Google Patents

Chemisches Palladium-Ätzmittel

Info

Publication number
DE69427680D1
DE69427680D1 DE69427680T DE69427680T DE69427680D1 DE 69427680 D1 DE69427680 D1 DE 69427680D1 DE 69427680 T DE69427680 T DE 69427680T DE 69427680 T DE69427680 T DE 69427680T DE 69427680 D1 DE69427680 D1 DE 69427680D1
Authority
DE
Germany
Prior art keywords
etchant
chemical palladium
palladium
chemical
palladium etchant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69427680T
Other languages
English (en)
Other versions
DE69427680T2 (de
Inventor
Joseph Anthony Abys
Maisano, Jr
Heinrich Karl Straschil
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Application granted granted Critical
Publication of DE69427680D1 publication Critical patent/DE69427680D1/de
Publication of DE69427680T2 publication Critical patent/DE69427680T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/16—Sulfur-containing compounds
    • C23F11/161—Mercaptans

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • ing And Chemical Polishing (AREA)
  • Treatment Of Water By Oxidation Or Reduction (AREA)
DE69427680T 1993-12-29 1994-12-09 Chemisches Palladium-Ätzmittel Expired - Lifetime DE69427680T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/175,091 US5380400A (en) 1993-12-29 1993-12-29 Chemical etchant for palladium

Publications (2)

Publication Number Publication Date
DE69427680D1 true DE69427680D1 (de) 2001-08-16
DE69427680T2 DE69427680T2 (de) 2002-04-25

Family

ID=22638843

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69427680T Expired - Lifetime DE69427680T2 (de) 1993-12-29 1994-12-09 Chemisches Palladium-Ätzmittel

Country Status (9)

Country Link
US (1) US5380400A (de)
EP (1) EP0661388B1 (de)
JP (1) JPH07207466A (de)
KR (1) KR950018642A (de)
CA (1) CA2133134C (de)
DE (1) DE69427680T2 (de)
HK (1) HK1004716A1 (de)
SG (1) SG43776A1 (de)
TW (1) TW270943B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7150820B2 (en) * 2003-09-22 2006-12-19 Semitool, Inc. Thiourea- and cyanide-free bath and process for electrolytic etching of gold
TW200831710A (en) * 2006-09-25 2008-08-01 Mec Co Ltd Metal removing solution and metal removing method using the same
JP5573429B2 (ja) * 2009-08-10 2014-08-20 住友ベークライト株式会社 無電解ニッケル−パラジウム−金めっき方法、めっき処理物、プリント配線板、インターポーザ、および半導体装置
TWI471457B (zh) * 2013-02-22 2015-02-01 Uwin Nanotech Co Ltd 金屬剝除添加劑、含其之組合物、及使用該組合物以剝除金屬的方法
CN105219967A (zh) * 2015-10-14 2016-01-06 云龙县铂翠贵金属科技有限公司 一种铜基镀钯电子废料退钯及提铜的方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2185858A (en) * 1936-06-27 1940-01-02 Western Electric Co Method of removing gold, silver, palladium, or the like
US2649361A (en) * 1949-05-13 1953-08-18 Enthone Method of dissolving metals and compostion therefor
US3102808A (en) * 1959-01-29 1963-09-03 Eltex Res Corp Composition for selectively stripping electroplated metals from surfaces
US3242090A (en) * 1964-03-10 1966-03-22 Macdermid Inc Compositions for and methods of removing gold deposits by chemical action
DE1226551B (de) * 1964-12-28 1966-10-13 Basf Ag Verfahren zur Gewinnung von Palladium-verbindungen durch Extraktion
US3655363A (en) * 1970-10-23 1972-04-11 Kuraray Co Method of recovering palladium
US3839110A (en) * 1973-02-20 1974-10-01 Bell Telephone Labor Inc Chemical etchant for palladium
US3819494A (en) * 1973-03-29 1974-06-25 Fountain Plating Co Inc Method of removing braze
US3935005A (en) * 1974-09-19 1976-01-27 American Chemical & Refining Company, Incorporated Composition and method for stripping gold and silver
US4548791A (en) * 1983-09-30 1985-10-22 American Chemical & Refining Company, Inc. Thallium-containing composition for stripping palladium
US4483739A (en) * 1984-02-16 1984-11-20 Omi International Corporation Compositions and method for stripping gold from copper substrates
JPH08988B2 (ja) * 1987-04-18 1996-01-10 新光電気工業株式会社 金めつき剥離液

Also Published As

Publication number Publication date
HK1004716A1 (en) 1998-12-04
CA2133134A1 (en) 1995-06-30
KR950018642A (ko) 1995-07-22
CA2133134C (en) 1998-12-15
TW270943B (de) 1996-02-21
JPH07207466A (ja) 1995-08-08
EP0661388A1 (de) 1995-07-05
DE69427680T2 (de) 2002-04-25
SG43776A1 (en) 1997-11-14
US5380400A (en) 1995-01-10
EP0661388B1 (de) 2001-07-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition