JPH0653462A - 樹脂封合形固体撮像素子パッケージおよびその製造方法 - Google Patents

樹脂封合形固体撮像素子パッケージおよびその製造方法

Info

Publication number
JPH0653462A
JPH0653462A JP12603093A JP12603093A JPH0653462A JP H0653462 A JPH0653462 A JP H0653462A JP 12603093 A JP12603093 A JP 12603093A JP 12603093 A JP12603093 A JP 12603093A JP H0653462 A JPH0653462 A JP H0653462A
Authority
JP
Japan
Prior art keywords
lead
resin
semiconductor chip
glass
device package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP12603093A
Other languages
English (en)
Japanese (ja)
Inventor
Ki Rok Hur
起緑 許
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Goldstar Electron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goldstar Electron Co Ltd filed Critical Goldstar Electron Co Ltd
Publication of JPH0653462A publication Critical patent/JPH0653462A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/124—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed the encapsulations having cavities other than that occupied by chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Solid State Image Pick-Up Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP12603093A 1992-06-16 1993-05-27 樹脂封合形固体撮像素子パッケージおよびその製造方法 Withdrawn JPH0653462A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR92P10430 1992-06-16
KR1019920010430A KR940001333A (ko) 1992-06-16 1992-06-16 수지봉합형 고체촬상소자 패키지 및 그 제조방법

Publications (1)

Publication Number Publication Date
JPH0653462A true JPH0653462A (ja) 1994-02-25

Family

ID=19334753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12603093A Withdrawn JPH0653462A (ja) 1992-06-16 1993-05-27 樹脂封合形固体撮像素子パッケージおよびその製造方法

Country Status (4)

Country Link
JP (1) JPH0653462A (enExample)
KR (1) KR940001333A (enExample)
DE (1) DE4319786A1 (enExample)
TW (1) TW222713B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100396702B1 (ko) * 2001-01-15 2003-09-03 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조방법

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19816309B4 (de) * 1997-04-14 2008-04-03 CiS Institut für Mikrosensorik gGmbH Verfahren zur Direktmontage von Silizium-Sensoren und danach hergestellte Sensoren
DE19724026A1 (de) * 1997-06-06 1998-12-10 Siemens Ag Drucksensor-Bauelement und Verfahren zur Herstellung
US6274927B1 (en) 1999-06-03 2001-08-14 Amkor Technology, Inc. Plastic package for an optical integrated circuit device and method of making
US6861720B1 (en) 2001-08-29 2005-03-01 Amkor Technology, Inc. Placement template and method for placing optical dies
US6784534B1 (en) 2002-02-06 2004-08-31 Amkor Technology, Inc. Thin integrated circuit package having an optically transparent window
DE10322751B3 (de) * 2003-05-19 2004-09-30 X-Fab Semiconductor Foundries Ag Verfahren zur Herstellung eines in Kunststoff verschlossenen optoelektronischen Bauelementes
US20060124915A1 (en) * 2003-05-19 2006-06-15 Siegfried Buettner Production of an optoelectronic component that is enclosed in plastic, and corresponding methods
GB0412436D0 (en) * 2004-06-04 2004-07-07 Melexis Nv Semiconductor package with transparent lid
WO2008082565A1 (en) * 2006-12-29 2008-07-10 Tessera, Inc. Microelectronic devices and methods of manufacturing such devices
KR100806774B1 (ko) * 2007-05-16 2008-02-22 주식회사 펠릭스정보통신 Ａｃ/ｄｃ 변환기 및 이를 이용한 ａｃ/ｄｃ 변환 방법
US11699647B2 (en) 2021-04-15 2023-07-11 Infineon Technologies Ag Pre-molded lead frames for semiconductor packages

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4812420A (en) * 1986-09-30 1989-03-14 Mitsubishi Denki Kabushiki Kaisha Method of producing a semiconductor device having a light transparent window
DE8808815U1 (de) * 1988-06-23 1988-09-15 Heimann Optoelectronics Gmbh, 65199 Wiesbaden Infrarotdetektor
JPH02143466A (ja) * 1988-11-25 1990-06-01 Mitsubishi Electric Corp 半導体装置の製造方法
KR930010072B1 (ko) * 1990-10-13 1993-10-14 금성일렉트론 주식회사 Ccd패키지 및 그 제조방법
KR940002444B1 (ko) * 1990-11-13 1994-03-24 금성일렉트론 주식회사 반도체 소자의 패키지 어셈블리 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100396702B1 (ko) * 2001-01-15 2003-09-03 앰코 테크놀로지 코리아 주식회사 반도체 패키지 및 그 제조방법

Also Published As

Publication number Publication date
DE4319786A1 (de) 1993-12-23
KR940001333A (ko) 1994-01-11
TW222713B (enExample) 1994-04-21

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Legal Events

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A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20000801