JPH06275661A - 半導体素子の基板接着構造 - Google Patents

半導体素子の基板接着構造

Info

Publication number
JPH06275661A
JPH06275661A JP5063655A JP6365593A JPH06275661A JP H06275661 A JPH06275661 A JP H06275661A JP 5063655 A JP5063655 A JP 5063655A JP 6365593 A JP6365593 A JP 6365593A JP H06275661 A JPH06275661 A JP H06275661A
Authority
JP
Japan
Prior art keywords
substrate
beads
bonding agent
ultraviolet rays
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5063655A
Other languages
English (en)
Inventor
良廣 ▲秦▼
Yoshihiro Hata
Masayuki Honda
正行 本多
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP5063655A priority Critical patent/JPH06275661A/ja
Publication of JPH06275661A publication Critical patent/JPH06275661A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/1403—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation characterised by the type of electromagnetic or particle radiation
    • B29C65/1406—Ultraviolet [UV] radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/4845—Radiation curing adhesives, e.g. UV light curing adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4865—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives
    • B29C65/487—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical
    • B29C65/4875—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding containing additives characterised by their shape, e.g. being fibres or being spherical being spherical, e.g. particles or powders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
    • B29C65/7802—Positioning the parts to be joined, e.g. aligning, indexing or centring
    • B29C65/782—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined
    • B29C65/7823—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint
    • B29C65/7826—Positioning the parts to be joined, e.g. aligning, indexing or centring by setting the gap between the parts to be joined by using distance pieces, i.e. by using spacers positioned between the parts to be joined and forming a part of the joint said distance pieces being non-integral with the parts to be joined, e.g. particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/29386—Base material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2224/29388—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/2939—Base material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83874—Ultraviolet [UV] curing

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】 【目的】 従来よりも作業工程の簡略化およびコストダ
ウンを図れる半導体素子の基板接着構造を提供する。 【構成】 ＵＶ硬化樹脂接着剤２’に予め、透明ガラス
または透光性樹脂等から作られた紫外光を透過するビー
ズ６を混入してなることを特徴とする。

Description

【発明の詳細な説明】
【０００１】
【産業上の利用分野】本発明は、例えばホログラムレー
ザーユニットの受光素子を基板に接着する半導体素子の
基板接着構造に関する。
【０００２】
【従来の技術】従来の技術について図４を参照して説明
する。図４（ａ），（ｂ）は従来例によるＵＶ硬化樹脂
接着剤を使用して、ホログラムレーザーユニット用の受
光素子を基板に接着する構造を説明するための断面図で
ある。
【０００３】従来は、例えば受光素子等の半導体ペレッ
トを基板に接着、接合させる場合、紫外光の照射によっ
て比較的短時間で硬化するＵＶ硬化性樹脂を用いてい
た。ところが、紫外光が樹脂に十分照射できない環境、
構造等においてはＵＶ硬化性のみでは十分な接合強度が
得られない、または十分な硬化までに時間を要するとい
った問題があり、ＵＶ硬化性樹脂に加え嫌気硬化性およ
び熱硬化性の２つの特性をもたせていた。さらに、ＵＶ
硬化性をより有効に生かせるために、以下のような構造
が実現されている。
【０００４】まず図４（ａ）に示すように、基板１に対
してＵＶ硬化樹脂接着剤（以下、単に接着剤と記す）２
を塗布し、その上に下面に光透過用の薄板３を設けた受
光素子４を載置する。ここで、接着剤２は、前述のよう
にＵＶ硬化性に加え嫌気硬化性と熱硬化性の２つの特性
を有するものである。また、受光素子４の下面に薄板３
を設けているのは、受光素子４と基板１との間に紫外光
５を十分導き、硬化が速やかに行われるようにするため
である。
【０００５】次に、図４（ｂ）に示すように、基板１全
体に対して紫外光５の照射を行い、接着剤２を硬化させ
受光素子を基板１に接着、固定する。
【０００６】
【発明が解決しようとする課題】ところが上記の従来構
造によれば、紫外光５を基板１と受光素子４との間に導
く光透過用の薄板３を接着層の部分に設けなければなら
ず、この層を形成する工程が別途必要となり、作業効率
の低下、コストアップにつながっていた。
【０００７】また、嫌気硬化性、熱硬化性を生かすため
には嫌気性の保持、加熱が可能という条件設定が不可欠
であり、不便であった。
【０００８】そこで本発明の目的は、作業工程が少なく
従来よりもコストダウンを図れる接着構造を提供するこ
とにある。
【０００９】
【課題を解決するための手段】前記目的を達成するため
に本発明は、基板に半導体素子をＵＶ硬化樹脂接着剤を
用いて接着する半導体素子の基板接着構造において、前
記ＵＶ硬化樹脂接着剤に予め紫外光を透過するビーズを
混入してなることを特徴とする。
【００１０】
【作用】樹脂に紫外光を透過するビーズを予め混入して
いるので、外部からの紫外光は樹脂中のビーズを介して
基板、半導体素子の接合部の内方にまで十分導かれる。
従って、従来不可欠であった導光のための薄板等は不要
となり、工程の簡略化、コストダウンを図れる。
【００１１】また、従来例による導光のための薄板は接
着剤とは別体であったが、本発明においては接着剤自体
に導光性をもたせているので、紫外光による硬化性が従
来よりも優れている。従って、従来の接着剤に加えてい
た嫌気硬化性、熱硬化性を持たせる必要がなくなり、さ
らにコストダウンを図れる。
【００１２】
【実施例】本発明の一実施例について、図１を参照して
説明する。図１（ａ）乃至（ｃ）は、本実施例による半
導体素子の基板接着方法を示す工程図である。なお、図
５に示す従来例と同一機能部分には同一記号を付してい
る。
【００１３】本実施例の特徴は、図１（ａ）に示すよう
に、ＵＶ硬化樹脂接着剤２に紫外光を透過する材料、例
えば透明ガラスまたは樹脂から作られたビーズ６を混入
させた点にある。樹脂の材料としては、例えばジビニル
ベンゼン系の高分子樹脂を使用する。ビーズの形状は球
形とし、その大きさは５ｕｍ〜１００ｕｍ（最適値は５
ｕｍ〜５０ｕｍ）、混入の比率は重量パーセンテージで
５％〜３０％（最適値は５％〜１０％）である。
【００１４】上記ビーズ入りのＵＶ硬化樹脂接着剤２’
（以下、単に接着剤２’と記す）をディスペンサー７を
用いて基板１上に塗布する。その後、図１（ｂ）に示す
ように、接着剤２’の上に半導体ペレット８を載置し、
次いで図１（ｃ）に示すように、基板全体に紫外光５を
照射して接着剤２’を硬化して基板１への受光素子８の
接着、接合を完了する。
【００１５】以上の方法によれば、樹脂に透光性のビー
ズ６を混入しているので、外部からの紫外光はビーズ６
を介して基板１、半導体ペレット８の接合部の内方にま
で十分導かれる。従って、従来不可欠であった導光のた
めの薄板等は不要となる。
【００１６】また、従来例による導光のための薄板は接
着剤とは別体であったが、本実施例においては接着剤
２’自体に導光性をもたせているので、紫外光による硬
化性が従来よりも優れている。従って、従来の接着剤に
加えていた嫌気硬化性、熱硬化性を持たせる必要がなく
なる。このように、接着剤に紫外光を透過するビーズ６
を混入するという簡単な方法で接着剤２’の均一な硬化
を安定して行え、従来不可欠であった導光のための薄板
等を接合部に設けるといった工程を削除できるととも
に、接着剤には嫌気硬化性、熱硬化性を加える必要もな
くなるので、工程の簡略化、コストダウンを図れる。
【００１７】図２及び図３は本発明の他の実施例であ
る。図２（ａ）及び（ｂ）は基板部に半導体素子部を接
着する工程を示す斜視図、図３は図２（ｂ）のＡ面断面
図である。
【００１８】ここでは、図１の実施例と異なる点につい
てのみ説明する。
【００１９】本実施例は図２（ａ）に示すように、基板
部１０に接着剤２’を塗布した後、図２（ｂ）に示すよ
うに基板部１０とほぼ同じ大きさの半導体素子部１１を
搭載し、押圧して固定するものである。以下、紫外光を
照射して硬化させる工程は図１の実施例と同一である。
本実施例の特徴は、図３に示すようにビーズ６の直径が
基板部１０と半導体素子部１１との間隙分となっている
点である。このように、ビーズ６の直径を必要とする基
板部１０，半導体素子部１１間の間隙と同一とすること
によって、間隙の距離を調整機器等を使用する事なく容
易に確保できる。
【００２０】なお、図１の実施例では、ビーズ６の形状
として球形のものを用いたが、たとえば、半球状や微小
な短冊形状でもよい。また、基板上に半導体ペレットを
接着、接合させる例を示しているが、基板の代わりにリ
ードフレーム、ステムを、また半導体ペレットの代わり
にＣ，Ｒ，Ｌ等の小型電子部品を接着、接合させる場合
でも同様である。また、図１乃至図３の実施例におい
て、樹脂の塗布方法としてディスペンス方式を用いた
が、この他にスタンピング方式でもよい。
【００２１】
【発明の効果】以上のように本発明によれば、ＵＶ硬化
樹脂接着剤によって半導体素子を基板等に接着する際、
紫外光がＵＶ硬化樹脂接着剤に十分導光される構造が非
常に容易に得られ、コストダウンを図れる。
【図面の簡単な説明】
【図１】（ａ）乃至（ｃ）は本発明の一実施例による半
導体素子の基板接着方法を示す断面図である。
【図２】（ａ）及び（ｂ）は、本発明の他の実施例によ
る半導体素子の基板接着方法を示す斜視図である。
【図３】本発明の他の実施例による接着方法による半導
体素子の基板接着状態を示す断面図である。
【図４】（ａ）及び（ｂ）は従来例による半導体素子の
基板接着方法を示す断面図である。
【符号の説明】
１ 基板 ２’ ＵＶ硬化樹脂接着剤 ６ ビーズ ８ 受光素子（半導体素子）

Claims (1)

    【特許請求の範囲】
  1. 【請求項１】 基板に半導体素子をＵＶ硬化樹脂接着剤
    を用いて接着する半導体素子の基板接着構造において、
    前記ＵＶ硬化樹脂接着剤に予め紫外光を透過するビーズ
    を混入してなることを特徴とする半導体素子の基板接着
    構造。
JP5063655A 1993-03-23 1993-03-23 半導体素子の基板接着構造 Pending JPH06275661A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5063655A JPH06275661A (ja) 1993-03-23 1993-03-23 半導体素子の基板接着構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5063655A JPH06275661A (ja) 1993-03-23 1993-03-23 半導体素子の基板接着構造

Publications (1)

Publication Number Publication Date
JPH06275661A true JPH06275661A (ja) 1994-09-30

Family

ID=13235584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5063655A Pending JPH06275661A (ja) 1993-03-23 1993-03-23 半導体素子の基板接着構造

Country Status (1)

Country Link
JP (1) JPH06275661A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011023683A1 (de) * 2009-08-28 2011-03-03 Eads Deutschland Gmbh Verfahren zum fügen von mindestens zwei bauteilen unter verwendung einer dualhärtenden klebstoffzusammensetzung
JP2012227436A (ja) * 2011-04-21 2012-11-15 Denso Corp 半導体装置の製造方法及び半導体装置
EP3039091A1 (en) * 2013-08-28 2016-07-06 Corning Incorporated Adhesive with embedded waveguides for curing

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011023683A1 (de) * 2009-08-28 2011-03-03 Eads Deutschland Gmbh Verfahren zum fügen von mindestens zwei bauteilen unter verwendung einer dualhärtenden klebstoffzusammensetzung
DE102009039029B4 (de) * 2009-08-28 2018-09-27 Airbus Defence and Space GmbH Verfahren zum Fügen von mindestens zwei Bauteilen unter Verwendung einer dualhärtenden Klebstoffzusammensetzung
JP2012227436A (ja) * 2011-04-21 2012-11-15 Denso Corp 半導体装置の製造方法及び半導体装置
EP3039091A1 (en) * 2013-08-28 2016-07-06 Corning Incorporated Adhesive with embedded waveguides for curing
JP2016534206A (ja) * 2013-08-28 2016-11-04 コーニング インコーポレイテッド 硬化用導波路が埋め込まれた接着剤

Similar Documents

Publication Publication Date Title
US11901331B2 (en) Adhesive bonding composition and electronic components prepared from the same
CN102186937B (zh) 粘合方法、粘合结构、光学模块的制造方法和光学模块
JP2020519000A (ja) 接着剤ボンディング組成物及びこれから作製される電子部品
US20090039291A1 (en) Mounting method, electric part-mounted substrate and an electric device
CN102829050B (zh) 使用可变功率紫外线固化粘合剂提高对位精度的方法
KR20100109965A (ko) 플라스틱의 접착 방법
JPH0328281A (ja) 基体の接合又は注封方法およびその実施装置
JPH06275661A (ja) 半導体素子の基板接着構造
JPH07263382A (ja) ウェーハ固定用テープ
JPS6363773A (ja) 接着方法
EP3318390A1 (en) Bonded body and method for producing bonded body
JPH1036777A (ja) 紫外線硬化樹脂による接着方法
JPH11224884A (ja) 電気回路の封止構造体およびその製造方法
JPS61250902A (ja) 光照射装置
JP2937429B2 (ja) イメージセンサの製造方法
JPH0721254Y2 (ja) 紫外線硬化型樹脂材料の塗付兼硬化装置
CN114265233A (zh) 一种可弯折高色域发光模块和背光装置以及固化步骤
JPH06327175A (ja) 実装電子部品及びその実装方法
JPS60116151A (ja) 電子部品の封止法
JP2004327531A (ja) 撮像装置
RU1774396C (ru) Способ приклеивани полупроводниковых материалов
JPH06331869A (ja) 光学装置とその製造方法
JPH11233537A (ja) 樹脂封止方法
JPS589848A (ja) 携帯時計側のガラス接着方法
JPH0442205A (ja) 光学レンズの保持構造