JPH0626223B2 - マイクロエレクトロニツクス半導体回路および積層回路を封止するための方法 - Google Patents

マイクロエレクトロニツクス半導体回路および積層回路を封止するための方法

Info

Publication number
JPH0626223B2
JPH0626223B2 JP60505156A JP50515685A JPH0626223B2 JP H0626223 B2 JPH0626223 B2 JP H0626223B2 JP 60505156 A JP60505156 A JP 60505156A JP 50515685 A JP50515685 A JP 50515685A JP H0626223 B2 JPH0626223 B2 JP H0626223B2
Authority
JP
Japan
Prior art keywords
layer
foil
microelectronic
synthetic material
sealable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60505156A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62500900A (ja
Inventor
メーレル・ウエルネル
グラフ・フオン・リユ‐テイツヒアウ・ハラルト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
METSUSAASHUMITSUTO BERUKO BUROOMU GmbH
Original Assignee
METSUSAASHUMITSUTO BERUKO BUROOMU GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by METSUSAASHUMITSUTO BERUKO BUROOMU GmbH filed Critical METSUSAASHUMITSUTO BERUKO BUROOMU GmbH
Publication of JPS62500900A publication Critical patent/JPS62500900A/ja
Publication of JPH0626223B2 publication Critical patent/JPH0626223B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W74/121—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H10W74/01—
    • H10W74/114—
    • H10W72/5363—
    • H10W72/5522—
    • H10W72/5524—
    • H10W74/00—
    • H10W90/754—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
JP60505156A 1984-11-17 1985-11-18 マイクロエレクトロニツクス半導体回路および積層回路を封止するための方法 Expired - Lifetime JPH0626223B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE3442131.9 1984-11-17
DE19843442131 DE3442131A1 (de) 1984-11-17 1984-11-17 Verfahren zum einkapseln von mikroelektronischen halbleiter- und schichtschaltungen
PCT/DE1985/000475 WO1986003055A1 (en) 1984-11-17 1985-11-18 Process for encapsulating micro-electronic semi-conductor and layer-type circuits

Publications (2)

Publication Number Publication Date
JPS62500900A JPS62500900A (ja) 1987-04-09
JPH0626223B2 true JPH0626223B2 (ja) 1994-04-06

Family

ID=6250592

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60505156A Expired - Lifetime JPH0626223B2 (ja) 1984-11-17 1985-11-18 マイクロエレクトロニツクス半導体回路および積層回路を封止するための方法

Country Status (5)

Country Link
US (1) US4784872A (OSRAM)
EP (1) EP0202279B1 (OSRAM)
JP (1) JPH0626223B2 (OSRAM)
DE (1) DE3442131A1 (OSRAM)
WO (1) WO1986003055A1 (OSRAM)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11914293B2 (en) 2017-01-31 2024-02-27 Flint Group Germany Gmbh Radiatioin-curable mixture containing low-functionalised, partially saponified polyvinyl acetate

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DE4027478A1 (de) * 1990-08-30 1992-03-05 Robert Dipl Ing Michaelides Schaltungsaufbau und herstellungsverfahren
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US5368899A (en) * 1992-02-28 1994-11-29 Delco Electronics Corp. Automatic vertical dip coater with simultaneous ultraviolet cure
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US5390082A (en) * 1992-07-06 1995-02-14 International Business Machines, Corp. Chip carrier with protective coating for circuitized surface
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US7084656B1 (en) 1993-11-16 2006-08-01 Formfactor, Inc. Probe for semiconductor devices
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US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US7200930B2 (en) 1994-11-15 2007-04-10 Formfactor, Inc. Probe for semiconductor devices
GB2295722B (en) * 1994-11-30 1997-12-17 Motorola Ltd Method of packaging integrated circuits
JPH09155918A (ja) * 1995-12-07 1997-06-17 Matsushita Electric Ind Co Ltd 樹脂封止電子製品の製造方法
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
DE69718693T2 (de) * 1996-03-08 2003-11-27 Matsushita Electric Industrial Co., Ltd. Elektronisches Bauteil und Herstellungsverfahren
DE19736090B4 (de) * 1997-08-20 2005-04-14 Daimlerchrysler Ag Bauelement mit Schutzschicht und Verfahren zur Herstellung einer Schutzschicht für ein Bauelement
US6138349A (en) 1997-12-18 2000-10-31 Vlt Corporation Protective coating for an electronic device
US5987358A (en) * 1998-02-17 1999-11-16 Intermedics, Inc. Semiconductor device packaging and method of fabrication
US6194290B1 (en) * 1998-03-09 2001-02-27 Intersil Corporation Methods for making semiconductor devices by low temperature direct bonding
JP2000219234A (ja) * 1999-01-29 2000-08-08 Bridgestone Sports Co Ltd ゴルフボール用箱
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US6589802B1 (en) * 1999-12-24 2003-07-08 Hitachi, Ltd. Packaging structure and method of packaging electronic parts
DE10049288B4 (de) * 2000-10-04 2004-07-15 Infineon Technologies Ag Elektronische Bauteile und eine Folienband zum Verpacken von Bonddrahtverbindungen elektronischer Bauteile sowie deren Herstellungsverfahren
FR2819935B1 (fr) * 2001-01-19 2003-04-25 Ela Medical Sa Procede de fabrication de circuits electroniques hybrides pour dispositifs medicaux implantables actifs
US6444501B1 (en) * 2001-06-12 2002-09-03 Micron Technology, Inc. Two stage transfer molding method to encapsulate MMC module
US20060182952A1 (en) * 2002-01-08 2006-08-17 Justo Roger J Encapsulated thermally conductive electrically insulating assembly and method to prepare same
DE10216652A1 (de) * 2002-04-15 2003-10-23 Orga Kartensysteme Gmbh Spritzgussverfahren zur Herstellung einer Chipkarte und nach diesem Verfahren hergestellte Chipkarte
DE10303449B4 (de) * 2003-01-29 2007-04-26 Siemens Ag Verfahren zum Umhüllen eines elektronischen Bauelementes
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法
DE102004049955B4 (de) * 2004-10-13 2008-12-04 Schott Ag Verfahren zur Herstellung eines optischen Bauelements, insbesondere einer OLED
US7523546B2 (en) * 2005-05-04 2009-04-28 Nokia Corporation Method for manufacturing a composite layer for an electronic device
US20080087323A1 (en) * 2005-05-09 2008-04-17 Kenji Araki Concentrator Solar Photovoltaic Power Generating Apparatus
DE102005041100A1 (de) * 2005-08-30 2007-03-08 Siemens Ag Halbleiterstruktur mit einem lateral funktionalen Aufbau
DE202006020507U1 (de) 2006-03-20 2008-10-30 Kromberg & Schubert Gmbh & Co. Kg Umhülltes Bauelement
US8051557B2 (en) * 2006-03-31 2011-11-08 Princo Corp. Substrate with multi-layer interconnection structure and method of manufacturing the same
DE102007035181B4 (de) * 2007-07-27 2011-11-10 Epcos Ag Verfahren zur Herstellung eines Moduls und Modul
US8957509B2 (en) * 2011-06-23 2015-02-17 Stats Chippac Ltd. Integrated circuit packaging system with thermal emission and method of manufacture thereof
JP2013055150A (ja) * 2011-09-01 2013-03-21 Toshiba Corp 半導体装置及びその製造方法
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JP2020515431A (ja) 2017-03-27 2020-05-28 フリント グループ ジャーマニー ゲーエムベーハー 画像レリーフ構造の製造方法
CN108401367B (zh) * 2018-02-26 2020-08-14 广州致远电子有限公司 塑封电子模块及其制作方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11914293B2 (en) 2017-01-31 2024-02-27 Flint Group Germany Gmbh Radiatioin-curable mixture containing low-functionalised, partially saponified polyvinyl acetate

Also Published As

Publication number Publication date
DE3442131A1 (de) 1986-05-22
JPS62500900A (ja) 1987-04-09
WO1986003055A1 (en) 1986-05-22
DE3442131C2 (OSRAM) 1988-12-01
EP0202279A1 (de) 1986-11-26
EP0202279B1 (de) 1989-08-02
US4784872A (en) 1988-11-15

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