JPH058574B2 - - Google Patents

Info

Publication number
JPH058574B2
JPH058574B2 JP59017443A JP1744384A JPH058574B2 JP H058574 B2 JPH058574 B2 JP H058574B2 JP 59017443 A JP59017443 A JP 59017443A JP 1744384 A JP1744384 A JP 1744384A JP H058574 B2 JPH058574 B2 JP H058574B2
Authority
JP
Japan
Prior art keywords
semiconductor pellet
stage
suction
semiconductor
deviation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59017443A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60161630A (ja
Inventor
Hitoshi Shirata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Toshiba Electronic Device Solutions Corp
Original Assignee
Toshiba Corp
Toshiba Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Microelectronics Corp filed Critical Toshiba Corp
Priority to JP1744384A priority Critical patent/JPS60161630A/ja
Publication of JPS60161630A publication Critical patent/JPS60161630A/ja
Publication of JPH058574B2 publication Critical patent/JPH058574B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Control Of Position Or Direction (AREA)
JP1744384A 1984-02-02 1984-02-02 半導体ペレツト位置決め装置 Granted JPS60161630A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1744384A JPS60161630A (ja) 1984-02-02 1984-02-02 半導体ペレツト位置決め装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1744384A JPS60161630A (ja) 1984-02-02 1984-02-02 半導体ペレツト位置決め装置

Publications (2)

Publication Number Publication Date
JPS60161630A JPS60161630A (ja) 1985-08-23
JPH058574B2 true JPH058574B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1993-02-02

Family

ID=11944165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1744384A Granted JPS60161630A (ja) 1984-02-02 1984-02-02 半導体ペレツト位置決め装置

Country Status (1)

Country Link
JP (1) JPS60161630A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0810711B2 (ja) * 1986-10-15 1996-01-31 ニチデン機械株式会社 微小ワ−ク片の認識方法
JPS63196056A (ja) * 1987-02-10 1988-08-15 Mitsubishi Electric Corp 半導体組立装置
WO2001017005A1 (en) * 1999-08-27 2001-03-08 Matsushita Electric Industrial Co., Ltd. Method and apparatus for handling arranged part
CH698719B1 (de) * 2007-02-06 2009-10-15 Oerlikon Assembly Equipment Ag Verfahren für die Montage von Halbleiterchips auf einem Substrat.
GB2525616A (en) * 2014-04-29 2015-11-04 Nissan Motor Mfg Uk Ltd Vehicle, striker assembly and damper

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS499171U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1972-04-26 1974-01-25
JPS57159246U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1981-03-30 1982-10-06

Also Published As

Publication number Publication date
JPS60161630A (ja) 1985-08-23

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term