JPH0582977B2 - - Google Patents
Info
- Publication number
- JPH0582977B2 JPH0582977B2 JP61075453A JP7545386A JPH0582977B2 JP H0582977 B2 JPH0582977 B2 JP H0582977B2 JP 61075453 A JP61075453 A JP 61075453A JP 7545386 A JP7545386 A JP 7545386A JP H0582977 B2 JPH0582977 B2 JP H0582977B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- leads
- lead member
- semiconductor element
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000011888 foil Substances 0.000 claims description 5
- 239000002985 plastic film Substances 0.000 claims description 5
- 229920006255 plastic film Polymers 0.000 claims description 5
- 238000000034 method Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7545386A JPS62232948A (ja) | 1986-04-03 | 1986-04-03 | リ−ドフレ−ム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7545386A JPS62232948A (ja) | 1986-04-03 | 1986-04-03 | リ−ドフレ−ム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62232948A JPS62232948A (ja) | 1987-10-13 |
JPH0582977B2 true JPH0582977B2 (US07714131-20100511-C00024.png) | 1993-11-24 |
Family
ID=13576714
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7545386A Granted JPS62232948A (ja) | 1986-04-03 | 1986-04-03 | リ−ドフレ−ム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62232948A (US07714131-20100511-C00024.png) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01137661A (ja) * | 1987-11-24 | 1989-05-30 | Nec Corp | リードフレーム |
JPH01238151A (ja) * | 1988-03-18 | 1989-09-22 | Nec Corp | 半導体装置用リードフレーム |
JPH02278757A (ja) * | 1989-04-19 | 1990-11-15 | Nec Corp | 混成集積回路 |
JPH0821673B2 (ja) * | 1989-08-31 | 1996-03-04 | 株式会社三井ハイテック | リードフレーム,これを用いた半導体装置およびその製造方法 |
US5227662A (en) * | 1990-05-24 | 1993-07-13 | Nippon Steel Corporation | Composite lead frame and semiconductor device using the same |
JPH0515448U (ja) * | 1991-07-31 | 1993-02-26 | 住友金属工業株式会社 | セラミツクパツケージ |
JP2846181B2 (ja) * | 1991-09-09 | 1999-01-13 | 日立電線株式会社 | 複合リードフレームの製造方法 |
JP2601079B2 (ja) * | 1991-10-31 | 1997-04-16 | 日立電線株式会社 | 複合リードフレーム |
JPH0878599A (ja) * | 1994-09-05 | 1996-03-22 | Goto Seisakusho:Kk | 集積回路パッケージ及びその製造方法 |
JP2009231425A (ja) * | 2008-03-21 | 2009-10-08 | Toppan Printing Co Ltd | テープ基板貼り合わせ構造体及び半導体装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52154358A (en) * | 1976-06-18 | 1977-12-22 | Hitachi Ltd | Production of semiconductor device |
JPS5310269B2 (US07714131-20100511-C00024.png) * | 1974-10-15 | 1978-04-12 | ||
JPS54118170A (en) * | 1978-02-28 | 1979-09-13 | Amp Inc | Electric connector used to mount electronic device at substrate |
JPS5521128A (en) * | 1978-08-02 | 1980-02-15 | Hitachi Ltd | Lead frame used for semiconductor device and its assembling |
JPS58122763A (ja) * | 1982-01-14 | 1983-07-21 | Toshiba Corp | 樹脂封止型半導体装置 |
JPS5998545A (ja) * | 1982-11-26 | 1984-06-06 | Hitachi Ltd | 半導体装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5090569U (US07714131-20100511-C00024.png) * | 1973-12-20 | 1975-07-31 | ||
JPS5310269U (US07714131-20100511-C00024.png) * | 1976-07-09 | 1978-01-27 | ||
JPS5895657U (ja) * | 1981-12-23 | 1983-06-29 | 日本電気株式会社 | 集積回路用リ−ドフレ−ム |
-
1986
- 1986-04-03 JP JP7545386A patent/JPS62232948A/ja active Granted
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5310269B2 (US07714131-20100511-C00024.png) * | 1974-10-15 | 1978-04-12 | ||
JPS52154358A (en) * | 1976-06-18 | 1977-12-22 | Hitachi Ltd | Production of semiconductor device |
JPS54118170A (en) * | 1978-02-28 | 1979-09-13 | Amp Inc | Electric connector used to mount electronic device at substrate |
JPS5521128A (en) * | 1978-08-02 | 1980-02-15 | Hitachi Ltd | Lead frame used for semiconductor device and its assembling |
JPS58122763A (ja) * | 1982-01-14 | 1983-07-21 | Toshiba Corp | 樹脂封止型半導体装置 |
JPS5998545A (ja) * | 1982-11-26 | 1984-06-06 | Hitachi Ltd | 半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS62232948A (ja) | 1987-10-13 |
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