JPH0582859B2 - - Google Patents
Info
- Publication number
- JPH0582859B2 JPH0582859B2 JP60276413A JP27641385A JPH0582859B2 JP H0582859 B2 JPH0582859 B2 JP H0582859B2 JP 60276413 A JP60276413 A JP 60276413A JP 27641385 A JP27641385 A JP 27641385A JP H0582859 B2 JPH0582859 B2 JP H0582859B2
- Authority
- JP
- Japan
- Prior art keywords
- electrical component
- acid
- polyester
- weight
- units
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27641385A JPS62135516A (ja) | 1985-12-09 | 1985-12-09 | 電気部品封止剤 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27641385A JPS62135516A (ja) | 1985-12-09 | 1985-12-09 | 電気部品封止剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62135516A JPS62135516A (ja) | 1987-06-18 |
JPH0582859B2 true JPH0582859B2 (enrdf_load_stackoverflow) | 1993-11-22 |
Family
ID=17569059
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27641385A Granted JPS62135516A (ja) | 1985-12-09 | 1985-12-09 | 電気部品封止剤 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62135516A (enrdf_load_stackoverflow) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100604740B1 (ko) * | 2000-03-02 | 2006-07-26 | 주식회사 코오롱 | 폴리에스테르계 수지 조성물 |
US7781057B2 (en) * | 2005-06-14 | 2010-08-24 | Siemens Energy, Inc. | Seeding resins for enhancing the crystallinity of polymeric substructures |
JP5337526B2 (ja) * | 2009-02-24 | 2013-11-06 | 国立大学法人 東京大学 | 金属と樹脂との接着方法、及びそれを用いた回路形成部品の製法、並びに回路形成部品 |
JP5810636B2 (ja) * | 2010-06-28 | 2015-11-11 | 東レ株式会社 | 液晶性樹脂組成物およびその製造方法 |
JP5795168B2 (ja) * | 2011-02-07 | 2015-10-14 | 明和化成株式会社 | 熱伝導性樹脂組成物及び半導体パッケージ |
JP5949078B2 (ja) * | 2012-04-11 | 2016-07-06 | 東洋紡株式会社 | 電気電子部品封止材用ポリエステル樹脂組成物、電気電子部品封止体の製造方法および電気電子部品封止体 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5617383B2 (enrdf_load_stackoverflow) * | 1973-04-03 | 1981-04-22 | ||
JPS5745783B2 (enrdf_load_stackoverflow) * | 1973-10-09 | 1982-09-29 | ||
JPS5122754A (ja) * | 1974-08-20 | 1976-02-23 | Sumitomo Chemical Co | Horiariirenesuteruno anteikahoho |
JPS51103958A (ja) * | 1975-03-11 | 1976-09-14 | Unitika Ltd | Hokozokuhoriesuterunoanteikahoho |
JPS5717153A (en) * | 1980-07-04 | 1982-01-28 | Asahi Glass Co Ltd | Sealing method of electronic parts |
JPS5893759A (ja) * | 1981-12-01 | 1983-06-03 | Toray Ind Inc | 樹脂成形品 |
JPS58191743A (ja) * | 1982-05-06 | 1983-11-09 | Toray Ind Inc | ポリアリレンエステル組成物 |
JPS58225117A (ja) * | 1982-06-21 | 1983-12-27 | Toyobo Co Ltd | 封止用エポキシ樹脂成形材料 |
JPS5933355A (ja) * | 1982-08-18 | 1984-02-23 | Kanegafuchi Chem Ind Co Ltd | 樹脂組成物 |
JPS6040163A (ja) * | 1983-07-27 | 1985-03-02 | ヘキスト・セラニーズ・コーポレーション | 電子部品の改良封入成形法 |
JPS6040143A (ja) * | 1983-08-12 | 1985-03-02 | Kuraray Co Ltd | 制振材用樹脂組成物 |
JPS6254A (ja) * | 1985-03-08 | 1987-01-06 | Kanebo Ltd | 新規グアニジノメチルシクロヘキサンカルボン酸誘導体および該化合物を有効成分とする抗潰瘍薬 |
JPS6234949A (ja) * | 1985-08-08 | 1987-02-14 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物 |
JPS62112622A (ja) * | 1985-11-11 | 1987-05-23 | Toshiba Chem Corp | 封止用樹脂組成物 |
-
1985
- 1985-12-09 JP JP27641385A patent/JPS62135516A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62135516A (ja) | 1987-06-18 |
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