JPS62135516A - 電気部品封止剤 - Google Patents

電気部品封止剤

Info

Publication number
JPS62135516A
JPS62135516A JP27641385A JP27641385A JPS62135516A JP S62135516 A JPS62135516 A JP S62135516A JP 27641385 A JP27641385 A JP 27641385A JP 27641385 A JP27641385 A JP 27641385A JP S62135516 A JPS62135516 A JP S62135516A
Authority
JP
Japan
Prior art keywords
electrical component
inorganic powder
acid
component sealant
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27641385A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0582859B2 (enrdf_load_stackoverflow
Inventor
Kenji Hijikata
健二 土方
Toshio Shikae
鹿江　敏夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Polyplastics Co Ltd
Original Assignee
Polyplastics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyplastics Co Ltd filed Critical Polyplastics Co Ltd
Priority to JP27641385A priority Critical patent/JPS62135516A/ja
Publication of JPS62135516A publication Critical patent/JPS62135516A/ja
Publication of JPH0582859B2 publication Critical patent/JPH0582859B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP27641385A 1985-12-09 1985-12-09 電気部品封止剤 Granted JPS62135516A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27641385A JPS62135516A (ja) 1985-12-09 1985-12-09 電気部品封止剤

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27641385A JPS62135516A (ja) 1985-12-09 1985-12-09 電気部品封止剤

Publications (2)

Publication Number Publication Date
JPS62135516A true JPS62135516A (ja) 1987-06-18
JPH0582859B2 JPH0582859B2 (enrdf_load_stackoverflow) 1993-11-22

Family

ID=17569059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27641385A Granted JPS62135516A (ja) 1985-12-09 1985-12-09 電気部品封止剤

Country Status (1)

Country Link
JP (1) JPS62135516A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100604740B1 (ko) * 2000-03-02 2006-07-26 주식회사 코오롱 폴리에스테르계 수지 조성물
JP2009532557A (ja) * 2006-04-03 2009-09-10 シーメンス エナジー インコーポレイテッド ポリマー基礎構造の結晶化度を向上させるためのシーディング樹脂
JP2010199174A (ja) * 2009-02-24 2010-09-09 Univ Of Tokyo 金属と樹脂との接着方法、及びそれを用いた回路形成部品の製法、並びに回路形成部品
JP2012031391A (ja) * 2010-06-28 2012-02-16 Toray Ind Inc 液晶性樹脂組成物およびその製造方法
JP2012162650A (ja) * 2011-02-07 2012-08-30 Meiwa Kasei Kk 熱伝導性樹脂組成物及び半導体パッケージ
JP2013216818A (ja) * 2012-04-11 2013-10-24 Toyobo Co Ltd 電気電子部品封止材用ポリエステル樹脂組成物、電気電子部品封止体の製造方法および電気電子部品封止体

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49125461A (enrdf_load_stackoverflow) * 1973-04-03 1974-11-30
JPS5064351A (enrdf_load_stackoverflow) * 1973-10-09 1975-05-31
JPS5122754A (ja) * 1974-08-20 1976-02-23 Sumitomo Chemical Co Horiariirenesuteruno anteikahoho
JPS51103958A (ja) * 1975-03-11 1976-09-14 Unitika Ltd Hokozokuhoriesuterunoanteikahoho
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
JPS5893759A (ja) * 1981-12-01 1983-06-03 Toray Ind Inc 樹脂成形品
JPS58191743A (ja) * 1982-05-06 1983-11-09 Toray Ind Inc ポリアリレンエステル組成物
JPS58225117A (ja) * 1982-06-21 1983-12-27 Toyobo Co Ltd 封止用エポキシ樹脂成形材料
JPS5933355A (ja) * 1982-08-18 1984-02-23 Kanegafuchi Chem Ind Co Ltd 樹脂組成物
JPS6040163A (ja) * 1983-07-27 1985-03-02 ヘキスト・セラニーズ・コーポレーション 電子部品の改良封入成形法
JPS6040143A (ja) * 1983-08-12 1985-03-02 Kuraray Co Ltd 制振材用樹脂組成物
JPS6254A (ja) * 1985-03-08 1987-01-06 Kanebo Ltd 新規グアニジノメチルシクロヘキサンカルボン酸誘導体および該化合物を有効成分とする抗潰瘍薬
JPS6234949A (ja) * 1985-08-08 1987-02-14 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPS62112622A (ja) * 1985-11-11 1987-05-23 Toshiba Chem Corp 封止用樹脂組成物

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49125461A (enrdf_load_stackoverflow) * 1973-04-03 1974-11-30
JPS5064351A (enrdf_load_stackoverflow) * 1973-10-09 1975-05-31
JPS5122754A (ja) * 1974-08-20 1976-02-23 Sumitomo Chemical Co Horiariirenesuteruno anteikahoho
JPS51103958A (ja) * 1975-03-11 1976-09-14 Unitika Ltd Hokozokuhoriesuterunoanteikahoho
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
JPS5893759A (ja) * 1981-12-01 1983-06-03 Toray Ind Inc 樹脂成形品
JPS58191743A (ja) * 1982-05-06 1983-11-09 Toray Ind Inc ポリアリレンエステル組成物
JPS58225117A (ja) * 1982-06-21 1983-12-27 Toyobo Co Ltd 封止用エポキシ樹脂成形材料
JPS5933355A (ja) * 1982-08-18 1984-02-23 Kanegafuchi Chem Ind Co Ltd 樹脂組成物
JPS6040163A (ja) * 1983-07-27 1985-03-02 ヘキスト・セラニーズ・コーポレーション 電子部品の改良封入成形法
JPS6040143A (ja) * 1983-08-12 1985-03-02 Kuraray Co Ltd 制振材用樹脂組成物
JPS6254A (ja) * 1985-03-08 1987-01-06 Kanebo Ltd 新規グアニジノメチルシクロヘキサンカルボン酸誘導体および該化合物を有効成分とする抗潰瘍薬
JPS6234949A (ja) * 1985-08-08 1987-02-14 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物
JPS62112622A (ja) * 1985-11-11 1987-05-23 Toshiba Chem Corp 封止用樹脂組成物

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100604740B1 (ko) * 2000-03-02 2006-07-26 주식회사 코오롱 폴리에스테르계 수지 조성물
JP2009532557A (ja) * 2006-04-03 2009-09-10 シーメンス エナジー インコーポレイテッド ポリマー基礎構造の結晶化度を向上させるためのシーディング樹脂
JP2010199174A (ja) * 2009-02-24 2010-09-09 Univ Of Tokyo 金属と樹脂との接着方法、及びそれを用いた回路形成部品の製法、並びに回路形成部品
JP2012031391A (ja) * 2010-06-28 2012-02-16 Toray Ind Inc 液晶性樹脂組成物およびその製造方法
JP2012162650A (ja) * 2011-02-07 2012-08-30 Meiwa Kasei Kk 熱伝導性樹脂組成物及び半導体パッケージ
JP2013216818A (ja) * 2012-04-11 2013-10-24 Toyobo Co Ltd 電気電子部品封止材用ポリエステル樹脂組成物、電気電子部品封止体の製造方法および電気電子部品封止体

Also Published As

Publication number Publication date
JPH0582859B2 (enrdf_load_stackoverflow) 1993-11-22

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