JPH0575581B2 - - Google Patents

Info

Publication number
JPH0575581B2
JPH0575581B2 JP23826888A JP23826888A JPH0575581B2 JP H0575581 B2 JPH0575581 B2 JP H0575581B2 JP 23826888 A JP23826888 A JP 23826888A JP 23826888 A JP23826888 A JP 23826888A JP H0575581 B2 JPH0575581 B2 JP H0575581B2
Authority
JP
Japan
Prior art keywords
weight
metal foil
epoxy resin
phenolic hydroxyl
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP23826888A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0286434A (ja
Inventor
Masayuki Noda
Kenichi Karya
Takahiro Yamaguchi
Katsuharu Takahashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Shin Kobe Electric Machinery Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Kobe Electric Machinery Co Ltd filed Critical Shin Kobe Electric Machinery Co Ltd
Priority to JP23826888A priority Critical patent/JPH0286434A/ja
Publication of JPH0286434A publication Critical patent/JPH0286434A/ja
Publication of JPH0575581B2 publication Critical patent/JPH0575581B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
JP23826888A 1988-09-22 1988-09-22 金属箔張り積層板の製造法 Granted JPH0286434A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23826888A JPH0286434A (ja) 1988-09-22 1988-09-22 金属箔張り積層板の製造法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23826888A JPH0286434A (ja) 1988-09-22 1988-09-22 金属箔張り積層板の製造法

Publications (2)

Publication Number Publication Date
JPH0286434A JPH0286434A (ja) 1990-03-27
JPH0575581B2 true JPH0575581B2 (enrdf_load_html_response) 1993-10-20

Family

ID=17027656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23826888A Granted JPH0286434A (ja) 1988-09-22 1988-09-22 金属箔張り積層板の製造法

Country Status (1)

Country Link
JP (1) JPH0286434A (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20210147614A1 (en) * 2018-04-20 2021-05-20 Mitsubishi Gas Chemical Company, Inc. Thermosetting composition, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board

Also Published As

Publication number Publication date
JPH0286434A (ja) 1990-03-27

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