JPH0573346B2 - - Google Patents

Info

Publication number
JPH0573346B2
JPH0573346B2 JP63331141A JP33114188A JPH0573346B2 JP H0573346 B2 JPH0573346 B2 JP H0573346B2 JP 63331141 A JP63331141 A JP 63331141A JP 33114188 A JP33114188 A JP 33114188A JP H0573346 B2 JPH0573346 B2 JP H0573346B2
Authority
JP
Japan
Prior art keywords
wafer
arm
notch
roller
drive roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP63331141A
Other languages
English (en)
Japanese (ja)
Other versions
JPH02178947A (ja
Inventor
Kazuo Shimane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP63331141A priority Critical patent/JPH02178947A/ja
Priority to US07/452,589 priority patent/US5028200A/en
Priority to EP89123662A priority patent/EP0376160B1/en
Priority to DE68913481T priority patent/DE68913481T2/de
Priority to KR1019890019892A priority patent/KR930004631B1/ko
Publication of JPH02178947A publication Critical patent/JPH02178947A/ja
Publication of JPH0573346B2 publication Critical patent/JPH0573346B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP63331141A 1988-12-29 1988-12-29 半導体ウェーハのノッチ合わせ機構 Granted JPH02178947A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP63331141A JPH02178947A (ja) 1988-12-29 1988-12-29 半導体ウェーハのノッチ合わせ機構
US07/452,589 US5028200A (en) 1988-12-29 1989-12-19 Wafer positioning mechanism using a notch formed on the wafer periphery
EP89123662A EP0376160B1 (en) 1988-12-29 1989-12-21 Wafer positioning mechanisms for notched wafers
DE68913481T DE68913481T2 (de) 1988-12-29 1989-12-21 Wafer-Positionierungsmechanismus für gekerbte Wafer.
KR1019890019892A KR930004631B1 (ko) 1988-12-29 1989-12-28 웨이퍼 주위에 형성된 노치(notch)를 사용하는 웨이퍼 위치설정기구

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63331141A JPH02178947A (ja) 1988-12-29 1988-12-29 半導体ウェーハのノッチ合わせ機構

Publications (2)

Publication Number Publication Date
JPH02178947A JPH02178947A (ja) 1990-07-11
JPH0573346B2 true JPH0573346B2 (en:Method) 1993-10-14

Family

ID=18240330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63331141A Granted JPH02178947A (ja) 1988-12-29 1988-12-29 半導体ウェーハのノッチ合わせ機構

Country Status (5)

Country Link
US (1) US5028200A (en:Method)
EP (1) EP0376160B1 (en:Method)
JP (1) JPH02178947A (en:Method)
KR (1) KR930004631B1 (en:Method)
DE (1) DE68913481T2 (en:Method)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5383759A (en) * 1993-08-20 1995-01-24 Lin; Gaille Low particle wafer automatic flat aligner
US6003185A (en) * 1994-07-15 1999-12-21 Ontrak Systems, Inc. Hesitation free roller
US5614914A (en) * 1994-09-06 1997-03-25 Interdigital Technology Corporation Wireless telephone distribution system with time and space diversity transmission for determining receiver location
US5862560A (en) * 1996-08-29 1999-01-26 Ontrak Systems, Inc. Roller with treading and system including the same
JP3439607B2 (ja) * 1996-09-04 2003-08-25 東京エレクトロン株式会社 ノッチ整列装置
US5853284A (en) * 1996-09-24 1998-12-29 Kaijo Corporation Notched wafer aligning apparatus
DE19729714C2 (de) * 1997-07-11 2002-11-07 Brooks Automation Gmbh Vorrichtung und Verfahren zur Orientierung von kreisförmigen Substraten
FR2778496B1 (fr) * 1998-05-05 2002-04-19 Recif Sa Procede et dispositif de changement de position d'une plaque de semi-conducteur
JP3610426B2 (ja) * 1998-06-04 2005-01-12 東京エレクトロン株式会社 基板姿勢制御装置
US6270307B1 (en) * 1999-01-25 2001-08-07 Chartered Semiconductor Manufacturing Company Method for aligning wafers in a cassette
JP4109371B2 (ja) * 1999-01-28 2008-07-02 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェハ
GB2380602B (en) * 2001-05-19 2005-03-02 Wentworth Lab Ltd Wafer alignment device
CH713466B1 (de) * 2001-07-12 2018-08-15 Murata Machinery Ltd Vorrichtung und Verfahren zum harmonisierten Positionieren von Waferscheiben.
FR2835337B1 (fr) 2002-01-29 2004-08-20 Recif Sa Procede et dispositif d'identification de caracteres inscrits sur une plaque de semi-conducteur comportant au moins une marque d'orientation
US20060066333A1 (en) * 2004-09-30 2006-03-30 Jian-Huei Feng System and method for aligning wafers
JP4780142B2 (ja) * 2008-05-22 2011-09-28 信越半導体株式会社 ウェーハの製造方法
CN105051882B (zh) * 2013-03-15 2019-01-18 应用材料公司 基板位置对准器
US10133186B2 (en) 2016-10-20 2018-11-20 Mapper Lithography Ip B.V. Method and apparatus for aligning substrates on a substrate support unit
JP7353711B2 (ja) * 2019-08-14 2023-10-02 株式会社ディスコ ウェーハ搬送装置
JP7562232B2 (ja) * 2020-10-30 2024-10-07 株式会社ディスコ ノッチ検出方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2609942A (en) * 1949-06-06 1952-09-09 Northwest Nut Growers Feeding, positioning, and orienting mechanism
SU446921A1 (ru) * 1973-02-20 1974-10-15 Предприятие П/Я Р-6495 Устройство дл транспортировани и ориентировани круглых подложек
US3820647A (en) * 1973-09-14 1974-06-28 Texas Instruments Inc Slice pre aligner
JPS5666036A (en) * 1979-11-05 1981-06-04 Canon Inc Wafer positioner
US4311427A (en) * 1979-12-21 1982-01-19 Varian Associates, Inc. Wafer transfer system
US4662811A (en) * 1983-07-25 1987-05-05 Hayden Thomas J Method and apparatus for orienting semiconductor wafers
US4887904A (en) * 1985-08-23 1989-12-19 Canon Kabushiki Kaisha Device for positioning a semi-conductor wafer
JPS62219535A (ja) * 1986-03-19 1987-09-26 Fujitsu Ltd ウエ−ハの位置合わせ方法
US4892455A (en) * 1987-05-21 1990-01-09 Hine Derek L Wafer alignment and transport mechanism
US4813840A (en) * 1987-08-11 1989-03-21 Applied Materials, Inc. Method of aligning wafers and device therefor

Also Published As

Publication number Publication date
EP0376160A3 (en) 1991-04-17
DE68913481D1 (de) 1994-04-07
KR900010960A (ko) 1990-07-11
DE68913481T2 (de) 1994-06-01
JPH02178947A (ja) 1990-07-11
EP0376160A2 (en) 1990-07-04
US5028200A (en) 1991-07-02
KR930004631B1 (ko) 1993-06-02
EP0376160B1 (en) 1994-03-02

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees