JPH0569319B2 - - Google Patents

Info

Publication number
JPH0569319B2
JPH0569319B2 JP12214786A JP12214786A JPH0569319B2 JP H0569319 B2 JPH0569319 B2 JP H0569319B2 JP 12214786 A JP12214786 A JP 12214786A JP 12214786 A JP12214786 A JP 12214786A JP H0569319 B2 JPH0569319 B2 JP H0569319B2
Authority
JP
Japan
Prior art keywords
conductor
firing
ceramic
fired
wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP12214786A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62279695A (ja
Inventor
Susumu Nishigaki
Shinsuke Yano
Hiroshi Kawabe
Toshio Nonomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Steel and Sumikin Electronics Devices Inc
Original Assignee
Sumitomo Metal Ceramics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Ceramics Inc filed Critical Sumitomo Metal Ceramics Inc
Priority to JP61122147A priority Critical patent/JPS62279695A/ja
Priority to EP19870107771 priority patent/EP0247617A3/en
Publication of JPS62279695A publication Critical patent/JPS62279695A/ja
Publication of JPH0569319B2 publication Critical patent/JPH0569319B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/247—Finish coating of conductors by using conductive pastes, inks or powders
    • H05K3/248—Finish coating of conductors by using conductive pastes, inks or powders fired compositions for inorganic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/4805—Shape
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H01L2224/83805—Soldering or alloying involving forming a eutectic alloy at the bonding interface
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
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    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
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    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
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    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
JP61122147A 1986-05-29 1986-05-29 セラミツク多層配線基板 Granted JPS62279695A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61122147A JPS62279695A (ja) 1986-05-29 1986-05-29 セラミツク多層配線基板
EP19870107771 EP0247617A3 (en) 1986-05-29 1987-05-27 Multilayer ceramic substrate with circuit patterns

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61122147A JPS62279695A (ja) 1986-05-29 1986-05-29 セラミツク多層配線基板

Publications (2)

Publication Number Publication Date
JPS62279695A JPS62279695A (ja) 1987-12-04
JPH0569319B2 true JPH0569319B2 (US20030220297A1-20031127-C00009.png) 1993-09-30

Family

ID=14828767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61122147A Granted JPS62279695A (ja) 1986-05-29 1986-05-29 セラミツク多層配線基板

Country Status (2)

Country Link
EP (1) EP0247617A3 (US20030220297A1-20031127-C00009.png)
JP (1) JPS62279695A (US20030220297A1-20031127-C00009.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006351671A (ja) * 2005-06-14 2006-12-28 Alps Electric Co Ltd 配線基板

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4861944A (en) * 1987-12-09 1989-08-29 Cabot Electronics Ceramics, Inc. Low cost, hermetic pin grid array package
JP2665557B2 (ja) * 1988-09-14 1997-10-22 日本特殊陶業株式会社 セラミック本体と外部端子の接合構造体
GB2222911B (en) * 1988-09-16 1992-07-01 Stc Plc Hybrid circuits
GB2229572A (en) * 1989-03-14 1990-09-26 Oxley Dev Co Ltd Ceramic multilayer structure
JPH0758832B2 (ja) * 1991-05-09 1995-06-21 日本碍子株式会社 セラミック多層配線基板の製造方法
JP2817890B2 (ja) * 1992-10-09 1998-10-30 株式会社住友金属エレクトロデバイス セラミックス多層基板及びその製造方法
JP3237258B2 (ja) * 1993-01-22 2001-12-10 株式会社デンソー セラミック多層配線基板
JP3331083B2 (ja) * 1995-03-06 2002-10-07 株式会社住友金属エレクトロデバイス 低温焼成セラミック回路基板
JPH09246723A (ja) * 1996-03-11 1997-09-19 Sumitomo Kinzoku Electro Device:Kk 低温焼成セラミック回路基板
DE19646369B4 (de) * 1996-11-09 2008-07-31 Robert Bosch Gmbh Keramische Mehrlagenschaltung und Verfahren zu ihrer Herstellung
DE102008041873A1 (de) * 2008-09-08 2010-03-11 Biotronik Crm Patent Ag LTCC-Substratstruktur und Verfahren zur Herstellung derselben

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS576257A (en) * 1980-06-10 1982-01-13 Matsushita Electric Ind Co Ltd Water heater by solar heat
JPS57188472A (en) * 1981-05-12 1982-11-19 Fujitsu Ltd Ceramic printing board
JPS617697A (ja) * 1984-06-22 1986-01-14 富士通株式会社 多層配線基板及びその製造方法
JPS61108192A (ja) * 1984-10-31 1986-05-26 日本電気株式会社 低温焼結多層セラミツク基板

Family Cites Families (1)

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GB2162167B (en) * 1984-06-01 1988-01-20 Narumi China Corp Ceramic substrate material

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JPS576257A (en) * 1980-06-10 1982-01-13 Matsushita Electric Ind Co Ltd Water heater by solar heat
JPS57188472A (en) * 1981-05-12 1982-11-19 Fujitsu Ltd Ceramic printing board
JPS617697A (ja) * 1984-06-22 1986-01-14 富士通株式会社 多層配線基板及びその製造方法
JPS61108192A (ja) * 1984-10-31 1986-05-26 日本電気株式会社 低温焼結多層セラミツク基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006351671A (ja) * 2005-06-14 2006-12-28 Alps Electric Co Ltd 配線基板
JP4613103B2 (ja) * 2005-06-14 2011-01-12 アルプス電気株式会社 配線基板

Also Published As

Publication number Publication date
JPS62279695A (ja) 1987-12-04
EP0247617A3 (en) 1988-11-23
EP0247617A2 (en) 1987-12-02

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