JPH0566863B2 - - Google Patents
Info
- Publication number
- JPH0566863B2 JPH0566863B2 JP1022348A JP2234889A JPH0566863B2 JP H0566863 B2 JPH0566863 B2 JP H0566863B2 JP 1022348 A JP1022348 A JP 1022348A JP 2234889 A JP2234889 A JP 2234889A JP H0566863 B2 JPH0566863 B2 JP H0566863B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- adhesive
- heat
- release paper
- films
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010408 film Substances 0.000 claims description 26
- 239000000853 adhesive Substances 0.000 claims description 19
- 230000001070 adhesive effect Effects 0.000 claims description 19
- 239000012787 coverlay film Substances 0.000 claims description 12
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 7
- 239000004698 Polyethylene Substances 0.000 description 6
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000006082 mold release agent Substances 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Adhesive Tapes (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1022348A JPH02202441A (ja) | 1989-01-31 | 1989-01-31 | カバーレイフィルム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1022348A JPH02202441A (ja) | 1989-01-31 | 1989-01-31 | カバーレイフィルム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02202441A JPH02202441A (ja) | 1990-08-10 |
| JPH0566863B2 true JPH0566863B2 (show.php) | 1993-09-22 |
Family
ID=12080166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1022348A Granted JPH02202441A (ja) | 1989-01-31 | 1989-01-31 | カバーレイフィルム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02202441A (show.php) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH084285Y2 (ja) * | 1990-11-29 | 1996-02-07 | 信越化学工業株式会社 | プリント回路基板多層化用両面カバーレイフィルム |
| CN108966519B (zh) * | 2017-05-23 | 2020-08-21 | 昆山雅森电子材料科技有限公司 | 高雾度的有色超薄高频覆盖膜及制备方法 |
-
1989
- 1989-01-31 JP JP1022348A patent/JPH02202441A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02202441A (ja) | 1990-08-10 |
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