JPH0566015B2 - - Google Patents

Info

Publication number
JPH0566015B2
JPH0566015B2 JP58126051A JP12605183A JPH0566015B2 JP H0566015 B2 JPH0566015 B2 JP H0566015B2 JP 58126051 A JP58126051 A JP 58126051A JP 12605183 A JP12605183 A JP 12605183A JP H0566015 B2 JPH0566015 B2 JP H0566015B2
Authority
JP
Japan
Prior art keywords
pellet
bonding
cavity
package
center position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58126051A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6018926A (ja
Inventor
Makoto Ariga
Satoru Haraguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi High Tech Corp
Original Assignee
Hitachi Ltd
Hitachi Electronics Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Electronics Engineering Co Ltd filed Critical Hitachi Ltd
Priority to JP12605183A priority Critical patent/JPS6018926A/ja
Publication of JPS6018926A publication Critical patent/JPS6018926A/ja
Publication of JPH0566015B2 publication Critical patent/JPH0566015B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP12605183A 1983-07-13 1983-07-13 ペレツトボンデイング装置 Granted JPS6018926A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12605183A JPS6018926A (ja) 1983-07-13 1983-07-13 ペレツトボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12605183A JPS6018926A (ja) 1983-07-13 1983-07-13 ペレツトボンデイング装置

Publications (2)

Publication Number Publication Date
JPS6018926A JPS6018926A (ja) 1985-01-31
JPH0566015B2 true JPH0566015B2 (enrdf_load_stackoverflow) 1993-09-20

Family

ID=14925427

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12605183A Granted JPS6018926A (ja) 1983-07-13 1983-07-13 ペレツトボンデイング装置

Country Status (1)

Country Link
JP (1) JPS6018926A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6386528A (ja) * 1986-09-30 1988-04-16 Toshiba Corp ダイボンデイング装置
US4769534A (en) * 1986-11-17 1988-09-06 Tektronix, Inc. Optical detector with storage effects reduction
JPH0775238B2 (ja) * 1988-07-29 1995-08-09 シャープ株式会社 ダイボンダ
JP5022598B2 (ja) * 2005-12-27 2012-09-12 株式会社東芝 ボンディング装置及び半導体装置の製造方法
JP5468848B2 (ja) * 2009-08-31 2014-04-09 トッパン・フォームズ株式会社 塗布量検出装置及び塗布量検出方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56164545A (en) * 1980-05-21 1981-12-17 Hitachi Ltd Pellet bonding inspection and device therefor
JPS57169250A (en) * 1981-04-13 1982-10-18 Hitachi Ltd Bonding method for pellet

Also Published As

Publication number Publication date
JPS6018926A (ja) 1985-01-31

Similar Documents

Publication Publication Date Title
US5058178A (en) Method and apparatus for inspection of specular, three-dimensional features
KR102219591B1 (ko) 반도체 제조 장치 및 반도체 장치의 제조 방법
KR100283834B1 (ko) 반도체칩의 본딩방법 및 그 장치
CN108573901B (zh) 裸芯片接合装置及半导体器件的制造方法
KR102641333B1 (ko) 다이 본딩 장치 및 반도체 장치의 제조 방법
JP2021193744A (ja) 半導体製造装置および半導体装置の製造方法
JP4409017B2 (ja) 部品装着確認方法および同装置
CN111725086B (zh) 半导体制造装置以及半导体器件的制造方法
JP2010078574A (ja) 板状金属表面自動検査装置
JPH0566015B2 (enrdf_load_stackoverflow)
KR102516586B1 (ko) 다이 본딩 장치 및 반도체 장치의 제조 방법
US5894659A (en) Method for inspecting lead frames in a tape lead bonding system
JP2954332B2 (ja) 画像入力方法およびその装置
JP3355978B2 (ja) ボンド塗布検査装置及びボンドの塗布検査方法
JP2539015B2 (ja) ペレットボンディング方法およびその装置
JP3225067B2 (ja) リード測定方法
JP2922214B2 (ja) 外観検査方法
JP3430435B2 (ja) リード接合検査方法及びリード接合検査装置
JP2009008596A (ja) 板状金属表面自動検査装置
JPH0582741B2 (enrdf_load_stackoverflow)
TWI823297B (zh) 黏晶裝置及半導體裝置的製造方法
JPS6336543A (ja) 半導体装置の自動検査方法及び検査装置
JP2682581B2 (ja) ボンディングワイヤの形状検査方法
KR100312958B1 (ko) 비지에이 반도체 패키지 제조시 솔더볼 범핑 미스 검사장치
JPH10112469A (ja) ワイヤボンディング検査装置