JPH0558653B2 - - Google Patents

Info

Publication number
JPH0558653B2
JPH0558653B2 JP61174510A JP17451086A JPH0558653B2 JP H0558653 B2 JPH0558653 B2 JP H0558653B2 JP 61174510 A JP61174510 A JP 61174510A JP 17451086 A JP17451086 A JP 17451086A JP H0558653 B2 JPH0558653 B2 JP H0558653B2
Authority
JP
Japan
Prior art keywords
conductor layer
forming
insulating film
conductor
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61174510A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6329940A (ja
Inventor
Yoshuki Hirano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP61174510A priority Critical patent/JPS6329940A/ja
Publication of JPS6329940A publication Critical patent/JPS6329940A/ja
Publication of JPH0558653B2 publication Critical patent/JPH0558653B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/012—

Landscapes

  • Wire Bonding (AREA)
JP61174510A 1986-07-23 1986-07-23 半導体装置の製造方法 Granted JPS6329940A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61174510A JPS6329940A (ja) 1986-07-23 1986-07-23 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61174510A JPS6329940A (ja) 1986-07-23 1986-07-23 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS6329940A JPS6329940A (ja) 1988-02-08
JPH0558653B2 true JPH0558653B2 (cg-RX-API-DMAC10.html) 1993-08-27

Family

ID=15979767

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61174510A Granted JPS6329940A (ja) 1986-07-23 1986-07-23 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS6329940A (cg-RX-API-DMAC10.html)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63161649A (ja) * 1986-12-25 1988-07-05 Casio Comput Co Ltd 半導体装置の製造方法
JP3027586B2 (ja) * 1989-07-13 2000-04-04 シャープ株式会社 バンプの製造方法
JP2721580B2 (ja) * 1990-05-17 1998-03-04 シャープ株式会社 半導体装置の製造方法
JP3271272B2 (ja) * 1991-11-12 2002-04-02 日本電気株式会社 半導体装置の製造方法
JP2582328Y2 (ja) * 1992-11-25 1998-09-30 日本精工株式会社 ボールねじ一体型直動案内ユニット
US5492235A (en) * 1995-12-18 1996-02-20 Intel Corporation Process for single mask C4 solder bump fabrication

Also Published As

Publication number Publication date
JPS6329940A (ja) 1988-02-08

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