JPH0554262B2 - - Google Patents

Info

Publication number
JPH0554262B2
JPH0554262B2 JP23333084A JP23333084A JPH0554262B2 JP H0554262 B2 JPH0554262 B2 JP H0554262B2 JP 23333084 A JP23333084 A JP 23333084A JP 23333084 A JP23333084 A JP 23333084A JP H0554262 B2 JPH0554262 B2 JP H0554262B2
Authority
JP
Japan
Prior art keywords
semiconductor wafer
wafer
adhesive sheet
adhesive layer
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP23333084A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61112345A (ja
Inventor
Takashi Kimura
Toshihiro Kato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP59233330A priority Critical patent/JPS61112345A/ja
Priority to EP85114207A priority patent/EP0182218B1/en
Priority to DE8585114207T priority patent/DE3583111D1/de
Publication of JPS61112345A publication Critical patent/JPS61112345A/ja
Priority to US07/015,585 priority patent/US4722130A/en
Publication of JPH0554262B2 publication Critical patent/JPH0554262B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/003—Multipurpose machines; Equipment therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Dicing (AREA)
JP59233330A 1984-11-07 1984-11-07 半導体装置の製造方法 Granted JPS61112345A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP59233330A JPS61112345A (ja) 1984-11-07 1984-11-07 半導体装置の製造方法
EP85114207A EP0182218B1 (en) 1984-11-07 1985-11-07 Method for dicing semiconductor wafer
DE8585114207T DE3583111D1 (de) 1984-11-07 1985-11-07 Verfahren zum schneiden von halbleiterscheiben.
US07/015,585 US4722130A (en) 1984-11-07 1987-02-17 Method of manufacturing a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59233330A JPS61112345A (ja) 1984-11-07 1984-11-07 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS61112345A JPS61112345A (ja) 1986-05-30
JPH0554262B2 true JPH0554262B2 (US20080005853A1-20080110-C00027.png) 1993-08-12

Family

ID=16953451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59233330A Granted JPS61112345A (ja) 1984-11-07 1984-11-07 半導体装置の製造方法

Country Status (4)

Country Link
US (1) US4722130A (US20080005853A1-20080110-C00027.png)
EP (1) EP0182218B1 (US20080005853A1-20080110-C00027.png)
JP (1) JPS61112345A (US20080005853A1-20080110-C00027.png)
DE (1) DE3583111D1 (US20080005853A1-20080110-C00027.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258136A (ja) * 2009-04-23 2010-11-11 Disco Abrasive Syst Ltd 粘着テープ及びウェーハの分割方法

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