JPH055376B2 - - Google Patents
Info
- Publication number
- JPH055376B2 JPH055376B2 JP61241669A JP24166986A JPH055376B2 JP H055376 B2 JPH055376 B2 JP H055376B2 JP 61241669 A JP61241669 A JP 61241669A JP 24166986 A JP24166986 A JP 24166986A JP H055376 B2 JPH055376 B2 JP H055376B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- semiconductor element
- center device
- device hole
- tape carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/701—Tape-automated bond [TAB] connectors
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61241669A JPS6395639A (ja) | 1986-10-09 | 1986-10-09 | テ−プキヤリア |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61241669A JPS6395639A (ja) | 1986-10-09 | 1986-10-09 | テ−プキヤリア |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6395639A JPS6395639A (ja) | 1988-04-26 |
| JPH055376B2 true JPH055376B2 (https=) | 1993-01-22 |
Family
ID=17077754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61241669A Granted JPS6395639A (ja) | 1986-10-09 | 1986-10-09 | テ−プキヤリア |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6395639A (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6481330A (en) * | 1987-09-24 | 1989-03-27 | Nec Corp | Film carrier semiconductor device |
| JP2522524B2 (ja) * | 1988-08-06 | 1996-08-07 | 株式会社東芝 | 半導体装置の製造方法 |
| JP3269171B2 (ja) * | 1993-04-08 | 2002-03-25 | セイコーエプソン株式会社 | 半導体装置およびそれを有した時計 |
| JP3564971B2 (ja) * | 1997-02-17 | 2004-09-15 | セイコーエプソン株式会社 | テープキャリアパッケージ |
| JP3487173B2 (ja) | 1997-05-26 | 2004-01-13 | セイコーエプソン株式会社 | Tab用テープキャリア、集積回路装置及び電子機器 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS502669U (https=) * | 1973-05-08 | 1975-01-11 | ||
| JPS572669U (https=) * | 1980-06-05 | 1982-01-08 | ||
| US4380566A (en) * | 1981-07-13 | 1983-04-19 | Fairchild Camera & Instrument Corp. | Radiation protection for integrated circuits utilizing tape automated bonding |
| JPS59132641A (ja) * | 1983-01-20 | 1984-07-30 | Seiko Epson Corp | Ic実装構造 |
| JPS6016102A (ja) * | 1983-07-08 | 1985-01-26 | Nissan Motor Co Ltd | 電気自動車の走行制御装置 |
-
1986
- 1986-10-09 JP JP61241669A patent/JPS6395639A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6395639A (ja) | 1988-04-26 |
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