JPH0537468Y2 - - Google Patents
Info
- Publication number
- JPH0537468Y2 JPH0537468Y2 JP238189U JP238189U JPH0537468Y2 JP H0537468 Y2 JPH0537468 Y2 JP H0537468Y2 JP 238189 U JP238189 U JP 238189U JP 238189 U JP238189 U JP 238189U JP H0537468 Y2 JPH0537468 Y2 JP H0537468Y2
- Authority
- JP
- Japan
- Prior art keywords
- electrode foil
- electrode foils
- anode
- metal layer
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011888 foil Substances 0.000 claims description 25
- 239000003990 capacitor Substances 0.000 claims description 17
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 12
- 229910052745 lead Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- 239000003792 electrolyte Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 1
- 239000010949 copper Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000006071 cream Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000007784 solid electrolyte Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP238189U JPH0537468Y2 (zh) | 1989-01-12 | 1989-01-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP238189U JPH0537468Y2 (zh) | 1989-01-12 | 1989-01-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0292921U JPH0292921U (zh) | 1990-07-24 |
| JPH0537468Y2 true JPH0537468Y2 (zh) | 1993-09-22 |
Family
ID=31203098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP238189U Expired - Lifetime JPH0537468Y2 (zh) | 1989-01-12 | 1989-01-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0537468Y2 (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07105317B2 (ja) * | 1992-11-30 | 1995-11-13 | 日本電気株式会社 | 積層型固体電解コンデンサとその製造方法 |
| JP2007200950A (ja) * | 2006-01-23 | 2007-08-09 | Fujitsu Media Device Kk | 積層型固体電解コンデンサ |
| JP2010177514A (ja) * | 2009-01-30 | 2010-08-12 | Tdk Corp | 積層型電解コンデンサ及びその製造方法 |
-
1989
- 1989-01-12 JP JP238189U patent/JPH0537468Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0292921U (zh) | 1990-07-24 |
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