JPH0533533B2 - - Google Patents

Info

Publication number
JPH0533533B2
JPH0533533B2 JP61043226A JP4322686A JPH0533533B2 JP H0533533 B2 JPH0533533 B2 JP H0533533B2 JP 61043226 A JP61043226 A JP 61043226A JP 4322686 A JP4322686 A JP 4322686A JP H0533533 B2 JPH0533533 B2 JP H0533533B2
Authority
JP
Japan
Prior art keywords
bump
bonding
plating layer
aluminum pad
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61043226A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62200738A (ja
Inventor
Kunio Sakuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP61043226A priority Critical patent/JPS62200738A/ja
Priority to US07/017,419 priority patent/US4786545A/en
Priority to GB8704425A priority patent/GB2187331B/en
Publication of JPS62200738A publication Critical patent/JPS62200738A/ja
Priority to GB8901825A priority patent/GB2211351B/en
Priority to SG1392A priority patent/SG1392G/en
Priority to SG1492A priority patent/SG1492G/en
Priority to HK359/93A priority patent/HK35993A/xx
Priority to HK360/93A priority patent/HK36093A/xx
Publication of JPH0533533B2 publication Critical patent/JPH0533533B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Wire Bonding (AREA)
JP61043226A 1986-02-28 1986-02-28 回路基板構造 Granted JPS62200738A (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP61043226A JPS62200738A (ja) 1986-02-28 1986-02-28 回路基板構造
US07/017,419 US4786545A (en) 1986-02-28 1987-02-24 Circuit substrate and method for forming bumps on the circuit substrate
GB8704425A GB2187331B (en) 1986-02-28 1987-02-25 Method of forming an integrated circuit assembly or part thereof
GB8901825A GB2211351B (en) 1986-02-28 1989-01-27 Method of forming an integrated circuit assembly or part thereof
SG1392A SG1392G (en) 1986-02-28 1992-01-08 Method of forming an integrated circuit assembly or part thereof
SG1492A SG1492G (en) 1986-02-28 1992-01-08 Method of forming an integrated circuit assembly or part thereof
HK359/93A HK35993A (en) 1986-02-28 1993-04-15 Method of forming an integrated circuit assembly or part thereof
HK360/93A HK36093A (en) 1986-02-28 1993-04-15 Method of forming an integrated circuit assembly or part thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61043226A JPS62200738A (ja) 1986-02-28 1986-02-28 回路基板構造

Publications (2)

Publication Number Publication Date
JPS62200738A JPS62200738A (ja) 1987-09-04
JPH0533533B2 true JPH0533533B2 (enrdf_load_stackoverflow) 1993-05-19

Family

ID=12657998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61043226A Granted JPS62200738A (ja) 1986-02-28 1986-02-28 回路基板構造

Country Status (1)

Country Link
JP (1) JPS62200738A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2606606B2 (ja) * 1994-10-14 1997-05-07 日本電気株式会社 半導体装置の製造方法
KR19980044255A (ko) * 1996-12-06 1998-09-05 황인길 플립 칩(Flip Chip)용 기판(Substrate)의 리드 핑거(Lead Finger)구조
JP4222703B2 (ja) * 2000-01-28 2009-02-12 Ｎｅｃエレクトロニクス株式会社 半導体装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52124865A (en) * 1976-04-13 1977-10-20 Sharp Corp Semiconductor device
JPS55138864A (en) * 1979-04-16 1980-10-30 Sharp Corp Method of fabricating semiconductor assembling substrate
JPS55140238A (en) * 1979-04-20 1980-11-01 Hitachi Ltd Tape carrier type semiconductor device

Also Published As

Publication number Publication date
JPS62200738A (ja) 1987-09-04

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term