JPH0528738B2 - - Google Patents
Info
- Publication number
- JPH0528738B2 JPH0528738B2 JP62178594A JP17859487A JPH0528738B2 JP H0528738 B2 JPH0528738 B2 JP H0528738B2 JP 62178594 A JP62178594 A JP 62178594A JP 17859487 A JP17859487 A JP 17859487A JP H0528738 B2 JPH0528738 B2 JP H0528738B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- group
- parts
- formula
- silica powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 23
- 229920001296 polysiloxane Polymers 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 15
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 12
- -1 polysiloxane Polymers 0.000 claims description 11
- 239000000843 powder Substances 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 8
- 229910052697 platinum Inorganic materials 0.000 claims description 6
- 239000004944 Liquid Silicone Rubber Substances 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 229920002379 silicone rubber Polymers 0.000 claims description 5
- 239000005350 fused silica glass Substances 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 229910020175 SiOH Chemical group 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 125000000524 functional group Chemical group 0.000 claims description 3
- 150000003961 organosilicon compounds Chemical class 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 230000003197 catalytic effect Effects 0.000 claims description 2
- 229910002026 crystalline silica Inorganic materials 0.000 claims description 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 2
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 2
- 235000012239 silicon dioxide Nutrition 0.000 claims description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 239000006229 carbon black Substances 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000007259 addition reaction Methods 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- 238000004191 hydrophobic interaction chromatography Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- MFGOFGRYDNHJTA-UHFFFAOYSA-N 2-amino-1-(2-fluorophenyl)ethanol Chemical compound NCC(O)C1=CC=CC=C1F MFGOFGRYDNHJTA-UHFFFAOYSA-N 0.000 description 1
- 125000001731 2-cyanoethyl group Chemical group [H]C([H])(*)C([H])([H])C#N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- HUCVOHYBFXVBRW-UHFFFAOYSA-M caesium hydroxide Inorganic materials [OH-].[Cs+] HUCVOHYBFXVBRW-UHFFFAOYSA-M 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 239000011362 coarse particle Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011067 equilibration Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 235000011118 potassium hydroxide Nutrition 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000000725 trifluoropropyl group Chemical group [H]C([H])(*)C([H])([H])C(F)(F)F 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17859487A JPS6422967A (en) | 1987-07-17 | 1987-07-17 | Curable liquid silicone rubber composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17859487A JPS6422967A (en) | 1987-07-17 | 1987-07-17 | Curable liquid silicone rubber composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6422967A JPS6422967A (en) | 1989-01-25 |
| JPH0528738B2 true JPH0528738B2 (de) | 1993-04-27 |
Family
ID=16051188
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17859487A Granted JPS6422967A (en) | 1987-07-17 | 1987-07-17 | Curable liquid silicone rubber composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6422967A (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10851242B2 (en) | 2015-12-10 | 2020-12-01 | Shin-Etsu Chemical Co., Ltd. | Addition-curable silicone rubber composition and silicone rubber |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4888226A (en) * | 1988-08-08 | 1989-12-19 | American Telephone And Telegraph Company | Silicone gel electronic device encapsulant |
| US5409995A (en) * | 1989-05-29 | 1995-04-25 | Kanegafuchi Chemical Industry Co., Ltd. | Curing agent, preparation thereof and curable composition comprising the same |
| JP2732315B2 (ja) * | 1989-05-29 | 1998-03-30 | 鐘淵化学工業株式会社 | 硬化剤、その製造方法及び該硬化剤を用いた硬化性組成物 |
| JPH0660281B2 (ja) * | 1989-07-07 | 1994-08-10 | 信越化学工業株式会社 | 硬化性液状シリコーンゴム組成物 |
| JP2714729B2 (ja) * | 1991-06-18 | 1998-02-16 | 信越化学工業株式会社 | 電子部品含浸用シリコーン組成物及びその硬化物 |
| DE60140576D1 (de) * | 2000-03-31 | 2009-12-31 | Hitachi Chemical Co Ltd | Hitzehärtbare Silikonzusammensetzung, Harzfilm, Metallfolie, Isolationsfilm, Metall-Leiterplatte-Laminat, Multischicht-Leiterplatte, die Zusammensetzung enthaltend und Verwendung der Zusammensetzung |
| JP2005146288A (ja) * | 2004-12-17 | 2005-06-09 | Shin Etsu Chem Co Ltd | オルガノポリシロキサン組成物 |
| JP4803365B2 (ja) * | 2006-02-22 | 2011-10-26 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物、熱伝導性シリコーン成形体及びその製造方法 |
| CN114616299B (zh) * | 2019-10-03 | 2024-02-27 | 陶氏东丽株式会社 | 紫外线固化性聚有机硅氧烷组合物及其用途 |
| CN110746779A (zh) * | 2019-10-31 | 2020-02-04 | 西安建筑科技大学 | 一种聚合物复合模板及其制备方法 |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5039345A (de) * | 1973-08-13 | 1975-04-11 | ||
| JPS5313508A (en) * | 1976-07-21 | 1978-02-07 | Inoue Shokai | Method of applying antiicorrosive coating for steel pipe pile |
| JPS55118656A (en) * | 1979-03-07 | 1980-09-11 | Hitachi Ltd | Manufacture of semiconductor device, and silicone resin used therefor |
| JPS5610947A (en) * | 1979-07-10 | 1981-02-03 | Toshiba Corp | Semiconductor sealing resin composition |
| JPS5850007A (ja) * | 1982-08-28 | 1983-03-24 | Kubota Ltd | 自動回行制御機構付きコンバイン |
| JPS58138740A (ja) * | 1982-02-15 | 1983-08-17 | Denki Kagaku Kogyo Kk | 樹脂組成物 |
| JPS59176347A (ja) * | 1983-03-25 | 1984-10-05 | Toray Silicone Co Ltd | オルガノポリシロキサン組成物 |
| JPS60210643A (ja) * | 1983-11-30 | 1985-10-23 | Denki Kagaku Kogyo Kk | 充填剤及びその組成物 |
| JPS6157347A (ja) * | 1984-08-29 | 1986-03-24 | Toshiba Corp | プリンタ制御装置 |
| JPS6296568A (ja) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | 半導体封止用樹脂組成物 |
| JPS6296567A (ja) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | 半導体封止用エポキシ樹脂組成物 |
-
1987
- 1987-07-17 JP JP17859487A patent/JPS6422967A/ja active Granted
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5039345A (de) * | 1973-08-13 | 1975-04-11 | ||
| JPS5313508A (en) * | 1976-07-21 | 1978-02-07 | Inoue Shokai | Method of applying antiicorrosive coating for steel pipe pile |
| JPS55118656A (en) * | 1979-03-07 | 1980-09-11 | Hitachi Ltd | Manufacture of semiconductor device, and silicone resin used therefor |
| JPS5610947A (en) * | 1979-07-10 | 1981-02-03 | Toshiba Corp | Semiconductor sealing resin composition |
| JPS58138740A (ja) * | 1982-02-15 | 1983-08-17 | Denki Kagaku Kogyo Kk | 樹脂組成物 |
| JPS5850007A (ja) * | 1982-08-28 | 1983-03-24 | Kubota Ltd | 自動回行制御機構付きコンバイン |
| JPS59176347A (ja) * | 1983-03-25 | 1984-10-05 | Toray Silicone Co Ltd | オルガノポリシロキサン組成物 |
| JPS60210643A (ja) * | 1983-11-30 | 1985-10-23 | Denki Kagaku Kogyo Kk | 充填剤及びその組成物 |
| JPS6157347A (ja) * | 1984-08-29 | 1986-03-24 | Toshiba Corp | プリンタ制御装置 |
| JPS6296568A (ja) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | 半導体封止用樹脂組成物 |
| JPS6296567A (ja) * | 1985-10-24 | 1987-05-06 | Denki Kagaku Kogyo Kk | 半導体封止用エポキシ樹脂組成物 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10851242B2 (en) | 2015-12-10 | 2020-12-01 | Shin-Etsu Chemical Co., Ltd. | Addition-curable silicone rubber composition and silicone rubber |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6422967A (en) | 1989-01-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |