JPH0519300B2 - - Google Patents
Info
- Publication number
- JPH0519300B2 JPH0519300B2 JP31581587A JP31581587A JPH0519300B2 JP H0519300 B2 JPH0519300 B2 JP H0519300B2 JP 31581587 A JP31581587 A JP 31581587A JP 31581587 A JP31581587 A JP 31581587A JP H0519300 B2 JPH0519300 B2 JP H0519300B2
- Authority
- JP
- Japan
- Prior art keywords
- resist
- layer
- resist layer
- pattern
- glass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 claims description 43
- 239000011521 glass Substances 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 14
- 239000004065 semiconductor Substances 0.000 claims description 13
- 238000000151 deposition Methods 0.000 claims description 4
- 238000000206 photolithography Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims description 4
- LRCFXGAMWKDGLA-UHFFFAOYSA-N dioxosilane;hydrate Chemical compound O.O=[Si]=O LRCFXGAMWKDGLA-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 claims description 2
- 239000004327 boric acid Substances 0.000 claims description 2
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 3
- 230000001376 precipitating effect Effects 0.000 claims 2
- 229920006395 saturated elastomer Polymers 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 238000007598 dipping method Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 description 6
- 206010034972 Photosensitivity reaction Diseases 0.000 description 5
- 230000036211 photosensitivity Effects 0.000 description 5
- 230000006866 deterioration Effects 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31581587A JPH01157535A (ja) | 1987-12-14 | 1987-12-14 | パターン形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31581587A JPH01157535A (ja) | 1987-12-14 | 1987-12-14 | パターン形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01157535A JPH01157535A (ja) | 1989-06-20 |
| JPH0519300B2 true JPH0519300B2 (enrdf_load_stackoverflow) | 1993-03-16 |
Family
ID=18069888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31581587A Granted JPH01157535A (ja) | 1987-12-14 | 1987-12-14 | パターン形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01157535A (enrdf_load_stackoverflow) |
-
1987
- 1987-12-14 JP JP31581587A patent/JPH01157535A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01157535A (ja) | 1989-06-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |