JPH0512854B2 - - Google Patents

Info

Publication number
JPH0512854B2
JPH0512854B2 JP59059468A JP5946884A JPH0512854B2 JP H0512854 B2 JPH0512854 B2 JP H0512854B2 JP 59059468 A JP59059468 A JP 59059468A JP 5946884 A JP5946884 A JP 5946884A JP H0512854 B2 JPH0512854 B2 JP H0512854B2
Authority
JP
Japan
Prior art keywords
semiconductor element
pressure
temperature
electrode
bonding tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59059468A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60206035A (ja
Inventor
Minoru Hirai
Kenzo Hatada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP59059468A priority Critical patent/JPS60206035A/ja
Publication of JPS60206035A publication Critical patent/JPS60206035A/ja
Publication of JPH0512854B2 publication Critical patent/JPH0512854B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP59059468A 1984-03-29 1984-03-29 半導体装置の製造方法 Granted JPS60206035A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59059468A JPS60206035A (ja) 1984-03-29 1984-03-29 半導体装置の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59059468A JPS60206035A (ja) 1984-03-29 1984-03-29 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS60206035A JPS60206035A (ja) 1985-10-17
JPH0512854B2 true JPH0512854B2 (enrdf_load_html_response) 1993-02-19

Family

ID=13114167

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59059468A Granted JPS60206035A (ja) 1984-03-29 1984-03-29 半導体装置の製造方法

Country Status (1)

Country Link
JP (1) JPS60206035A (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081520A (en) * 1989-05-16 1992-01-14 Minolta Camera Kabushiki Kaisha Chip mounting substrate having an integral molded projection and conductive pattern

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5751937A (en) * 1980-09-11 1982-03-27 Honda Motor Co Ltd Starting failure preventer due to residual fuel in float chamber of carburetor
JPS5790955A (en) * 1980-11-27 1982-06-05 Nec Corp Manufacture of semiconductor device
JPS5892231A (ja) * 1981-11-28 1983-06-01 Mitsubishi Electric Corp 半導体素子のボンデイング方法

Also Published As

Publication number Publication date
JPS60206035A (ja) 1985-10-17

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term